H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2006
08/24/2006	DE102005013762B3 Electronic device e.g. converter, for supply to electric motor, has sensor thermoconductively connected with heat sink, and metallic areas of inner layers connected with metallic area at surface facing heat sink and arranged close to sensor
08/24/2006	DE102005008322A1 Signal transmission arrangement, has three semiconductor chips that is connected with each other in common housing, where arrangement is arranged for signal transmission between logic chip and memory chip over transmitting/receiving port
08/24/2006	DE102005008195A1 Hochfrequenzanordnung A radio frequency device
08/24/2006	DE102005007373A1 Leistungshalbleiterbaugruppe Power semiconductor module
08/24/2006	DE102005006995A1 Semiconductor module component, has plastic housing comprising conducting path, through which lower contact surfaces are electrically connected with upper contact surfaces, where paths comprise contacting path layer
08/24/2006	DE102005006281A1 Halbleiterbauteil mit Goldbeschichtungen und Verfahren zur Herstellung desselben Of the same semiconductor device with gold coatings and methods for preparing
08/24/2006	DE102005006280A1 Halbleiterbauteil mit einem Druckkontakt durch eine Gehäusemasse und Verfahren zur Herstellung desselben Of the same semiconductor device with a contact pressure by a housing composition and methods for preparing
08/24/2006	DE102005005579A1 OLED-Verkapselung mit Wasserdampf- und sauerstoffabsorbierenden Zwischenschichten OLED Encapsulation with water vapor and oxygen-absorbing intermediate layers
08/24/2006	DE102004063994A1 Chip-size package manufacture involves patterning dielectric layer to form openings exposing conductive lines
08/24/2006	DE10047135B4 Verfahren zum Herstellen eines Kunststoff umhüllten Bauelementes und Kunststoff umhülltes Bauelement A method for producing a plastic coated component and plastic component enveloped
08/23/2006	EP1693891A2 Method of manufacturing a semiconductor device
08/23/2006	EP1693890A1 Silicone adhesive agent
08/23/2006	EP1693785A1 Tape with embedded ic chip and sheet with embedded ic chip
08/23/2006	EP1693214A2 Semiconductor device and ink tank provided with such device
08/23/2006	EP1692926A1 Method for constructing emi shielding around a component embedded in a circuit board
08/23/2006	EP1692723A1 Plastically-deformable irreversible storage medium and method of producing one such medium
08/23/2006	EP1692525A1 A ground-signal-ground (gsg) test structure
08/23/2006	EP1479106B1 Fuse structure programming by electromigration of silicide enhanced by creating temperature gradient
08/23/2006	EP1393369A4 High performance heat sink for printed circuit boards
08/23/2006	EP1388167B1 Method of removing oxide from copper bond pads
08/23/2006	EP1192524B1 Micro cooling device
08/23/2006	EP1171914B1 Dissipation of heat from a circuit board having bare silicon chips mounted thereon
08/23/2006	CN2810115Y Radiation system and reflux prevention apparatus thereof
08/23/2006	CN2810114Y Radiation module
08/23/2006	CN2810113Y Backboard of radiator
08/23/2006	CN2810112Y Radiator
08/23/2006	CN2809879Y A light bulb
08/23/2006	CN2809878Y Water-cooling head
08/23/2006	CN2809877Y Fixing rack for water-cooling radiator component
08/23/2006	CN2809876Y Radiator with heat pipe
08/23/2006	CN2809875Y Fastener for switching radiator from one interface card to another
08/23/2006	CN2809874Y Fixing piece for radiator
08/23/2006	CN2809873Y A carrier plate for chip package
08/23/2006	CN2809872Y Protective box for chip
08/23/2006	CN1823561A Packaging of semiconductor devices for incrased reliability
08/23/2006	CN1823417A Semiconductor device including optimized driver layout for integrated circuit with staggered bond pads
08/23/2006	CN1823416A Stackable integrated circuit package and method therefor
08/23/2006	CN1823415A Thermal management materials
08/23/2006	CN1823414A PECVD silicon-rich oxide layer for reduced UV charging in an EEPROM
08/23/2006	CN1823413A Semiconductor device having electrical contact from opposite sides and method therefor
08/23/2006	CN1823410A Metal bump with an insulation for the side walls and method of fabricating a chip with such a metal bump
08/23/2006	CN1823408A ESD protection device and method of making the same
08/23/2006	CN1823391A Fuse structure
08/23/2006	CN1823181A Surface treating agent for tin or tin alloy material
08/23/2006	CN1822757A Heat radiation loop system
08/23/2006	CN1822747A Three-dimensional circuit module and method of manufacturing the same
08/23/2006	CN1822722A Semiconductor sensor
08/23/2006	CN1822402A Side view LED package having lead frame structure designed to improve resin flow
08/23/2006	CN1822401A LED package frame and LED package having the same
