| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/01/2006 | US7084490 Leads under chip IC package |
| 08/01/2006 | US7084489 Computer system including at least one stress balanced semiconductor package |
| 08/01/2006 | US7084488 Packaged semiconductor device and method of manufacture using shaped die |
| 08/01/2006 | US7084487 Shielded platform for die-bonding an analog die to an FPGA |
| 08/01/2006 | US7084481 Symmetric inducting device for an integrated circuit having a ground shield |
| 08/01/2006 | US7084479 Line level air gaps |
| 08/01/2006 | US7084478 Load resistor with dummy contact substantially free of charge build up during etching process |
| 08/01/2006 | US7084474 Photosensitive semiconductor package and method for fabricating the same |
| 08/01/2006 | US7084463 Semiconductor device and manufacturing method thereof |
| 08/01/2006 | US7084452 Semiconductor device having one-time programmable ROM and method of fabricating the same |
| 08/01/2006 | US7084442 Double gate transistor arrangement for receiving electrical signals from living cells |
| 08/01/2006 | US7084440 Integrated circuit layout and a semiconductor device manufactured using the same |
| 08/01/2006 | US7084430 Pixel structure and fabricating method thereof |
| 08/01/2006 | US7084427 Systems and methods for overlay shift determination |
| 08/01/2006 | US7084355 Multilayer printed circuit board |
| 08/01/2006 | US7084352 Thin-film resin substrate used in a high-frequency module |
| 08/01/2006 | US7084351 Electrical device allowing for increased device densities |
| 08/01/2006 | US7084112 Activated polyethylene glycol compounds |
| 08/01/2006 | US7084079 Method for low temperature chemical vapor deposition of low-k films using selected cyclosiloxane and ozone gases for semiconductor applications |
| 08/01/2006 | US7084077 Method of fabricating multilayer interconnect wiring structure having low dielectric constant insulator film with enhanced adhesivity |
| 08/01/2006 | US7084063 Fabrication method of semiconductor integrated circuit device |
| 08/01/2006 | US7084058 Method of forming low-loss coplanar waveguides |
| 08/01/2006 | US7084057 Bit line contact structure and fabrication method thereof |
| 08/01/2006 | US7084056 Electrical interconnection, method of forming the electrical interconnection, image sensor having the electrical interconnection and method of manufacturing the image sensor |
| 08/01/2006 | US7084055 Method for manufacturing semiconductor integrated circuit device |
| 08/01/2006 | US7084053 Unidirectionally conductive materials for interconnection |
| 08/01/2006 | US7084022 Method of manufacturing a semiconductor device including forming a pattern, an interlayer insulation film, exposing the patterning and flattening |
| 08/01/2006 | US7084014 Method of making circuitized substrate |
| 08/01/2006 | US7084013 Methods for forming protective layers on semiconductor device substrates |
| 08/01/2006 | US7084011 Forming a chip package having a no-flow underfill |
| 08/01/2006 | US7084010 Integrated package design and method for a radiation sensing device |
| 08/01/2006 | US7084009 Method of manufacturing a packaging structure for electronic parts buried in an insulating film formed on the electronic parts and a wiring substrate |
| 08/01/2006 | US7084008 Manufacturing method for electronic component-mounted component, manufacturing method for electronic component-mounted completed product with the electronic component-mounted component, and electronic component-mounted completed product |
| 08/01/2006 | US7084006 Electronic parts packaging structure and method of manufacturing the same |
| 08/01/2006 | US7084005 Semiconductor device and method of manufacturing the same |
| 08/01/2006 | US7084004 MEMS heat pumps for integrated circuit heat dissipation |
| 08/01/2006 | US7084003 Method for manufacturing semiconductor device packages |
| 08/01/2006 | US7083994 Method of manufacturing a semiconductor device with outline of cleave marking regions and alignment or registration features |
| 08/01/2006 | US7083897 Method of fabricating a poly fuse |
| 08/01/2006 | US7083850 Electrically conductive thermal interface |
| 08/01/2006 | US7083759 Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions |
| 08/01/2006 | US7083747 Ultrasonic aerosol generators; transducers; fluid flow; supplying carrier gas; pyrolysis |
| 08/01/2006 | US7083436 Particle distribution interposer and method of manufacture thereof |
| 08/01/2006 | US7083424 Socket for electronic part |
| 08/01/2006 | US7082778 Self-contained spray cooling module |
| 08/01/2006 | US7082772 Peltier temperature control system for electronic components |
| 08/01/2006 | US7082682 Contact structures and methods for making same |
