Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2006
08/16/2006CN1819235A CMOS image sensor and method for fabricating the same
08/16/2006CN1819217A Active matrix substrate and its manufacturing method
08/16/2006CN1819199A Semiconductor product with semiconductor substrate and testing structure and method
08/16/2006CN1819193A Universal light-emitting diodes and light thereof
08/16/2006CN1819192A 半导体器件以及半导体封装 Semiconductor device and semiconductor package
08/16/2006CN1819190A 半导体器件 Semiconductor devices
08/16/2006CN1819189A Method for manufacturing circuit device
08/16/2006CN1819188A Semiconductor device
08/16/2006CN1819187A Semiconductor device and capsule type semiconductor package
08/16/2006CN1819186A Semiconductor device
08/16/2006CN1819185A Die module system and method
08/16/2006CN1819184A Devices comprising a power core and methods of making thereof
08/16/2006CN1819183A Esd protection for high voltage applications
08/16/2006CN1819182A Structure and method for accurate deep trench resistance measurement
08/16/2006CN1819181A Semiconductor device and method for fabricating the same
08/16/2006CN1819180A Dielectric materialand method to make the same
08/16/2006CN1819179A Semiconductor device and method of manufacturing the same
08/16/2006CN1819178A Semiconductor device and method for production thereof
08/16/2006CN1819177A Metal interconnection of semiconductor device and forming method
08/16/2006CN1819176A Interconnecting substrate and semiconductor device
08/16/2006CN1819175A Surface installing emitting led
08/16/2006CN1819174A Wiring board and capacitor to be built into wiring board
08/16/2006CN1819173A 半导体器件 Semiconductor devices
08/16/2006CN1819172A Semiconductor device and manufacturing method therefor
08/16/2006CN1819171A Signal transfer film, display apparatus having the same and method of manufacturing the same
08/16/2006CN1819170A Packed module with positioning structure, electronic device and inspection after assembly
08/16/2006CN1819169A Electronic component, electro-optical device, and electronic apparatus
08/16/2006CN1819168A Semiconductor device and manufacturing process therefor
08/16/2006CN1819167A On-chip circuit pad structure and method of manufacture
08/16/2006CN1819166A Package structure
08/16/2006CN1819165A Techniques for microchannel cooling
08/16/2006CN1819164A Radiator for semiconductor
08/16/2006CN1819163A Insulating sheet and method for producing it, and power module comprising the insulating sheet
08/16/2006CN1819162A Chip-style radiating module and radiating method thereof
08/16/2006CN1819161A Semiconductor device and manufacturing method thereof
08/16/2006CN1819160A A substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same
08/16/2006CN1819159A Semiconductor wafer, semiconductor device manufacturing method, and semiconductor device
08/16/2006CN1819158A 半导体器件 Semiconductor devices
08/16/2006CN1819157A 半导体器件 Semiconductor devices
08/16/2006CN1819141A Method for designing semiconductor device and method for evaluating reliability thereof
08/16/2006CN1819131A Method for producing a module including an integrated circuit on a substrate and an integrated module manufactured thereby
08/16/2006CN1819130A Semiconductor device manufacturing method, semiconductor device, laminated semiconductor device, circuit substrate, and electronic apparatus
08/16/2006CN1819124A Semiconductor device and fabrication method thereof
08/16/2006CN1819111A Semiconductor device fabrication method and semiconductor device fabrication device
08/16/2006CN1270403C Circuit board device and its manufacturing method
08/16/2006CN1270386C Semiconductor device and its manufacturing method
08/16/2006CN1270381C Current compensation circuit for light leakage and light signal circuit using said circuit
08/16/2006CN1270380C Semiconductor device and its manufacturing method
08/16/2006CN1270378C Semiconductor arrangement and producing method thereof
08/16/2006CN1270377C Low-impedance olecoupling device
08/16/2006CN1270376C Method for connecting down-lead of lead frame or components to contact welding disk of substrate
