| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 08/10/2006 | US20060175697 Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof |
| 08/10/2006 | US20060175696 Nested integrated circuit package on package system |
| 08/10/2006 | US20060175695 Integrated circuit package system using interposer |
| 08/10/2006 | US20060175694 Stacked structure of integrated circuits and method for manufacturing the same |
| 08/10/2006 | US20060175693 Systems, methods, and apparatus for generating ball-out matrix configuration output for a flex circuit |
| 08/10/2006 | US20060175692 Substrate structure with embedded semiconductor chip and fabrication method thereof |
| 08/10/2006 | US20060175691 Semiconductor device with gold coatings, and process for producing it |
| 08/10/2006 | US20060175690 Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methods |
| 08/10/2006 | US20060175689 Multi-leadframe semiconductor package and method of manufacture |
| 08/10/2006 | US20060175688 Stacked integrated circuit package system |
| 08/10/2006 | US20060175687 Method and device for integrating an illumination source and detector into the same IC package that allows angular illumination with a common planar leadframe |
| 08/10/2006 | US20060175686 Semiconductor device and fabrication method thereof |
| 08/10/2006 | US20060175685 Composition for forming low-dielectric constant film comprising fullerene, low-dielectric constant film formed from the composition and method for forming the low-dielectric constant film |
| 08/10/2006 | US20060175684 Organosilicon compound |
| 08/10/2006 | US20060175683 Composition for forming low dielectric thin film including siloxane monomer or siloxane polymer having only one type of stereoisomer and method of producing low dielectric thin film using same |
| 08/10/2006 | US20060175679 Semiconductor device and method for manufacturing the same |
| 08/10/2006 | US20060175678 Drain extended MOS transistors with multiple capacitors and methods of fabrication |
| 08/10/2006 | US20060175665 Design and optimization of NMOS drivers using self-ballasting ESD protection technique in fully salicided CMOS process |
| 08/10/2006 | US20060175663 Electrostatic discharge circuit and method of dissipating an electrostatic current |
| 08/10/2006 | US20060175662 Reverse blocking semiconductor component with charge compensation |
| 08/10/2006 | US20060175636 Integrated circuit |
| 08/10/2006 | US20060175634 Redundant interconnect high current bipolar device and method of forming the device |
| 08/10/2006 | US20060175630 Electronic power module comprising a rubber seal and corresponding production method |
| 08/10/2006 | US20060175611 Thin film transistor circuit device, production method thereof and liquid crystal display using the thin film transistor circuit device |
| 08/10/2006 | US20060175607 Semiconductor device, device forming substrate, wiring connection testing method, and manufacturing method of the semiconductor device |
| 08/10/2006 | US20060175606 Subthreshold design methodology for ultra-low power systems |
| 08/10/2006 | US20060175419 Smart card, smart card module, and a method for production of a smart card module |
| 08/10/2006 | US20060175319 Systems and methods for overlay shift determination |
| 08/10/2006 | US20060175088 Substrate with slot |
| 08/10/2006 | DE19737294B4 Halbleiterbaustein mit wenigstens einem Kondensatorelement mit parallelen Kondensatorplatten sowie Verfahren zu seiner Herstellung A semiconductor device having at least one capacitor element with parallel capacitor plates, and methods for its preparation |
| 08/10/2006 | DE19730914B4 Mikroelektronik-Baugruppe Microelectronics assembly |
| 08/10/2006 | DE19508027B4 Integrierte Schaltung Integrated circuit |
| 08/10/2006 | DE10343256B4 Anordnung zur Herstellung einer elektrischen Verbindung zwischen einem BGA-Package und einer Signalquelle, sowie Verfahren zum Herstellen einer solchen Verbindung An arrangement for producing an electrical connection between a BGA package and a signal source, and to processes for producing such a compound |
| 08/10/2006 | DE102006005955A1 Inline memory module architecture, has two arrays of memory devices located on respective sides of printed circuit board, where devices of one array are arranged to overlap relative to reference axis of circuit board |
| 08/10/2006 | DE102006004788A1 Halbleiterbauelement und Fertigungsverfahren für dieses Semiconductor device and manufacturing method thereof |
| 08/10/2006 | DE102005004777A1 Kühler Cooler |
| 08/10/2006 | DE102005004599A1 Measuring object measurement method for manufacturing plant for semiconductor wafer, involves scanning target object in intensity profile and determining parameter as measurement result, where one of the results is stored in processing unit |
| 08/10/2006 | DE102005004384A1 Verfahren zur Herstellung einer definierten Vertiefung in einer Damaszener-Struktur unter Verwendung eines CMP Prozesses und eine Damaszener-Struktur A process for producing a defined recess in a damascene structure using a CMP process and a damascene structure |
| 08/10/2006 | DE102005004365A1 Conducting structure manufacturing method for integrated circuit arrangement, involves superimposing nucleation layer at base surface or cover surface before or after creation of through-hole, and depositing structure material in hole |