08/23/2006	CN1822385A 显示装置 Display device
08/23/2006	CN1822372A Display device and sputtering target for producing the same
08/23/2006	CN1822368A Tamper-resistant semiconductor device
08/23/2006	CN1822367A 半导体器件 Semiconductor devices
08/23/2006	CN1822365A Light emitting device provided with lens for controlling light distribution characteristic
08/23/2006	CN1822363A Semiconductor device and method of manufacturing the same
08/23/2006	CN1822362A Device and method for preventing an integrated circuit from malfunctioning due to a surge voltage
08/23/2006	CN1822361A Magnetic shielding for magnetically sensitive semiconductor devices
08/23/2006	CN1822360A Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same
08/23/2006	CN1822359A TAB tape and method of manufacturing the same
08/23/2006	CN1822358A Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized subs
08/23/2006	CN1822357A Semiconductor device package, method of manufacturing semiconductor device and semiconductor device
08/23/2006	CN1822356A Interposer for decoupling integrated circuits on a circuit board
08/23/2006	CN1822355A Bond pad structure for integrated circuit chip
08/23/2006	CN1822354A Method for forming solid cooling structure and its integrated with package element
08/23/2006	CN1822353A Housing for storage solid state imaging assemble and solid state imaging device
08/23/2006	CN1822329A Semiconductor and method for fabricating the same
08/23/2006	CN1820928A Lid made of resin for case for accommodating solid-state imaging device and manufacture method of the same
08/23/2006	CN1820889A Non low eutectic lead free solder composition
08/23/2006	CN1271895C Method for shielding an electric circuit on printed circuit board and a corresponding combination of a printed circuit board and shield
08/23/2006	CN1271723C Semiconductor device and its manufacturing method
08/23/2006	CN1271712C Semiconductor device with exposed radiator from sealed resin
08/23/2006	CN1271711C Exposed signal line and semiconductor having gap between signal line and substrate sheet
08/23/2006	CN1271710C Heat radiation unit for electronic component and production process thereof
08/23/2006	CN1271709C Leg correcting tool for chip transfer plate
08/23/2006	CN1271708C BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the same
08/23/2006	CN1271703C Method for manufacturing metal insulator metal capacitor and resistor at the same gradation
08/23/2006	CN1271165C Liquid epoxy packaging material and its preparation method and application
08/22/2006	US7096450 Enhancement of performance of a conductive wire in a multilayered substrate
08/22/2006	US7095624 Electromagnetic shield with vee-slot panel joints
08/22/2006	US7095623 Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus
08/22/2006	US7095621 Leadless leadframe electronic package and sensor module incorporating same
08/22/2006	US7095614 Electronic module assembly
08/22/2006	US7095550 Substrate having a planarization layer and method of manufacture therefor, substrate for electro-optical device, electro-optical device, and electronic apparatus
08/22/2006	US7095483 Process independent alignment marks
08/22/2006	US7095474 Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
08/22/2006	US7095460 Thin film transistor array substrate using low dielectric insulating layer and method of fabricating the same
08/22/2006	US7095372 Integrated circuit package including miniature antenna
08/22/2006	US7095293 Methods and devices for providing bias to a monolithic microwave integrated circuit
08/22/2006	US7095292 High-frequency line transducer, having an electrode opening surrounded by inner and outer vias
08/22/2006	US7095253 Programmable multi-chip module
08/22/2006	US7095241 Anisotropic conductive connector, probe member, wafer inspecting device, and wafer inspecting method
08/22/2006	US7095143 Device and method for ferrofluid power generator and cooling system
08/22/2006	US7095125 Mixtures of polyepoxides, phenolic resin curing agent, zinc molybdate, polysiloxanes, polyethersiloxane copolymers and fillers, used as flameproofing casings for electronics
08/22/2006	US7095124 Semiconductor device
08/22/2006	US7095123 Sensor semiconductor package, provided with an insert, and method for making same
08/22/2006	US7095122 Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same
08/22/2006	US7095121 Metallic strain-absorbing layer for improved fatigue resistance of solder-attached devices
08/22/2006	US7095120 Semiconductor integrated circuit device with a connective portion for multilevel interconnection
08/22/2006	US7095119 Semiconductor device
08/22/2006	US7095118 High-Frequency semiconductor device with noise elimination characteristic

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