| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/09/2006 | CN1815721A CPU radiator |
| 08/09/2006 | CN1815720A Semiconductor device and method for producing the same |
| 08/09/2006 | CN1815719A Semiconductor device, method and apparatus for fabricating the same |
| 08/09/2006 | CN1815711A Interconnect structure and method of forming the same |
| 08/09/2006 | CN1815710A Method of manufacture semiconductor component with low dielectric constant dielectric layer |
| 08/09/2006 | CN1815708A Interconnect structure with low-resistance inlaid copper/barrier and method for manufacturing the same |
| 08/09/2006 | CN1269390C Semiconductor device and producing method thereof |
| 08/09/2006 | CN1269223C Semiconductor device and its manufacturing method |
| 08/09/2006 | CN1269212C Circuit structure for integrating power distributed function of circuit and lead frame to chip surface |
| 08/09/2006 | CN1269211C Electronic part with a lead frame |
| 08/09/2006 | CN1269210C Wafer pad on plastic substrate for accepting integrated circuit wafer |
| 08/09/2006 | CN1269209C Semiconductor device and its producing method |
| 08/09/2006 | CN1269205C Topological process of wiring diagram, semiconductor device and optical patter-correcting method |
| 08/09/2006 | CN1269200C 集成电路器件和布线板 IC devices and wiring board |
| 08/09/2006 | CN1269199C Flip chip type semiconductor device and making method thereof |
| 08/09/2006 | CN1269198C Resin packaged semiconductor device and die bonding material and packaging material thereof |
| 08/09/2006 | CN1268712C Thermosoftening heat conducting component |
| 08/09/2006 | CA2535757A1 Package or pre-applied foamable underfill for lead-free process |
| 08/08/2006 | US7089522 Device, design and method for a slot in a conductive area |
| 08/08/2006 | US7089516 Measurement of integrated circuit interconnect process parameters |
| 08/08/2006 | US7088751 Solid-state laser apparatus |
| 08/08/2006 | US7088610 Magnetic memory apparatus and method of manufacturing magnetic memory apparatus |
| 08/08/2006 | US7088592 ESD protection structure and device utilizing the same |
| 08/08/2006 | US7088584 Air guiding device for electronic components |
| 08/08/2006 | US7088582 Heat-dissipating device |
| 08/08/2006 | US7088204 Transmission line and semiconductor integrated circuit device |
| 08/08/2006 | US7088186 High-frequency power amplifier module |
| 08/08/2006 | US7088074 System level device for battery and integrated circuit integration |
| 08/08/2006 | US7088010 Chip packaging compositions, packages and systems made therewith, and methods of making same |
| 08/08/2006 | US7088009 Wirebonded assemblage method and apparatus |
| 08/08/2006 | US7088008 Electronic package with optimized circuitization pattern |
| 08/08/2006 | US7088007 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 08/08/2006 | US7088006 Integrated circuit arrangement |
| 08/08/2006 | US7088005 Wafer stacking with anisotropic conductive adhesive |
| 08/08/2006 | US7088004 Flip-chip device having conductive connectors |
| 08/08/2006 | US7088003 Structures and methods for integration of ultralow-k dielectrics with improved reliability |
| 08/08/2006 | US7088002 Interconnect |
| 08/08/2006 | US7088001 Semiconductor integrated circuit device with a metallization structure |
| 08/08/2006 | US7088000 Method and structure to wire electronic devices |
| 08/08/2006 | US7087999 Semiconductor protection element, semiconductor device and method for manufacturing same |
| 08/08/2006 | US7087998 Control of air gap position in a dielectric layer |
| 08/08/2006 | US7087997 Copper to aluminum interlayer interconnect using stud and via liner |
| 08/08/2006 | US7087996 Etchant formulation for selectively removing thin films in the presence of copper, tin, and lead |
| 08/08/2006 | US7087995 Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages |
| 08/08/2006 | US7087994 Microelectronic devices including underfill apertures |
| 08/08/2006 | US7087993 Chip package and electrical connection structure between chip and substrate |
| 08/08/2006 | US7087992 Multichip wafer level packages and computing systems incorporating same |
| 08/08/2006 | US7087991 Integrated circuit package and method of manufacture |
| 08/08/2006 | US7087990 Power semiconductor device |
| 08/08/2006 | US7087989 Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device |
| 08/08/2006 | US7087988 Semiconductor packaging apparatus |