| 08/10/2006 | DE102005004160A1 Semiconductor component e.g. transistor, has electroplating area extending from circuit contact port on lateral surfaces, and insulation layer arranged between area and body comprising opening for connection of port with area |
| 08/10/2006 | DE102004055040B4 Verfahren zum Schneiden eines Laminats mit einem Laser und Laminat A method of cutting a laminate with a laser and laminate |
| 08/09/2006 | WO2006093078A1 Surface acoustic wave device |
| 08/09/2006 | EP1688998A2 Photoelectric conversion apparatus and image sensor |
| 08/09/2006 | EP1688997A1 Electronic component with stacked semiconductor chips and method for its manufacture |
| 08/09/2006 | EP1688996A2 Semiconductor integrated device and method of providing shield interconnection therein |
| 08/09/2006 | EP1688995A1 Interposer for decoupling integrated circuits on a circuit board |
| 08/09/2006 | EP1688994A1 Wafer level packaging cap and fabrication method thereof |
| 08/09/2006 | EP1688993A2 Standardized bonding location process and apparatus |
| 08/09/2006 | EP1688810A1 Circuit substrate manufacturing method and system, substrate used for the same, and circuit substrate using the same |
| 08/09/2006 | EP1688025A1 Flat plate heat transfer device |
| 08/09/2006 | EP1688022A1 Electric circuit arrangement |
| 08/09/2006 | EP1687878A1 Heat sink for a pulsed laser diode bar with optimized thermal time constant |
| 08/09/2006 | EP1687866A1 Fabrication of ltcc t/r modules wih multiple cavities and an integrated ceramic ring frame |
| 08/09/2006 | EP1687851A2 Structure and programming of laser fuse |
| 08/09/2006 | EP1687850A2 Crack stop for low k dielectrics |
| 08/09/2006 | EP1687846A1 Method for galvanising and forming a contact boss |
| 08/09/2006 | EP1687845A2 Device having compliant electrical interconnects and compliant sealing element |
| 08/09/2006 | EP1687840A1 Mim capacitor structure and method of fabrication |
| 08/09/2006 | EP1687837A2 High temperature electronic devices |
| 08/09/2006 | EP1273609B1 Resin compound for forming interlayer insulating layer of printed wiring board, resin sheet and copper foil with resin for forming insulating layer using the resin compound, and copper-clad laminate using them |
| 08/09/2006 | EP1195079B1 An arrangement for mounting chips in multilayer printed circuit boards |
| 08/09/2006 | EP0977797B1 Organohydridosiloxane resins with high organic content |
| 08/09/2006 | EP0951739B1 High density electrical connectors |
| 08/09/2006 | CN2805319Y Double-finned duct heater radiator |
| 08/09/2006 | CN2805318Y 散热器 Heat sink |
| 08/09/2006 | CN2805317Y Electronic device with radiation shell |
| 08/09/2006 | CN2805316Y Heat sink with cool and heat exchange function |
| 08/09/2006 | CN2805101Y LED structure with broad application |
| 08/09/2006 | CN2805093Y Electrostatic discharging protection circuit |
| 08/09/2006 | CN2805092Y Improved structure for conducting wire erectin belt |
| 08/09/2006 | CN2805091Y Packaging structure for integrated-circuit or separated members plane convex point type packge |
| 08/09/2006 | CN2805090Y Liquid-cooling type heat radiation device |
| 08/09/2006 | CN2805089Y 热管基座 Heat pipe base |
| 08/09/2006 | CN2805088Y Heat radiation device |
| 08/09/2006 | CN2805087Y Radiating scale type radiator |
| 08/09/2006 | CN2805086Y Improved structure of radiator scales |
| 08/09/2006 | CN2805085Y Improved structure of heat conducting tube type radiator |
| 08/09/2006 | CN2805084Y Improved structure of heat conducting tube type radiator |
| 08/09/2006 | CN2805083Y Improvement of radiation plate structure of radiator |
| 08/09/2006 | CN2805082Y Package carrying plate for integrated circuit |
| 08/09/2006 | CN1816948A Prefabricated and attached interconnect structure |
| 08/09/2006 | CN1816918A Light-emitting diode thermal management system |
| 08/09/2006 | CN1816911A Electronic power module comprising a rubber seal and corresponding production method |
| 08/09/2006 | CN1816904A Mold compound cap in a flip chip multi-matrix array package and process of making same |
| 08/09/2006 | CN1816817A Flexible semiconductor device and identification label |
| 08/09/2006 | CN1816607A Silicon composition which can be crosslinked into an adhesive gel |
| 08/09/2006 | CN1816504A High thermal conductivite element, method for manufacturing same, and heat radiating system |
| 08/09/2006 | CN1816244A Circuit board using for reducing signal crosstalk |
| 08/09/2006 | CN1815767A Lead frame for electrical source luminescent diode and manufacturing method thereof |
| 08/09/2006 | CN1815764A Baseboard structure of luminous diode module |
| 08/09/2006 | CN1815733A Semiconductor device and manufacturing method therefor |
| 08/09/2006 | CN1815730A Devices comprising a power core and methods of making thereof |
| 08/09/2006 | CN1815729A Electric fuse structure |
| 08/09/2006 | CN1815728A Semiconductor device, and method for manufacturing the same |
| 08/09/2006 | CN1815727A Wire loop, semiconductor device having same and wire bonding method |
| 08/09/2006 | CN1815726A Circuit board and manufacturing method therefor and semiconductor package and manufacturing method therefor |
| 08/09/2006 | CN1815725A Trace design to minimize electromigration damage to solder bumps |
| 08/09/2006 | CN1815724A Routing design to minimize electromigration damage to solder bumps |
| 08/09/2006 | CN1815723A Semiconductor integrated circuit and method of manufacturing the same |
| 08/09/2006 | CN1815722A Low power multi-chip semiconductor memory device and chip enable method thereof |