| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 07/27/2006 | US20060163741 TFT array panel and fabricating method thereof |
| 07/27/2006 | US20060163740 Semiconductor mounting board |
| 07/27/2006 | US20060163739 Semiconductor device and method for production thereof |
| 07/27/2006 | US20060163738 Dual damascene structure and methods of forming the same |
| 07/27/2006 | US20060163737 Interconnections for integrated circuits |
| 07/27/2006 | US20060163736 Interconnections having double capping layer and method for forming the same |
| 07/27/2006 | US20060163735 Damascene process at semiconductor substrate level |
| 07/27/2006 | US20060163734 Fuse structure and method for making the same |
| 07/27/2006 | US20060163733 Semiconductor structure having multilayer of polysilicon and display panel applied with the same |
| 07/27/2006 | US20060163732 Copper interconnect systems which use conductive, metal-based cap layers |
| 07/27/2006 | US20060163731 Dual damascene interconnections employing a copper alloy at the copper/barrier interface |
| 07/27/2006 | US20060163730 Electronic device and its manufacturing method |
| 07/27/2006 | US20060163729 Structure and manufacturing method of a chip scale package |
| 07/27/2006 | US20060163728 Semiconductor device and method for manufacturing semiconductor device |
| 07/27/2006 | US20060163727 Semiconductor device |
| 07/27/2006 | US20060163726 Spaced, bumped component structure |
| 07/27/2006 | US20060163725 Wiring board and production method thereof |
| 07/27/2006 | US20060163724 Display apparatus |
| 07/27/2006 | US20060163723 Bump-less chip package |
| 07/27/2006 | US20060163722 Semiconductor chip electrical connection structure |
| 07/27/2006 | US20060163721 Electronic assembly with reduced leakage current |
| 07/27/2006 | US20060163720 Semiconductor device |
| 07/27/2006 | US20060163719 Semiconductor device and method of manufacturing a semiconductor device |
| 07/27/2006 | US20060163718 Flexible wiring base material and process for producing the same |
| 07/27/2006 | US20060163717 Method for connection of an integrated circuit to a substrate, and a corresponding circuit arrangement |
| 07/27/2006 | US20060163716 Semiconductor package with crossing conductor assembly and method of manufacture |
| 07/27/2006 | US20060163715 Flip chip interconnection pad layout |
| 07/27/2006 | US20060163714 Package structure and fabrication method thereof |
| 07/27/2006 | US20060163713 Semiconductor device |
| 07/27/2006 | US20060163712 System and method for direct-bonding of substrates |
| 07/27/2006 | US20060163711 Method to form an electronic device |
| 07/27/2006 | US20060163710 Semiconductor device and manufacturing method thereof |
| 07/27/2006 | US20060163709 Chip-scale monolithic load switch for portable applications |
| 07/27/2006 | US20060163708 Semiconductor device |
| 07/27/2006 | US20060163707 Method and apparatus for reducing stresses applied to bonded interconnects between substrates |
| 07/27/2006 | US20060163706 Bilayer aluminum last metal for interconnects and wirebond pads |
| 07/27/2006 | US20060163705 Surface mount semiconductor device |
| 07/27/2006 | US20060163704 Chip package and producing method thereof |
| 07/27/2006 | US20060163703 Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same |
| 07/27/2006 | US20060163702 Chip on board leadframe for semiconductor components having area array |
| 07/27/2006 | US20060163701 Scribe-line structures and methods of forming the same |
| 07/27/2006 | US20060163700 Semiconductor device and method of manufacturing the same |
| 07/27/2006 | US20060163699 Semiconductor wafer, semiconductor device manufacturing method, and semiconductor device |
| 07/27/2006 | US20060163698 Method and apparatus for wafer to wafer bonding |
| 07/27/2006 | US20060163695 Inductors for integrated circuits |
| 07/27/2006 | US20060163692 Inductive and capacitvie elements for semiconductor techinologies with minimum pattern density requirements |
| 07/27/2006 | US20060163688 Multiple layer structure for substrate noise isolation |
| 07/27/2006 | US20060163660 Electrostatic discharge (ESD) protection circuit |
| 07/27/2006 | US20060163659 Compound semiconductor switch circuit device |
| 07/27/2006 | US20060163658 Monolithic MOSFET and schottky diode for mobile phone boost converter |
| 07/27/2006 | US20060163657 Method to reduce leakage in a protection diode structure |
| 07/27/2006 | US20060163648 Semiconductor component |
| 07/27/2006 | US20060163628 Solid state imaging apparatus and method for fabricating the same |
| 07/27/2006 | US20060163622 Apparatus and method for manufacturing thermal interface device having aligned carbon nanotubes |
| 07/27/2006 | US20060163616 Semiconductor device having ESD protection circuit |
| 07/27/2006 | US20060163572 Semiconductor memory testing device and test method using the same |
| 07/27/2006 | US20060163571 Test element group structures having 3 dimensional SRAM cell transistors |
| 07/27/2006 | US20060163570 Aerodynamic jetting of aerosolized fluids for fabrication of passive structures |
| 07/27/2006 | US20060163569 Test structure of semiconductor device |
| 07/27/2006 | US20060163568 Integration system and the method for operating the same |
| 07/27/2006 | US20060162956 Connection substrate, multi-layer wiring board using the connection substrate, substrate for semiconductor package, and methods for manufacturing them |
| 07/27/2006 | US20060162157 Economical high-frequency package |
