| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/17/2006 | US20060180926 Heat spreader clamping mechanism for semiconductor modules |
| 08/17/2006 | US20060180925 LED housing and fabrication method thereof |
| 08/17/2006 | US20060180924 Apparatus and methods for cooling semiconductor integrated circuit chip packages |
| 08/17/2006 | US20060180923 Heat sink |
| 08/17/2006 | US20060180922 Dielectric material |
| 08/17/2006 | US20060180921 Method for producing an FBGA component and substrate for carrying out the method |
| 08/17/2006 | US20060180920 Semiconductor device and manufacturing method thereof |
| 08/17/2006 | US20060180919 Fine pitch low cost flip chip substrate |
| 08/17/2006 | US20060180918 Semiconductor device and method of manufacturing the same |
| 08/17/2006 | US20060180917 Circuit board for reducing crosstalk of signals |
| 08/17/2006 | US20060180916 Ground arch for wirebond ball grid arrays |
| 08/17/2006 | US20060180915 Semiconductor package using terminals formed on a conductive layer of a circuit board |
| 08/17/2006 | US20060180914 Stacked die package system |
| 08/17/2006 | US20060180913 Input stage of semiconductor device with multiple pads of common function, and multi-chip package having the same |
| 08/17/2006 | US20060180912 Stacked ball grid array package module utilizing one or more interposer layers |
| 08/17/2006 | US20060180911 Stacked integrated circuit and package system |
| 08/17/2006 | US20060180910 Three-dimensional circuit module and method of manufacturing the same |
| 08/17/2006 | US20060180909 Optical device package |
| 08/17/2006 | US20060180908 Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same |
| 08/17/2006 | US20060180907 Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectonic devices |
| 08/17/2006 | US20060180906 Chip package and producing method thereof |
| 08/17/2006 | US20060180905 IC package with signal land pads |
| 08/17/2006 | US20060180904 Non-leaded integrated circuit package system |
| 08/17/2006 | US20060180903 Semiconductor device and process for fabrication thereof |
| 08/17/2006 | US20060180902 Semiconductor package with low and high-speed signal paths |
| 08/17/2006 | US20060180901 Method and apparatus for increasing the immunity of new generation microprocessors from ESD events |
| 08/17/2006 | US20060180900 Organo-silsesquioxane polymers for forming low-k dielectrics |
| 08/17/2006 | US20060180899 Semiconductive chip device having insulating coating layer and method of manfacturing the same |
| 08/17/2006 | US20060180891 Semiconductor storage device, semiconductor device, and manufacturing method therefor |
| 08/17/2006 | US20060180868 Structure and method for improved diode ideality |
| 08/17/2006 | US20060180865 Semiconductor device |
| 08/17/2006 | US20060180864 Semiconductor device |
| 08/17/2006 | US20060180863 Novel implantation method to improve ESD robustness of thick gate-oxide grounded-gate NMOSFET's in deep-submicron CMOS technologies |
| 08/17/2006 | US20060180825 IC chip coating material and vacuum fluorescent display device using same |
| 08/17/2006 | US20060180821 Light-emitting diode thermal management system |
| 08/17/2006 | US20060180808 Organic semiconductor element having multi protection layers and process of making the same |
| 08/17/2006 | US20060180752 Stacked-plate gas-expansion cooler assembly, fabrication method, and use |
| 08/17/2006 | US20060180595 Method and system for transferring dies between surfaces |
| 08/17/2006 | US20060180580 High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby |
| 08/17/2006 | US20060180461 Stable electroless fine pitch interconnect plating |
| 08/17/2006 | US20060180345 Perimeter matrix ball grid array circuit package with a populated center |
| 08/17/2006 | US20060180344 Multilayer printed wiring board and process for producing the same |
| 08/17/2006 | US20060180341 Multilayer printed wiring board and method of manufacturing the same |
| 08/17/2006 | US20060179916 Frequency characteristics measuring method and device for acceleration sensor |
| 08/17/2006 | DE20321253U1 Fuse unit for hardware circuits or modules in electronic circuits whereby an attempt to rmove the fuse unit from the circuit board causes a break in a contact |
| 08/17/2006 | DE202006008850U1 LED assembled lamps has optical aid through which rays from all lamps are diverted in two different directions onto desired optical axis, thus relatively low light intensity is visible on optical axis of lamp |
| 08/17/2006 | DE19639181B4 Mikroelektronisches Bauelement mit einem Zuleitungsrahmen und einem integrierten Schaltkreis Microelectronic component with a lead frame and an integrated circuit |
| 08/17/2006 | DE112004002071T5 Kühlvorrichtung und elektronische Vorrichtung Cooling device and electronic device |
| 08/17/2006 | DE112004001783T5 Thermisches Kopplungsmaterial mit ausgerichteten Kohlenstoffnanoröhrchen Thermal interface material with aligned carbon nanotubes |
| 08/17/2006 | DE102006005674A1 Anti fuse circuit for forming internal connections has gate electrode and field control unit to apply separate electrical fields to two transition regions |
| 08/17/2006 | DE102006004015A1 Isolierender Flächenkörper und Verfahren zu seiner Herstellung und den Isolierenden Flächenkörper aufweisendes Leistungsmodul Insulating sheet and method for its preparation and the insulating sheet exhibiting power module |
| 08/17/2006 | DE102005054353A1 Electronic component, especially multi chip as in ball grid array, has one chip above another with spacers between them and bond wire to inner conductive surface of lower chip |