08/16/2006CN1270375C Connection method between integrated circuit chip and circuit substrate and application thereof
08/16/2006CN1270374C Encapsulated microelectronic devices
08/16/2006CN1270364C Semiconductor device and making method
08/16/2006CN1270363C Manufacturing method for electronic component module and electromagnetically readable data carrier
08/16/2006CN1270272C IC card
08/15/2006US7093222 Power supply wiring method for semiconductor integrated circuit and semiconductor integrated circuit
08/15/2006US7093210 Method of manufacturing circuit device using a communication network
08/15/2006US7093209 Method and apparatus for packaging test integrated circuits
08/15/2006US7092890 Method for manufacturing thin GaAs die with copper-back metal structures
08/15/2006US7092838 Method and apparatus for the analysis and optimization of variability in nanometer technologies
08/15/2006US7092639 EMI shield for reducing clock jitter of a transceiver
08/15/2006US7092424 Integrated arrays of modulators and lasers on electronics
08/15/2006US7092418 Compact laser package with integrated temperature control
08/15/2006US7092306 Semiconductor device capable of adjusting operation timing using antifuse
08/15/2006US7092255 Thermal management system and method for electronic equipment mounted on coldplates
08/15/2006US7092252 Air-directing unit
08/15/2006US7092234 DRAM cells and electronic systems
08/15/2006US7092227 Electrostatic discharge protection circuit with active device
08/15/2006US7092047 Thin film transistor substrate for liquid crystal display panel and manufacturing method thereof
08/15/2006US7092043 Fully integrated tuner architecture
08/15/2006US7091820 Methods for manufacturing resistors using a sacrificial layer
08/15/2006US7091814 On-chip differential multi-layer inductor
08/15/2006US7091716 Multilayer wiring board, manufacturing method therefor and test apparatus thereof
08/15/2006US7091624 Semiconductor device obtained by dividing semiconductor wafer by use of laser dicing technique and method of manufacturing the same
08/15/2006US7091623 Multi-chip semiconductor package and fabrication method thereof
08/15/2006US7091622 Semiconductor device, ball grid array connection system, and method of making
08/15/2006US7091621 Crack resistant scribe line monitor structure and method for making the same
08/15/2006US7091620 Semiconductor device and manufacturing method thereof
08/15/2006US7091619 Semiconductor device, semiconductor package, electronic device, electronic apparatus, and manufacturing methods of semiconductor device and electronic device
08/15/2006US7091618 Semiconductor device and method of manufacturing the same
08/15/2006US7091616 Semiconductor device having a leading wiring layer
08/15/2006US7091615 Concentration graded carbon doped oxide
08/15/2006US7091614 Integrated circuit design for routing an electrical connection
08/15/2006US7091613 Elongated bonding pad for wire bonding and sort probing
08/15/2006US7091612 Dual damascene structure and method
08/15/2006US7091611 Multilevel copper interconnects with low-k dielectrics and air gaps
08/15/2006US7091610 Self-aligned contacts to gates
08/15/2006US7091609 Semiconductor devices including an alloy layer and a wetting layer on an interlayer dielectric
08/15/2006US7091608 Chip package
08/15/2006US7091607 Semiconductor package
08/15/2006US7091606 Circuit device and manufacturing method of circuit device and semiconductor module
08/15/2006US7091605 To prevent premature device failure or premature degradation of device performance
08/15/2006US7091604 Three dimensional integrated circuits
08/15/2006US7091603 Semiconductor device
08/15/2006US7091602 Miniature moldlocks for heatsink or flag for an overmolded plastic package
08/15/2006US7091601 Method of fabricating an apparatus including a sealed cavity
08/15/2006US7091600 Prevention of post CMP defects in CU/FSG process
08/15/2006US7091599 Solid-state imaging device
08/15/2006US7091598 Electronic circuit device