| 07/27/2006 | DE202005020760U1 Device comprising cooler, supporting electronic component, and spring clip for pressing component against cooler for connection of component waste heat between component and cooler, |
| 07/27/2006 | DE19928788B4 Elektronisches Keramikbauelement Ceramic electronic component |
| 07/27/2006 | DE10345768B4 Anschlussmittel und Verfahren zum Kontaktieren des Anschlussmittels Connection means and methods for contacting the connection means |
| 07/27/2006 | DE10335153B4 Schaltungsanordnung auf einem Substrat, die einen Bestandteil eines Sensors aufweist, und Verfahren zum Herstellen der Schaltungsanordnung auf dem Substrat A circuit arrangement on a substrate having a part of a sensor and method for manufacturing the circuit arrangement on the substrate |
| 07/27/2006 | DE102006002452A1 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation |
| 07/27/2006 | DE102006001999A1 Signalneuverteilung unter Verwendung einer Brückenschicht für ein Mehrchipmodul Signalneuverteilung using a bridge layer for a multi-chip module |
| 07/27/2006 | DE102005041266A1 Multi-chip arrangement, has heat conducting device provided such that heat, generated within interior of multi-chip arrangement, is dissipated in direction of opposite side of stack arrangement of contact units |
| 07/27/2006 | DE102005003390A1 Substrate for fine ball grid array semiconductor component, has bond channel lockable with housing part consisting of sealing compound, and form closure units arranged in area, in which housing part is formed, of substrate |
| 07/27/2006 | DE102005003298A1 Elektronisches Bauelement für Hochfrequenz-Anwendungen und Verfahren zum Herstellen eines elektronischen Bauelements für Hochfrequenz-Anwendungen The electronic component for high-frequency applications and methods for producing an electronic component for high-frequency applications |
| 07/27/2006 | DE102005003139A1 Electrostatic discharge protection semiconductor device, has one conduction channel close to another channel at distance which is measured so that voltage stability of insulator in extension is smaller than electrical potential level |
| 07/27/2006 | DE102005003125A1 High-frequency electrical circuit for multi-chip module, has electrical components mechanically connected with each other by sealing compound and provided with conductive strip layers, which electrically connects components with each other |
| 07/27/2006 | DE102005002987A1 Leiterbahnstruktur zur Minimierung von thermomechanischen Belastungen Conductor track structure in order to minimize thermo-mechanical stress |
| 07/27/2006 | DE102005002862A1 Fine ball grid array component manufacturing method, involves pressing grouting form for detection of lower housing part on solder ball side, and designing substrate surface as sealing area such that surface is provided with sealing units |
| 07/27/2006 | DE102005002707A1 Semiconductor component, has micro connecting unit to provide high frequency coupling of components and including three ply structure with two layers extending along common middle line and fixed on contact surface pairs of components |
| 07/27/2006 | DE102005001718A1 Integrated circuit e.g. logical chip, arrangement, has wiring section with nano-structure between wiring-junction units and electrically insulating layer provided in section, where one unit and layer form channel between junction units |
| 07/27/2006 | DE10144467B4 Elektronisches Sensorbauteil und Verfahren zu seiner Herstellung Electronic sensor component and method for its preparation |
| 07/27/2006 | DE10037452B4 Nachführschaltung Readjustment |
| 07/26/2006 | EP1684564A1 Liquid cooled thermosiphon for electronic components |
| 07/26/2006 | EP1684561A1 Device permitting heat transfer, especially from a component or electronic cart to a framework or to a heat dissipator linked to said framework |
| 07/26/2006 | EP1684559A1 Conductive paste and multilayer ceramic substrate |
| 07/26/2006 | EP1684347A2 Semiconductor apparatus |
| 07/26/2006 | EP1684346A2 Packaging structure protecting against electrical interferences |
| 07/26/2006 | EP1684345A2 Surface mount semiconductor device |
| 07/26/2006 | EP1684344A2 Heat sink |
| 07/26/2006 | EP1684341A2 Electric circuit and method of manufacturing an electric circuit |
| 07/26/2006 | EP1684338A1 Non-contact id card and manufacturing method thereof |
| 07/26/2006 | EP1683822A1 Prepolymer, prepolymer composition, high molecular weight polymer having structure containing hole and electrically insulating film |
| 07/26/2006 | EP1683404A2 Flow distributing unit and cooling unit having bypass flow |
| 07/26/2006 | EP1683278A2 Processor component |
| 07/26/2006 | EP1683209A2 Encapsulation assembly for electronic devices |
| 07/26/2006 | EP1683202A1 Trench gate field effect devices |
| 07/26/2006 | EP1683198A2 Semiconductor device and manufacturing method thereof |
| 07/26/2006 | EP1683197A2 Power module |
| 07/26/2006 | EP1683196A2 Electromagnetic noise shielding in semiconductor packages using caged interconnect structures |
| 07/26/2006 | EP1682858A1 An integrated thermal sensor for microwave transistors |
| 07/26/2006 | EP1682841A1 Flow distributing unit and cooling unit |
| 07/26/2006 | EP1360724B1 Method of fabricating integrated circuits, providing improved so-called "saw bow" conductive tracks |
| 07/26/2006 | EP1358124A4 Metal-carbon composite powders, methods for producing powders and devices fabricated from same |