Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2006
08/02/2006EP1636854B1 Sensor component, and panel used for the production thereof
08/02/2006EP1615970B1 Acrylic-based thermally conductive composition and thermally conductive sheet
08/02/2006EP1614009B1 Masking arrangement and method for producing integrated circuit arrangements
08/02/2006EP1434750B1 Thick film conductor compositions for use on aluminum nitride substrates
08/02/2006EP1206325A4 Vapor phase connection techniques
08/02/2006CN2802919Y Heat sink
08/02/2006CN2802726Y Water cooled heat exchanger and heat sink
08/02/2006CN2802725Y Heat sink
08/02/2006CN2802724Y CPU heat sink
08/02/2006CN2802723Y Heat sink joint structure for storage of note-book type computer
08/02/2006CN2802722Y Packed ceramic substrate structure for image sensor
08/02/2006CN1813506A Cooler for electronic equipment
08/02/2006CN1813505A Integrated socket and cable connector
08/02/2006CN1813362A Methods for forming patterns on a filled dielectric material on substrates
08/02/2006CN1813350A Methods for the control of flatness and electron mobility of diamond coated silicon and structures formed thereby
08/02/2006CN1813349A Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
08/02/2006CN1813348A Device comprising at least one heat source formed by a functional element that is to be cooled, at least one heat sink, and at least one intermediate layer located between the heat source and the heat
08/02/2006CN1813346A Underfill and mold compounds including siloxane-based aromatic diamines
08/02/2006CN1812826A Gas-collecting unit, test head, and IC device testing apparatus
08/02/2006CN1812691A Multi-component ltcc substrate with a core of high dielectric constant ceramic material and processes for the development thereof
08/02/2006CN1812238A Using higher voltage power supply electrical level of low-voltage logical operation
08/02/2006CN1812120A Semiconductor device
08/02/2006CN1812109A Tft array panel and fabricating method thereof
08/02/2006CN1812100A Semiconductor device and manufacturing method therefor
08/02/2006CN1812099A Semiconductor integrated circuit
08/02/2006CN1812097A Semiconductor device
08/02/2006CN1812095A Low voltage logic operation using higher voltage supply levels
08/02/2006CN1812094A Low voltage logic operation using higher voltage supply levels
08/02/2006CN1812093A Light-emitting diode, backlight device and method of manufacturing the light-emitting diode
08/02/2006CN1812089A Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument
08/02/2006CN1812088A Multi-level semiconductor module and method for fabricating the same
08/02/2006CN1812087A Battery protection ic chip
08/02/2006CN1812086A Antifuse structure having an integrated heating element
08/02/2006CN1812085A Surface mount semiconductor device
08/02/2006CN1812084A Semiconductor package and lead frame therefor
08/02/2006CN1812083A Semiconductor apparatus and manufacturing method
08/02/2006CN1812082A Semiconductor device
08/02/2006CN1812081A Semiconductor device and unit equipped with the same
08/02/2006CN1812080A Device for flip chip assembling
08/02/2006CN1812079A Electronic apparatus and display apparatus equipped with the electric apparatus
08/02/2006CN1812078A Radiator structure and producing method thereof
08/02/2006CN1812077A Ic chip package structure and underfill process
08/02/2006CN1812064A Coating for enhancing adhesion of molding compound to semiconductor devices
08/02/2006CN1812063A Circuit device manufacturing method
08/02/2006CN1810690A Ultralow temperature diode glass casing
08/02/2006CN1810507A Mounted structure, liquid droplet ejection head, liquid droplet ejection apparatus and manufacturing method
08/02/2006CN1810506A Device package structure, device packaging method, droplet ejection head, connector, and semiconductor device
08/02/2006CN1268193C Housing structure of electronic device and heat radiation method therefor
08/02/2006CN1268177C Method of making electronic materials
08/02/2006CN1268041C Contact for spiral contactor and spiral contactor
08/02/2006CN1267998C Semiconductor structure for preventing self-alignment metal silicides bridge connection and method thereof
08/02/2006CN1267996C Semiconductor device and its manufacturing method
08/02/2006CN1267995C Programmable gate array based on transistor grid oxidation layr breakdown property
08/02/2006CN1267993C Semiconductor device and manufacture thereof
08/02/2006CN1267992C Semiconductor device of multi-layer wiring structure
08/02/2006CN1267991C Gold wire for semiconductor device bonded connecting
08/02/2006CN1267990C Pressure cast power device and its making process
08/02/2006CN1267989C Circuit board for mounting electronic parts
08/02/2006CN1267986C Method for making silicide film of plane unit storage element
08/02/2006CN1267978C Projected spots forming method,semiconductor element and device and manufacture thehreof, circuit placode and electron machine
08/02/2006CN1267969C Manufacturing method for semiconductor device
08/02/2006CN1267922C Voice code and decode method,and voice transmission and receiving method
08/02/2006CN1267850C Memory card and its manufacturing method
08/02/2006CN1267784C Method for producing liquid crystal display device
08/02/2006CN1267770C Photoelectric device, its making method and electronic equipment
08/02/2006CN1267268C Interface materials and methods of production and use thereof
08/02/2006CN1267208C Method and equipment for quantitatively distributing adhesion agent onto heat radiator fin, and positioning adhesion therefor
08/01/2006US7086024 Methods and apparatus for defining power grid structures having diagonal stripes
08/01/2006US7085135 Thermal dissipation structure and method employing segmented heat sink surface coupling to an electronic component
08/01/2006US7084728 Electrically decoupled integrated transformer having at least one grounded electric shield
08/01/2006US7084723 Waveguide coupler
08/01/2006US7084708 High-frequency amplification device
08/01/2006US7084696 Circuits associated with fusible elements for establishing and detecting of the states of those elements
08/01/2006US7084660 System and method for accelerated detection of transient particle induced soft error rates in integrated circuits
08/01/2006US7084517 Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit
08/01/2006US7084515 Electronic device package
08/01/2006US7084514 Multi-chip module and methods
08/01/2006US7084513 Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same
08/01/2006US7084512 Circuit substrate and its manufacturing method
08/01/2006US7084511 Semiconductor device having resin-sealed area on circuit board thereof
08/01/2006US7084510 Semiconductor device and method of manufacturing the same
08/01/2006US7084509 Electronic package with filled blinds vias
08/01/2006US7084508 Semiconductor device with multiple layer insulating film
08/01/2006US7084507 Integrated circuit device and method of producing the same
08/01/2006US7084506 Semiconductor device
08/01/2006US7084505 Porous film, composition and manufacturing method, interlayer dielectric film, and semiconductor device
08/01/2006US7084504 Boron incorporated diffusion barrier material
08/01/2006US7084503 Semiconductor device and fabricating method thereof
08/01/2006US7084502 Microelectromechanical device and method for producing it
08/01/2006US7084501 Interconnecting component
08/01/2006US7084500 Semiconductor circuit with multiple contact sizes
08/01/2006US7084499 Semiconductor package and method for making the same
08/01/2006US7084498 Semiconductor device having projected electrodes and structure for mounting the same
08/01/2006US7084497 Physically deposited layer to electrically connect circuit edit connection targets
08/01/2006US7084496 Method and apparatus for providing optoelectronic communication with an electronic device
08/01/2006US7084495 Electroosmotic pumps using porous frits for cooling integrated circuit stacks
08/01/2006US7084494 Semiconductor package having integrated metal parts for thermal enhancement
08/01/2006US7084493 Wiring circuit board and production method thereof
08/01/2006US7084492 Underfill and mold compounds including siloxane-based aromatic diamines
08/01/2006US7084491 Semiconductor device