| 08/01/2006 | US7082678 Method of fabricating an integrated circuit package |
| 08/01/2006 | CA2314116C Pb-free solder-connected structure and electronic device |
| 08/01/2006 | CA2250504C Multibit single cell memory having tapered contact |
| 07/27/2006 | WO2006079104A2 Encapsulation of circuit components to reduce thermal cycling stress |
| 07/27/2006 | WO2006078383A1 Vsat block up converter (buc) chip |
| 07/27/2006 | WO2006078065A1 Semiconductor device |
| 07/27/2006 | WO2006078062A1 Epoxy resin composition, method of rendering the same latent, and semiconductor device |
| 07/27/2006 | WO2006077974A1 Sealing board and method for producing the same |
| 07/27/2006 | WO2006077870A1 Method for cutting lead terminal of packaged electronic component |
| 07/27/2006 | WO2006077862A1 Epoxy resin composition and optical material using same |
| 07/27/2006 | WO2006077802A1 Semiconductor device |
| 07/27/2006 | WO2006077755A1 Member for semiconductor device and method for manufacture thereof |
| 07/27/2006 | WO2006077667A1 Silicone composition for encapsulating luminescent element and luminescent device |
| 07/27/2006 | WO2006077630A1 Semiconductor device manufacturing method |
| 07/27/2006 | WO2006077452A1 Leadframe, semiconductor package and methods of producing the same |
| 07/27/2006 | WO2006076984A1 Strip conductor structure for minimizing thermomechanical loads |
| 07/27/2006 | WO2006063272A3 Alloyed underlayer for microelectronic interconnects |
| 07/27/2006 | WO2006023184A3 Qfn package and method therefor |
| 07/27/2006 | WO2005101489A3 Housing for led chip and light source |
| 07/27/2006 | WO2005098946A3 Lead frame having a tilt flap for locking molding compound and semiconductor device having the same |
| 07/27/2006 | WO2005094240A3 Reconfigurable processor module with stacked die elements |
| 07/27/2006 | US20060168702 Security-sensitive semiconductor product, particularly a smart-card chip |
| 07/27/2006 | US20060168552 Substrate mapping |
| 07/27/2006 | US20060167650 Interconnection pattern inspection method, manufacturing method of semiconductor device and inspection apparatus |
| 07/27/2006 | US20060167174 Electronic device manufacture |
| 07/27/2006 | US20060166507 Integrated circuits having low resistivity contacts and the formation thereof using an in situ plasma doping and clean |
| 07/27/2006 | US20060166490 Forming buried via hole substrates |
| 07/27/2006 | US20060166488 Semiconductor device and method for manufacturing the same |
| 07/27/2006 | US20060166479 Interconnection device for a printed circuit board, a method of manufacturing the same, and an interconnection assembly having the same |
| 07/27/2006 | US20060166434 Computer implemented method for designing a semiconductor integrated circuit and a semiconductor integrated circuit |
| 07/27/2006 | US20060166407 Hermetic packaging |
| 07/27/2006 | US20060166405 Manufacturing method of semiconductor device |
| 07/27/2006 | US20060166402 Elevated bond-pad structure for high-density flip-clip packaging and a method of fabricating the structures |
| 07/27/2006 | US20060166401 Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication therefor |
| 07/27/2006 | US20060166400 Electronic assembly with integrated IO and power contacts |
| 07/27/2006 | US20060166399 Integrated circuit die connection methods and apparatus |
| 07/27/2006 | US20060166397 Thermal enhanced package for block mold assembly |
| 07/27/2006 | US20060166012 Chemical planarization performance for copper/low-k interconnect structures |
| 07/27/2006 | US20060165875 Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment |
| 07/27/2006 | US20060164817 Communication module |
| 07/27/2006 | US20060164805 Cooling assembly comprising micro-jets |
| 07/27/2006 | US20060164189 Strip line device, member to be mounted on printed wiring board, circuit board, semiconductor package, and its fabricating method |
| 07/27/2006 | US20060163752 Storage assembly |
| 07/27/2006 | US20060163751 Integrated circuit package encapsulating a hermetically sealed device |
| 07/27/2006 | US20060163750 Semiconductor device and method for producing the same |
| 07/27/2006 | US20060163749 IC chip package structure and underfill process |
| 07/27/2006 | US20060163748 Semiconductor device |
| 07/27/2006 | US20060163747 Assembly including a circuit and an encapsulation frame, and method of making the same |
| 07/27/2006 | US20060163746 Barrier structure for semiconductor devices |
| 07/27/2006 | US20060163745 Semiconductor device |
| 07/27/2006 | US20060163744 Printable electrical conductors |
| 07/27/2006 | US20060163743 Semiconductor device and method for manufacturing the same, and electric device |
| 07/27/2006 | US20060163742 Semiconductor component with passivation layer |