Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2014
05/07/2014CN103782670A 用于冷却功率电子器件的系统和方法 System and method for cooling power electronics
05/07/2014CN103782459A 安装有完整扩散阻挡层的半导体激光器 A complete installation of the diffusion barrier layer is a semiconductor laser
05/07/2014CN103782382A 具有锚固结构的焊接掩模 Anchorage has a solder mask structure
05/07/2014CN103782381A 包括在衬底上的管芯以及在管芯上具有开窗的散热器的电子组件 On a substrate comprising a die and an electronic component having a heat sink in the window on the die
05/07/2014CN103782380A 半导体模块 Semiconductor Modules
05/07/2014CN103782379A 半导体模块，电路基板 The semiconductor module, the circuit board
05/07/2014CN103782377A 焊接补救方法以及利用该方法的半导体器件 Welding remedy and a semiconductor device using this method
05/07/2014CN103782374A 显示装置用配线结构 Wiring structure of a display device
05/07/2014CN103782373A 蚀刻液组合物以及蚀刻方法 Etchant compositions and method of etching
05/07/2014CN103782143A 用于估计半导体芯片温度的方法和设备 Methods and apparatus for estimating the temperature of the semiconductor chip
05/07/2014CN103781852A 固化硅组合物、其固化物、及其光半导体装置 Curing silicone composition cured and optical semiconductor device
05/07/2014CN103781821A 聚合物和含有该聚合物的组合物以及粘合剂用组合物 Polymers and compositions containing the polymer and the adhesive composition
05/07/2014CN103781815A 光半导体元件密封用固化性树脂组合物及其固化物 An optical semiconductor element is sealed with a curable resin composition and a cured product
05/07/2014CN103781742A 氮化硅基板和氮化硅基板的制造方法 The method of producing the silicon nitride substrate and the silicon nitride substrate,
05/07/2014CN103781274A 多层板的散热结构和制造该结构的方法 The method of manufacturing multilayer thermal structure and the structure
05/07/2014CN103780243A 一种具有转移信号功能的3d芯片冗余硅通孔容错结构 3d chip redundancy signal having a transfer function of TSV fault-tolerant architecture
05/07/2014CN103780102A 一种智能半导体功率模块 An intelligent semiconductor power module
05/07/2014CN103779490A 光电半导体装置及其制造方法 Optical semiconductor device and manufacturing method
05/07/2014CN103779427A 一种氧化物薄膜晶体管及其制备方法 An oxide thin film transistor and a method for preparing
05/07/2014CN103779402A 半导体结构与其制造方法 Semiconductor structure and its manufacturing method
05/07/2014CN103779351A 三维封装结构及其制造方法 Three-dimensional packaging structure and manufacturing method thereof
05/07/2014CN103779348A 一种平板式功率半导体模块 A flat-type power semiconductor module
05/07/2014CN103779344A 一种功率模块封装结构 A power module package structure
05/07/2014CN103779343A 功率半导体模块 Power semiconductor module
05/07/2014CN103779342A 一种功率半导体模块 A power semiconductor module
05/07/2014CN103779341A 一种大功率半桥模块 One kind of high-power half-bridge module
05/07/2014CN103779340A 半导体器件和制造半导体器件的方法 The method of manufacturing a semiconductor device and a semiconductor device
05/07/2014CN103779339A 功率半导体模块 Power semiconductor module
05/07/2014CN103779338A 电子设备和半导体器件 Electronic device and a semiconductor device
05/07/2014CN103779336A 具有集成天线的半导体封装及其形成方法 The semiconductor package with integrated antennas and method of forming
05/07/2014CN103779335A 高电阻薄膜电阻器及形成所述电阻器的方法 High resistance thin film resistor and method of forming the resistor
05/07/2014CN103779334A 一种用于智能卡的有源防护装置 An active protection device for a smart card
05/07/2014CN103779333A 具有内嵌元件、及电磁屏障的线路板 With embedded components, and electromagnetic barrier board
05/07/2014CN103779332A 具有内置自维护块的集成电路芯片的堆叠芯片模块 With built-in self-maintenance blocks stacked integrated circuit chip chip module
