| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 08/08/2006 | US7086291 Overstress indication |
| 08/08/2006 | US7086149 Method of making a contact structure with a distinctly formed tip structure |
| 08/08/2006 | US7086148 Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit |
| 08/08/2006 | US7086147 Method of accommodating in volume expansion during solder reflow |
| 08/03/2006 | WO2006080500A1 Adhesive and luminescent element |
| 08/03/2006 | WO2006080459A1 Curable silicone resin composition, hermetic container using same and electronic component |
| 08/03/2006 | WO2006080388A1 Electronic element package manufacturing method and electronic element package |
| 08/03/2006 | WO2006080338A1 Highly heat-resistant synthetic polymer compound and high withstand voltage semiconductor device |
| 08/03/2006 | WO2006080337A1 Semiconductor device and method for manufacturing same, and stacked type semiconductor integrated circuit |
| 08/03/2006 | WO2006080297A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| 08/03/2006 | WO2006080270A1 Curing accelerator, curable resin composition, and electronic part/device |
| 08/03/2006 | WO2006080048A1 Semiconductor device |
| 08/03/2006 | WO2006079849A1 Improvements to ceramic packages for high frequency circuits |
| 08/03/2006 | WO2006048845A3 Carbon nanotube-based conductive connections for integrated circuit devices |
| 08/03/2006 | WO2006035360A3 Method of forming a coating on a substrate, and a coating thus formed |
| 08/03/2006 | WO2006017998A3 Wiring substrate of a semiconductor component comprising external contact pads for external contacts and method for producing the same |
| 08/03/2006 | WO2005101493A3 Improved bonding arrangement and method for ltcc circuitry |
| 08/03/2006 | WO2005079498A3 Continuously varying offset mark and methods of determining overlay |
| 08/03/2006 | WO2004093128A3 Lead frame structure with aperture or groove for flip chip in a leaded molded package |
| 08/03/2006 | US20060172878 Low temperature sintering ceramic composition for high frequency, method of fabriacting the same and electronic component |
| 08/03/2006 | US20060172535 Etch process for improving yield of dielectric contacts on nickel silicides |
| 08/03/2006 | US20060172530 CxHy sacrificial layer for cu/low-k interconnects |
| 08/03/2006 | US20060172529 Uniform passivation method for conductive features |
| 08/03/2006 | US20060172524 Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles |
| 08/03/2006 | US20060172472 Thin film transistor array panel and manufacturing method thereof |
| 08/03/2006 | US20060172464 Method of embedding semiconductor element in carrier and embedded structure thereof |
| 08/03/2006 | US20060172463 Semiconductor multi-package module having wire bond interconnect between stacked packages |
| 08/03/2006 | US20060172460 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
| 08/03/2006 | US20060172457 Chip-stacked semiconductor package and method for fabricating the same |
| 08/03/2006 | US20060172442 Semiconductor production system and semiconductor production process |
| 08/03/2006 | US20060171130 Semiconductor module |
| 08/03/2006 | US20060171125 Heat dissipating apparatus |
| 08/03/2006 | US20060171116 Integrated coolant circuit arrangement, operating method and production method |
| 08/03/2006 | US20060170446 System and method for testing devices utilizing capacitively coupled signaling |
| 08/03/2006 | US20060170115 Means of mounting for electronic components, arrangement and procedure |
| 08/03/2006 | US20060170114 Novel method for copper wafer wire bonding |
| 08/03/2006 | US20060170113 Semiconductor device |
| 08/03/2006 | US20060170112 Semiconductor device and method of manufacturing thereof |
| 08/03/2006 | US20060170111 Semiconductor device, electronic device, and method of manufacturing semiconductor device |
| 08/03/2006 | US20060170110 Through-substrate interconnect structures and assemblies |
| 08/03/2006 | US20060170109 Semiconductor device |
| 08/03/2006 | US20060170108 Semiconductor device |
| 08/03/2006 | US20060170107 Semiconductor device preventing electrical short and method of manufacturing the same |
| 08/03/2006 | US20060170106 Dual damascene with via liner |
| 08/03/2006 | US20060170105 Semiconductor device featuring probe area definition mark for defining probe area in electrode pad, and proof test system for proving proper contact of test probe with probe area |
| 08/03/2006 | US20060170104 Method and structure for defect monitoring of semiconductor devices using power bus wiring grids |
| 08/03/2006 | US20060170103 Semiconductor device and method of manufacturing the same |
| 08/03/2006 | US20060170102 Bump structure of semiconductor device and method of manufacturing the same |
| 08/03/2006 | US20060170101 Low thermal resistance package |
| 08/03/2006 | US20060170100 Routing design to minimize electromigration damage to solder bumps |
| 08/03/2006 | US20060170099 Transistor-level signal cutting method and structure |
| 08/03/2006 | US20060170098 Module structure having embedded chips |
| 08/03/2006 | US20060170097 Printed wires arrangement for in-line memory (IMM) module |