| 08/17/2006 | DE102005007041A1 Kühlkörper für Halbleiterbauelemente oder dgl. Einrichtungen sowie Verfahren zu dessen Herstellung Heat sink for semiconductor devices or the like. Facilities and process for its preparation |
| 08/17/2006 | DE102005005985A1 Integrated circuit arrangement has metal layers reading of two bit values and to set identification bit by metal programming, and exclusive-or-circuit inputs with output for reading of circuit-bit value to set or provide bit |
| 08/17/2006 | DE102005005749A1 Semiconductor component for mobile device, has external contacts connecting surfaces with recess in its middle area, where recess has dovetail profile, and surface extension of recess is smaller than maximum cross section of contacts |
| 08/17/2006 | DE102005005622A1 Safety-semiconductor chip stack, has connecting units provided in chips to provide mechanical connection between chips, where units and functional layers are made from copper, and units stand in direct contact with layers |
| 08/17/2006 | DE102005004108A1 Semiconductor circuit, for dynamic semiconductor memory, has enamel unit and photo unit, where connections of enamel and photo unit are connected in series and current flowing through series connection is determined |
| 08/17/2006 | DE102004062214B4 Halbleitervorrichtung mit Temperaturerfassungsfunktion A semiconductor device comprising temperature detection function |
| 08/17/2006 | DE102004059506B3 Anordnung zum Test von eingebetteten Schaltungen mit Hilfe einer separaten Versorgungsspannung An arrangement for embedded test circuits by means of a separate supply voltage |
| 08/17/2006 | DE102004058411B3 Halbleiterwafer mit einer Teststruktur und Verfahren Semiconductor wafer having a test structure and method |
| 08/17/2006 | DE10133959B4 Elektronisches Bauteil mit Halbleiterchip Electronic component with semiconductor chip |
| 08/17/2006 | DE10110151B4 Verdrahtungssubstrat, Verfahren zum Herstellen desselben und elektronische Vorrichtung, die dasselbe verwendet Wiring substrate, process for producing the same and electronic apparatus using the same |
| 08/17/2006 | DE10024377B4 Gehäuseeinrichtung und darin zu verwendendes Kontaktelement Housing means and to be used in contact element |
| 08/17/2006 | CA2597289A1 Method of manufacturing a hermetic chamber with electrical feedthroughs |
| 08/16/2006 | EP1691595A2 Blower control unit for a vehicle |
| 08/16/2006 | EP1691414A2 Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same |
| 08/16/2006 | EP1691413A1 Tamper-resistant electronic component |
| 08/16/2006 | EP1691412A2 Semiconductor heatsink and process for producing the same |
| 08/16/2006 | EP1691411A2 Circuit member for semiconductor device, semiconductor device using the same, and process for producing said circuit member and said semiconductor device |
| 08/16/2006 | EP1691206A2 Method and apparatus for testing semiconductor dice |
| 08/16/2006 | EP1691202A1 Vibration piezoelectric acceleration sensor |
| 08/16/2006 | EP1690293A1 Single substrate hydrogen and microwave absorber for integrated microwave assembly and method of manufacturing same |
| 08/16/2006 | EP1689554A2 Laser-based system for memory link processing with picosecond lasers |
| 08/16/2006 | EP1623463A4 Mram architecture with a bit line located underneath the magnetic tunneling junction device |
| 08/16/2006 | EP1301827B1 Photolithographically-patterned out-of-plane coil structures and method of making |
| 08/16/2006 | EP0946980B1 Improved integrated circuit structures and methods to facilitate accurate measurement of the ic devices |
| 08/16/2006 | CN2807481Y Mixing type photoelectric accumulating body package structure |
| 08/16/2006 | CN2807480Y Radiating module |
| 08/16/2006 | CN2807479Y Vertical polyhedral radiator of semiconductor device |
| 08/16/2006 | CN2807478Y Radiation structure of micro computer |
| 08/16/2006 | CN2807477Y Package carrying plate for integrated circuit |
| 08/16/2006 | CN2807476Y Glue overflow preventing construction of package carrying plate used for integrated circuit |
| 08/16/2006 | CN1820560A Tower heat sink with sintered grooved wick |
| 08/16/2006 | CN1820395A Pressure contact spring for contact arrangement in power semiconductor module |
| 08/16/2006 | CN1820371A Encapsulation structure for display devices |
| 08/16/2006 | CN1820369A Security-sensitive semiconductor product, particularly a smart-card chip |
| 08/16/2006 | CN1820368A Lead frame and manufacture thereof |
| 08/16/2006 | CN1820367A Surface mount multichip devices |
| 08/16/2006 | CN1820366A Cooling apparatus of electric device |
| 08/16/2006 | CN1820360A Manufacture of semiconductor device |
| 08/16/2006 | CN1820359A Planar magnetic tunnel junction substrate having recessed alignment marks |
| 08/16/2006 | CN1820328A Insulated conductive ball for anisotropic conductive connection, method of preparing the same, and product using the same |
| 08/16/2006 | CN1820230A Method for etching patterned silicone layer |
| 08/16/2006 | CN1819968A Methods and apparatus for attaching a die to a substrate |
| 08/16/2006 | CN1819754A Flat hot pipe radiator |
| 08/16/2006 | CN1819289A Light-emitting diode apparatus |
| 08/16/2006 | CN1819268A Semiconductor device and method for manufacturing the same, and electric device |
| 08/16/2006 | CN1819259A Package for gallium nitride semiconductor devices |
| 08/16/2006 | CN1819257A Organic electroluminescent device and method for manufacturing the same |
| 08/16/2006 | CN1819236A Method for fabricating vertical CMOS image sensor |