05/07/2014CN103779331A 等离子体引入损伤检测结构及制作方法 Plasma introducing structural damage detection and production method
05/07/2014CN103779330A 监控金属工艺后短路或断路的测试结构 After monitoring metal craft short or open circuit test structure
05/07/2014CN103779329A 用于mosfet噪声测试的半导体测试结构 Mosfet semiconductor test structure for noise testing
05/07/2014CN103779328A 一种半导体器件的测试结构及测试方法 Test structures and test method of a semiconductor device
05/07/2014CN103779327A Imd测量电路结构和imd性能测试方法 Imd measuring circuit structure and performance test methods imd
05/07/2014CN103779326A Goi测试电路结构 Goi test circuit structure
05/07/2014CN103779325A 用于级联mos晶体管的布局方案 Layout scheme for cascade mos transistors
05/07/2014CN103779324A 穿硅孔堆叠结构以及其制作方法 Through silicon holes stacked structure and its manufacturing method
05/07/2014CN103779323A 柔性嵌入式光互连结构及其制作方法 Flexible Embedded optical interconnect structure and production methods
05/07/2014CN103779322A 镶嵌间隙结构 Mosaic gap structure
05/07/2014CN103779321A 具有接触插栓的半导体结构与其形成方法 Semiconductor structure having a contact plug its formation method
05/07/2014CN103779320A 用于无芯变压器的系统和方法 System and method for coreless transformer
05/07/2014CN103779319A 具有集成天线的半导体封装及其形成方法 The semiconductor package with integrated antennas and method of forming
05/07/2014CN103779318A 包括凹陷有源区的半导体器件及形成该半导体器件的方法 The semiconductor device includes a recessed region of the active semiconductor device and a method of forming the
05/07/2014CN103779317A 半导体结构与降低半导体结构中信号干扰的方法 The semiconductor structure of the semiconductor structure to reduce signal interference method
05/07/2014CN103779316A 一种功率模块焊接结构 A power module welded structure
05/07/2014CN103779315A 一种散热一体化功率模块的封装结构 A package structure integrated power module cooling
05/07/2014CN103779314A 封装基板及其制作方法 Package substrate and its making method
05/07/2014CN103779313A 一种带电极压力装置的功率半导体模块 A power semiconductor module with a pressure device electrodes
05/07/2014CN103779312A 嵌入式芯片封装及用于制造嵌入式芯片封装的方法 The embedded chip package and a method for the manufacture of embedded chip package
05/07/2014CN103779311A 半导体装置及其制造方法 Semiconductor device and manufacturing method
05/07/2014CN103779310A 一种在功率半导体封装中使用的焊接用信号引线 Welding for use in a semiconductor package with a power signal lead
05/07/2014CN103779309A 镀金金银钯合金单晶键合丝及其制造方法 Gold-plated and silver-palladium alloy crystal bonding wire and its manufacturing method
05/07/2014CN103779308A 金银钯合金单晶键合丝及其制造方法 Silver-palladium alloy crystal bonding wire and its manufacturing method
05/07/2014CN103779307A 一种全免清洗软钎焊功率模块及制备方法 One kind of Shipping cleaning soldering power module and preparation methods
05/07/2014CN103779306A 一种封装结构、封装方法及在封装方法中使用的模板 A package structure, packaging methods and templates used in the encapsulation method
05/07/2014CN103779305A 一种金属连接件及功率半导体模块 Metal connector and the power semiconductor module
05/07/2014CN103779304A 焊料连接结构、其制造方法、表面安装结构和安装方法 Solder connection structure, manufacturing method, surface mounting structure and installation methods
05/07/2014CN103779303A 凸点式封装及其形成方法 Bump package and method of forming
05/07/2014CN103779302A 具有大焊盘的封装集成电路及其形成方法 Packaged integrated circuit having a large pad and method of forming
05/07/2014CN103779301A 电接触垫 Electrical contact pads
05/07/2014CN103779300A 封装基板及芯片封装构件 Package substrate and chip packaging member
05/07/2014CN103779299A 半导体封装件及其制法 The semiconductor package Jiqizhifa