| 08/03/2006 | US20060170096 Chip scale package and method for manufacturing the same |
| 08/03/2006 | US20060170095 Device package |
| 08/03/2006 | US20060170094 Semiconductor package integral heat spreader |
| 08/03/2006 | US20060170093 Flip chip interconnection pad layout |
| 08/03/2006 | US20060170092 Semiconductor package system with cavity substrate |
| 08/03/2006 | US20060170091 Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages |
| 08/03/2006 | US20060170090 Stacked type semiconductor device and method of fabricating stacked type semiconductor device |
| 08/03/2006 | US20060170089 Electronic device and method for fabricating the same |
| 08/03/2006 | US20060170088 Spacer Structures for Semiconductor Package Devices |
| 08/03/2006 | US20060170087 Semiconductor device |
| 08/03/2006 | US20060170086 Semiconductor package and method of manufacturing the same |
| 08/03/2006 | US20060170085 Semiconductor device and manufacturing method thereof |
| 08/03/2006 | US20060170084 Semiconductor device and a method of manufacturing the same |
| 08/03/2006 | US20060170083 Side view LED package having lead frame structure designed to improve resin flow |
| 08/03/2006 | US20060170082 Chip packaging structure adapted to reduce electromagnetic interference |
| 08/03/2006 | US20060170081 Method and apparatus for packaging an electronic chip |
| 08/03/2006 | US20060170080 Semiconductor device having directly attached heat spreader |
| 08/03/2006 | US20060170079 Integrated circuit device having encapsulant dam with chamfered edge |
| 08/03/2006 | US20060170077 Substrate having pattern and method for manufacturing the same, and semiconductor device and method for manufacturing the same |
| 08/03/2006 | US20060170076 Apparatus, system, and method for reducing integrated circuit peeling |
| 08/03/2006 | US20060170054 Device having a low-voltage trigger element |
| 08/03/2006 | US20060170051 Semiconductor circuit constructions |
| 08/03/2006 | US20060169977 Liquid detection end effector sensor and method of using the same |
| 08/03/2006 | US20060169490 Molding tool and a method of forming an electronic device package |
| 08/03/2006 | DE4222142B4 Halbleiterbauelement mit einer Verdrahtungsschicht und Verfahren zu dessen Herstellung A semiconductor device having a wiring layer and method for its production |
| 08/03/2006 | DE19951754B4 Strahlungsrauschen-Unterdrückungs-Komponentenstruktur Radiation noise suppression component structure |
| 08/03/2006 | DE10332333B4 Detektormodul Detector module |
| 08/03/2006 | DE102005033306B3 Monolithic integrated circuit for use as FlexRay (RTM) transceiver, has interference suppressing device for reducing interference radiation, and comprising strip conductor with section whose length is selected based on radiation frequency |
| 08/03/2006 | DE102005003000A1 Semiconductor product e.g. dynamic RAM, for storing information, has substrate comprising isolation layer, and dopant diffusion region connected with capacitor electrode that is connected with one source and drain region |
| 08/03/2006 | DE102005002812A1 Kühlkörper für oberflächenmontierte Halbleiterbauteile und Montageverfahren Heat sink for semiconductor components and surface mount assembly process |
| 08/03/2006 | DE102005002731A1 Portable data carrier e.g. chip card, for document identification, has electronic unit connected with coil by connection formed by contacting arrays and connecting surfaces where arrays and surfaces are pressed against each other |
| 08/03/2006 | DE102005002678A1 Ritzrahmen mit verbesserter Füllroutine Scribe line with improved fill routine |
| 08/03/2006 | DE102004052626B3 Verfahren zum Bestimmen einer Kantenabdeckung bei Beschichtungsprozessen und Vorrichtung zur Durchführung des Verfahrens A method for determining an edge cover in coating processes and apparatus for carrying out the method |
| 08/03/2006 | DE10158770B4 Leiterrahmen und Bauelement mit einem Leiterrahmen Lead frame and component having a lead frame |
| 08/03/2006 | DE10103084B4 Halbleitermodul und Verfahren zu seiner Herstellung Semiconductor module and method for its preparation |
| 08/02/2006 | EP1686844A2 Overmolded electronic assembly with insert molded heat sinks |
| 08/02/2006 | EP1686628A2 Chip scale image sensor module and fabrication method of the same |
| 08/02/2006 | EP1686627A1 Semiconductor package and method of manufacturing the same |
| 08/02/2006 | EP1686623A1 Semiconductor device and process for fabricating the same |
| 08/02/2006 | EP1686622A2 Semiconductor device and manufacturing method of the same |
| 08/02/2006 | EP1686621A1 Surface mountable hermetically sealed package |
| 08/02/2006 | EP1685604A1 Device for cooling an electrical component and production method thereof |
| 08/02/2006 | EP1685600A1 Stackable electronic assembly |
| 08/02/2006 | EP1685596A2 Electric motor and method for producing said motor |
| 08/02/2006 | EP1685595A1 Power-electronic-cooling device |
| 08/02/2006 | EP1685594A2 Press-fit diode |
| 08/02/2006 | EP1685589A1 Zeolite - carbon doped oxide composite low k dielectric |