H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2006
08/22/2006	US7095117 Semiconductor device and an electronic device
08/22/2006	US7095115 Circuit substrates, semiconductor packages, and ball grid arrays
08/22/2006	US7095114 Semiconductor device with via hole group generating high frequency electromagnetic bonding, manufacturing method thereof, and monolithic microwave integrated circuit
08/22/2006	US7095113 Semiconductor device with interlocking clip
08/22/2006	US7095112 Semiconductor device, semiconductor package member, and semiconductor device manufacturing method
08/22/2006	US7095111 Package with integrated wick layer and method for heat removal
08/22/2006	US7095110 Light emitting diode apparatuses with heat pipes for thermal management
08/22/2006	US7095109 Optical fiber terminator package
08/22/2006	US7095108 Array capacitors in interposers, and methods of using same
08/22/2006	US7095107 Ball assignment schemes for integrated circuit packages
08/22/2006	US7095106 Collars, support structures, and forms for protruding conductive structures
08/22/2006	US7095105 Vertically stacked semiconductor device
08/22/2006	US7095104 Overlap stacking of center bus bonded memory chips for double density and method of manufacturing the same
08/22/2006	US7095103 Leadframe based memory card
08/22/2006	US7095102 Pad rearrangement substrate
08/22/2006	US7095101 Supporting frame for surface-mount diode package
08/22/2006	US7095100 Semiconductor device and method of making the same
08/22/2006	US7095099 Low profile package having multiple die
08/22/2006	US7095098 Electrically isolated and thermally conductive double-sided pre-packaged component
08/22/2006	US7095097 Integrated circuit device having reduced bow and method for making same
08/22/2006	US7095096 Microarray lead frame
08/22/2006	US7095095 Semiconductor constructions
08/22/2006	US7095080 RF power LDMOS transistor with multiple gate fingers
08/22/2006	US7095072 Semiconductor device with wiring layers forming a capacitor
08/22/2006	US7095068 Semiconductor memory device having ferroelectric capacitor and method of manufacturing the same
08/22/2006	US7095048 Semiconductor device, electronic circuit array substrate provided with the same and method of manufacturing the electronic circuit array substrate
08/22/2006	US7095045 Semiconductor device and manufacturing method thereof
08/22/2006	US7094966 Packaging integrated circuits with adhesive posts
08/22/2006	US7094844 Waterproof, heat resistance, shockproof; undercoating for semiconductor, flip chips
08/22/2006	US7094710 Very low dielectric constant plasma-enhanced CVD films
08/22/2006	US7094707 Method of forming nitrided oxide in a hot wall single wafer furnace
08/22/2006	US7094692 Semiconductor device and method of manufacturing the same
08/22/2006	US7094681 Semiconductor device fabrication method
08/22/2006	US7094677 Method of forming a penetration electrode and substrate having a penetration electrode
08/22/2006	US7094663 Semiconductor device and method of manufacturing the same
08/22/2006	US7094662 Overlay mark and method of fabricating the same
08/22/2006	US7094636 Method of forming a conductive line
08/22/2006	US7094633 Method for efficiently producing removable peripheral cards
08/22/2006	US7094632 Low profile chip scale stacking system and method
08/22/2006	US7094630 Method of fabricating semiconductor device having a chip, reinforcing plate, and sealing material sharing a common rear surface
08/22/2006	US7094629 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
08/22/2006	US7094628 Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling microelectronic devices
08/22/2006	US7094618 Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape
08/22/2006	US7094459 Method for cooling electronic components and thermally conductive sheet for use therewith
08/22/2006	US7094370 Method for the production of metal-carbon composite powders
08/22/2006	US7094074 Manufacturing methods for ultra-slim USB flash-memory card with supporting dividers or underside ribs
08/22/2006	US7094062 Land grid array connector
08/22/2006	US7094046 Mold assembly for a package stack via bottom-leaded plastic (BLP) packaging
08/22/2006	US7093647 Ebullition cooling device for heat generating component
08/22/2006	US7093356 Method for producing wiring substrate