05/07/2014CN103779298A 立体堆叠式封装结构及其制作方法 Three-dimensional stacked package structure and production methods
05/07/2014CN103779297A 金属凸块接合结构 Metal bump bonding structure
05/07/2014CN103779296A 一种组合式键合外壳 A modular housing bond
05/07/2014CN103779295A 功率模块封装 Power Module Package
05/07/2014CN103779294A 一种利用水冷散热器双面散热的模块功率封装结构 A use of double-sided cooling water cooler module power package
05/07/2014CN103779293A 一种小功率绝缘栅双极性晶体管全桥模块 A small-power insulated gate bipolar transistor full bridge modules
05/07/2014CN103779292A 一种基于石墨烯的芯片散热材料的制备方法 Preparation method of graphene-based material chip cooling
05/07/2014CN103779291A 一种功率模块封装用的散热基板 A power module package with heat dissipation substrate
05/07/2014CN103779290A 连接基板及层叠封装结构 Connection board and laminated packaging structure
05/07/2014CN103779289A 连接基板及层叠封装结构 Connection board and laminated packaging structure
05/07/2014CN103779288A 一种基于双电源的串并联内耦式半导体制冷模块 Based in the series-parallel coupled dual power semiconductor cooling module
05/07/2014CN103779287A 超薄微型贴片微功耗声控传感器用封装芯片及其封装方法 Packaged chips and thin micro SMD packaging method micropower voice sensor
05/07/2014CN103779286A 一种封装结构、封装方法及在封装方法中使用的模板 A package structure, packaging methods and templates used in the encapsulation method
05/07/2014CN103779285A 一种混合集成功率模块散热封装结构 A hybrid integrated power module cooling package structure
05/07/2014CN103779284A 封装载板与芯片封装结构 Package substrate and chip package structure
05/07/2014CN103779283A 封装器件、封装器件的制造方法以及封装方法 Packaged device manufacturing method, packaged devices and encapsulation method
05/07/2014CN103779282A 一种便于安装的功率半导体模块 A power semiconductor module is easy to install
05/07/2014CN103779252A 一种用于圆片级键合中颗粒污染的在线检测结构 Online detection structure for wafer-level bonding in particle contamination
05/07/2014CN103779250A 用于倒装芯片的电学测试的装置和方法 Flip-chip device and method for electrical testing
05/07/2014CN103779246A 一种高可靠性的铜柱凸块封装方法及其封装结构 A highly reliable method for copper pillar bump package and package structure
05/07/2014CN103779245A 芯片封装方法及封装结构 Chip packaging method and package structure
05/07/2014CN103779243A 半导体器件及其制造方法以及封装后的半导体器件 Semiconductor device and manufacturing method and a semiconductor device encapsulated
05/07/2014CN103779240A 制造电路板的方法及使用其制造的芯片封装件和电路板 The method of producing a circuit board and manufactured using chip package and the circuit board
05/07/2014CN103779239A 一种智能功率模块的制造方法及智能功率模块 An intelligent power module manufacturing method and intelligent power module
05/07/2014CN103779237A 用于组装wlcsp晶片的方法及半导体器件 A method for assembling semiconductor devices and wafers wlcsp
05/07/2014CN103779235A 扇出晶圆级封装结构 Fan-out wafer level package structure
05/07/2014CN103779234A 一种半导体器件封装结构以及制备方法 A semiconductor device package structure, and a method for preparing
05/07/2014CN103779202A 像素结构及其制作方法和显示面板 Pixel structure and its production method and the display panel
05/07/2014CN103779181A 一种mim电容器及其制造方法 One kind mim capacitor and manufacturing method
05/07/2014CN103778966A 堆叠芯片模块及其制造和维修方法 Stacked chip module and its manufacturing and repair methods
05/07/2014CN103773265A 各向异性导电性粘接剂组合物 An anisotropic conductive adhesive composition
05/07/2014CN103772997A 可固化组合物 The curable composition
05/07/2014CN103772649A 辐射或热可固化的防渗密封胶 Radiation or heat curable impermeable sealant
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