| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/15/2006 | US7091597 Power supply device |
| 08/15/2006 | US7091596 Semiconductor packages and leadframe assemblies |
| 08/15/2006 | US7091595 Semiconductor device with semiconductor chip and rewiring layer and method for producing the same |
| 08/15/2006 | US7091594 Leadframe type semiconductor package having reduced inductance and its manufacturing method |
| 08/15/2006 | US7091593 Circuit board with built-in electronic component and method for manufacturing the same |
| 08/15/2006 | US7091592 Stacked package for electronic elements and packaging method thereof |
| 08/15/2006 | US7091591 Semiconductor device |
| 08/15/2006 | US7091590 Multiple stacked-chip packaging structure |
| 08/15/2006 | US7091589 Multilayer wiring board and manufacture method thereof |
| 08/15/2006 | US7091588 Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation |
| 08/15/2006 | US7091587 Semiconductor device |
| 08/15/2006 | US7091586 Detachable on package voltage regulation module |
| 08/15/2006 | US7091585 Process for manufacturing semiconductor device |
| 08/15/2006 | US7091584 Semiconductor package assembly and method for electrically isolating modules |
| 08/15/2006 | US7091583 Method and structure for prevention leakage of substrate strip |
| 08/15/2006 | US7091582 Electronic package with snap-on perimeter wall |
| 08/15/2006 | US7091581 Integrated circuit package and process for fabricating the same |
| 08/15/2006 | US7091580 Semiconductor device |
| 08/15/2006 | US7091576 Inductor for semiconductor integrated circuit and method of fabricating the same |
| 08/15/2006 | US7091574 Voltage island circuit placement |
| 08/15/2006 | US7091564 Semiconductor chip with fuse unit |
| 08/15/2006 | US7091554 Semiconductor device |
| 08/15/2006 | US7091520 Method of manufacturing semiconductor device having conductive thin films |
| 08/15/2006 | US7091518 Semiconductor device |
| 08/15/2006 | US7091165 Composition and method for removing copper-compatible resist |
| 08/15/2006 | US7091133 Two-step formation of etch stop layer |
| 08/15/2006 | US7091128 Method for avoiding oxide undercut during pre-silicide clean for thin spacer FETs |
| 08/15/2006 | US7091124 Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices |
| 08/15/2006 | US7091122 Semiconductor device and method of manufacturing the same |
| 08/15/2006 | US7091121 Bumping process |
| 08/15/2006 | US7091108 Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices |
| 08/15/2006 | US7091067 Current limiting antifuse programming path |
| 08/15/2006 | US7091066 Method of making circuitized substrate |
| 08/15/2006 | US7091065 Method of making a center bond flip chip semiconductor carrier |
| 08/15/2006 | US7091064 Method and apparatus for attaching microelectronic substrates and support members |
| 08/15/2006 | US7091063 Electronic assembly comprising solderable thermal interface and methods of manufacture |
| 08/15/2006 | US7091062 Wafer level packages for chips with sawn edge protection |
| 08/15/2006 | US7091061 Method of forming a stack of packaged memory dice |
| 08/15/2006 | US7091060 Circuit and substrate encapsulation methods |
| 08/15/2006 | US7090896 Thermally treating a sol-gel product of a multifunctional carbosilane |
| 08/15/2006 | US7090895 Epoxy resin encapsulated semiconductor resin and foaming agent for halogen free polymer |
| 08/15/2006 | US7090482 Semiconductor device package manufacturing method and semiconductor device package manufactured by the method |
| 08/15/2006 | US7090413 Optical semiconductor device |
| 08/15/2006 | US7090044 Electrical apparatus, cooling system therefor, and electric vehicle |
| 08/15/2006 | US7090001 Optimized multiple heat pipe blocks for electronics cooling |
| 08/15/2006 | US7089984 Forming folded-stack packaged device using progressive folding tool |
| 08/15/2006 | CA2256982C Nickel ultrafine powder |
| 08/15/2006 | CA2211540C Conductive via fill inks for ceramic multilayer circuit boards on support substrates |
| 08/14/2006 | CA2531632A1 Led assembly with led position template and method of making an led assembly using led position template |
| 08/10/2006 | WO2006084250A2 A subthreshold design methodology for ultra-low power systems |
| 08/10/2006 | WO2006084177A2 Nested integrated circuit package on package system |
| 08/10/2006 | WO2006084028A2 Interdiffusion bonded stacked die device |