08/17/2006	WO2006086738A1 Heat sink having directive heat elements
08/17/2006	WO2006086337A1 A low temperature method for fabricating high-aspect ratio vias and devices fabricated by said method
08/17/2006	WO2006086297A1 Foil slot impingement cooler with effective light-trap cavities
08/17/2006	WO2006086244A2 Carbonaceous composite heat spreader and associated methods
08/17/2006	WO2006086151A2 Consolidated flip chip bga assembly process and apparatus
08/17/2006	WO2006085993A2 Device and method for achieving enhanced field emission utilizing nanostructures grown on a conductive substrate
08/17/2006	WO2006085825A1 A packaging method for mems devices, and mems packages produced using the method
08/17/2006	WO2006085637A1 Semiconductor device and manufacturing method thereof
08/17/2006	WO2006085363A1 Semiconductor apparatus and electronic circuit
08/17/2006	WO2006085189A1 Optical data transceivers
08/17/2006	WO2006084525A1 Adhesive strip conductor on an insulating layer
08/17/2006	WO2006084509A1 Economical assembly and connection technique by means of a printing method
08/17/2006	WO2006084349A1 High performance ic package and method
08/17/2006	WO2006072109A3 Systems for low cost liquid cooling
08/17/2006	WO2006058860A3 Heat exchange device for a semiconductor component and method for producing said heat exchange device
08/17/2006	WO2006050449A9 Low cost power mosfet with current monitoring
08/17/2006	WO2005122706A3 Method of aligning semiconductor device and semiconductor structure thereof
08/17/2006	US20060183349 Semiconductor component having thinned die with polymer layers
08/17/2006	US20060183331 Methods for patterning dielectric material, and methods for aligning semiconductor fabrication molds and semiconductor substrates
08/17/2006	US20060183324 Semiconductor device and method for producing the same
08/17/2006	US20060183313 Semiconductor package and method for manufacturing the same
08/17/2006	US20060183306 Method for producing an electronic component with shielding
08/17/2006	US20060183299 Electronic device sealed under vacuum containing a getter and method of operation
08/17/2006	US20060183298 Method for manufacturing a ceramic/metal substrate
08/17/2006	US20060183269 Method for producing a semiconductor component with a plastic housing and carrier plate for performing the method
08/17/2006	US20060183259 Method of forming a wear-resistant dielectric layer
08/17/2006	US20060181854 Patterned structure, method of making and use
08/17/2006	US20060181339 Semiconductor device with resistor element
08/17/2006	US20060181308 Programmable structured arrays
08/17/2006	US20060181301 System and method for testing devices utilizing capacitively coupled signaling
08/17/2006	US20060180946 Bond pad structure for integrated circuit chip
08/17/2006	US20060180945 Forming a cap above a metal layer
08/17/2006	US20060180944 Flip chip ball grid array package with constraint plate
08/17/2006	US20060180943 Semiconductor device
08/17/2006	US20060180942 Semiconductor device
08/17/2006	US20060180941 Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements
08/17/2006	US20060180940 Semiconductor devices and in-process semiconductor devices having conductor filled vias
08/17/2006	US20060180939 Tamper-resistant semiconductor device
08/17/2006	US20060180938 Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same
08/17/2006	US20060180937 Electronic module, methods of manufacturing and driving the same, and electronic instrument
08/17/2006	US20060180936 Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same
08/17/2006	US20060180935 Semiconductor device
08/17/2006	US20060180934 Wiring structures for semiconductor devices
08/17/2006	US20060180933 Semiconductor device and manufacturing method of the same
08/17/2006	US20060180932 Component arrangement for series terminal for high-voltage applications
08/17/2006	US20060180931 Semiconductor package with plated connection
08/17/2006	US20060180930 Reliability and functionality improvements on copper interconnects with wide metal line below the via
08/17/2006	US20060180929 Substrate for an FBGA semiconductor component
08/17/2006	US20060180928 Semiconductor chip having solder bump
08/17/2006	US20060180927 Contact structure and method for manufacturing the same

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