| 08/08/2006 | US7087987 Tape circuit substrate and semiconductor chip package using the same |
| 08/08/2006 | US7087986 Solder pad configuration for use in a micro-array integrated circuit package |
| 08/08/2006 | US7087985 Nitride semiconductor light emitting device |
| 08/08/2006 | US7087984 Methods for protecting intermediate conductive elements of semiconductor device assemblies |
| 08/08/2006 | US7087983 Manufacturing methods of semiconductor devices and a solid state image pickup device |
| 08/08/2006 | US7087982 Nitrogen-containing polymers as porogens in the preparation of highly porous, low dielectric constant materials |
| 08/08/2006 | US7087980 Film thickness measuring monitor wafer |
| 08/08/2006 | US7087976 Inductors for integrated circuits |
| 08/08/2006 | US7087975 Area efficient stacking of antifuses in semiconductor device |
| 08/08/2006 | US7087974 Semiconductor integrated circuit including anti-fuse and method for manufacturing the same |
| 08/08/2006 | US7087973 Ballast resistors for transistor devices |
| 08/08/2006 | US7087968 Electrostatic discharge protection circuit and semiconductor circuit therewith |
| 08/08/2006 | US7087938 ESD protective circuit with collector-current-controlled triggering for a monolithically integrated circuit |
| 08/08/2006 | US7087937 Light emitting diode (LED) packaging |
| 08/08/2006 | US7087927 Semiconductor die with an editing structure |
| 08/08/2006 | US7087846 Pinned electronic package with strengthened conductive pad |
| 08/08/2006 | US7087844 Wiring circuit board |
| 08/08/2006 | US7087526 Method of fabricating a p-type CaO-doped SrCu2O2 thin film |
| 08/08/2006 | US7087524 Method of forming copper wiring in semiconductor device |
| 08/08/2006 | US7087520 Method for fabricating metal wiring |
| 08/08/2006 | US7087516 Electromigration-reliability improvement of dual damascene interconnects |
| 08/08/2006 | US7087514 Substrate having built-in semiconductor apparatus and manufacturing method thereof |
| 08/08/2006 | US7087512 Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions |
| 08/08/2006 | US7087511 Method for conducting heat in a flip-chip assembly |
| 08/08/2006 | US7087496 Seal ring for integrated circuits |
| 08/08/2006 | US7087467 Lead frame and production process thereof and production process of thermally conductive substrate |
| 08/08/2006 | US7087464 Method and structure for a wafer level packaging |
| 08/08/2006 | US7087460 Methods for assembly and packaging of flip chip configured dice with interposer |
| 08/08/2006 | US7087459 Method for packaging a multi-chip module of a semiconductor device |
| 08/08/2006 | US7087458 Method for fabricating a flip chip package with pillar bump and no flow underfill |
| 08/08/2006 | US7087455 Semiconductor device and manufacturing method for the same |
| 08/08/2006 | US7087452 Edge arrangements for integrated circuit chips |
| 08/08/2006 | US7087440 Monitoring of nitrided oxide gate dielectrics by determination of a wet etch |
| 08/08/2006 | US7087439 Method and apparatus for thermally assisted testing of integrated circuits |
| 08/08/2006 | US7087352 Measurement by adjustment lithography exposure of light; detection of interference pattern; spectral curves stored in library |
| 08/08/2006 | US7087350 Method for combining via patterns into a single mask |
| 08/08/2006 | US7087341 Metal-air battery components and methods for making same |
| 08/08/2006 | US7087316 iron layer and nickel layer having an iron-nickel layer between formed by heat treatment diffusion; relatively large thermal conductivity in a direction of thickness thereof |
| 08/08/2006 | US7087315 Method for forming plating film |
| 08/08/2006 | US7087198 Aerosol method and apparatus, particulate products, and electronic devices made therefrom |
| 08/08/2006 | US7087133 Methods for application of adhesive tape to semiconductor devices |
| 08/08/2006 | US7087116 Apparatus for modifying the configuration of an exposed surface of a viscous fluid |
| 08/08/2006 | US7086786 Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology |
| 08/08/2006 | US7086600 Electronic device and method of manufacturing the same |
| 08/08/2006 | US7086458 Heat sink structure with flexible heat dissipation pad |
| 08/08/2006 | US7086456 Combination of fan and heat sink |
| 08/08/2006 | US7086455 Spray cooling system |
| 08/08/2006 | US7086453 Integrated liquid cooling system for electrical components |
| 08/08/2006 | US7086451 Heat sink with carbon nanotubes and method for manufacturing same |