| 08/10/2006 | WO2006083110A1 Side view type led package |
| 08/10/2006 | WO2006083025A1 Optical semiconductor, sealing material therefor and sealing composition |
| 08/10/2006 | WO2006082903A1 Resin compositions, cured article obtained therefrom, and sheet |
| 08/10/2006 | WO2006082838A1 Multilayer wiring board, method for manufacturing such multilayer wiring board, and semiconductor device and electronic device using multilayer wiring board |
| 08/10/2006 | WO2006082770A1 Ceramic wiring board and process for producing the same, and semiconductor device using the same |
| 08/10/2006 | WO2006082756A1 Semiconductor device, and method and apparatus for manufacturing same |
| 08/10/2006 | WO2006082633A1 Module mounted with package |
| 08/10/2006 | WO2006081977A1 Cooler |
| 08/10/2006 | WO2006066964A3 An electronic device, a chip containing method and a contacting device |
| 08/10/2006 | WO2006065378A3 Flip chip and wire bond semiconductor package |
| 08/10/2006 | WO2006042029A3 Structure and method of making interconnect element having metal traces embedded in surface of dielectric |
| 08/10/2006 | WO2006039632A3 Gate stacks |
| 08/10/2006 | WO2006017224A3 Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package |
| 08/10/2006 | WO2006008315A3 A heat-sink structure for electronic devices and the like |
| 08/10/2006 | WO2005114737A3 Illuminable gaas switching component with a transparent housing, and microwave circuit therewith |
| 08/10/2006 | WO2005050777A3 Receiver electronics proximate antenna |
| 08/10/2006 | US20060179490 Method and device for protection of an mram device against tampering |
| 08/10/2006 | US20060177994 Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices |
| 08/10/2006 | US20060177990 Methods for selective integration of airgaps and devices made by such methods |
| 08/10/2006 | US20060177969 Method for interconnecting semiconductor components with substrates and contact means |
| 08/10/2006 | US20060177968 Method for fabricating semiconductor packages with semiconductor chips |
| 08/10/2006 | US20060177965 Semiconductor device and process for producing the same |
| 08/10/2006 | US20060177964 Semiconductor module and method for producing a semiconductor module |
| 08/10/2006 | US20060177963 Process for producing copy protection for an electronic circuit |
| 08/10/2006 | US20060176668 Heat Sink Fan and Method for Manufacturing Heat Sink That Is Used for the Heat Sink Fan |
| 08/10/2006 | US20060176415 Display device and method for repairing line disconnection thereof |
| 08/10/2006 | US20060176181 Radio frequency indentification device resistant to humid environments and its manufacturing method |
| 08/10/2006 | US20060176101 Semiconductor integrated circuit |
| 08/10/2006 | US20060175718 Semiconductor device and method of manufacturing the same |
| 08/10/2006 | US20060175717 Semiconductor device and method of making the same |
| 08/10/2006 | US20060175716 Molded package and semiconductor device using molded package |
| 08/10/2006 | US20060175715 Semiconductor device and capsule type semiconductor package |
| 08/10/2006 | US20060175714 Semiconductor device |
| 08/10/2006 | US20060175713 Liquid crystal display panel |
| 08/10/2006 | US20060175711 Structure and method for bonding an IC chip |
| 08/10/2006 | US20060175710 Consolidated flip chip BGA assembly process and apparatus |
| 08/10/2006 | US20060175709 Integrated circuits and interconnect structure for integrated circuits |
| 08/10/2006 | US20060175708 Semiconductor device and method of manufacturing the same |
| 08/10/2006 | US20060175707 Wafer level packaging cap and fabrication method thereof |
| 08/10/2006 | US20060175706 TFT array panel and fabricating method thereof |
| 08/10/2006 | US20060175705 Semiconductor device and method for fabricating the same |
| 08/10/2006 | US20060175704 Current collecting structure and electrode structure |
| 08/10/2006 | US20060175703 Thermally responsive pressure relief plug and method of making the same |
| 08/10/2006 | US20060175702 Ball grid array package |
| 08/10/2006 | US20060175701 Dissociated fabrication of packages and chips of integrated circuits |
| 08/10/2006 | US20060175700 Semiconductor device and method of manufacturing the same |
| 08/10/2006 | US20060175699 Interposers with flexible solder pad elements |
| 08/10/2006 | US20060175698 Semiconductor device |