H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2006
08/24/2006	WO2005112100A3 Stacked module systems and methods
08/24/2006	WO2005081976A9 Reprogrammable metal-to-metal antifuse employing carbon-containing antifuse material
08/24/2006	WO2005052179A3 Method of making carbon nanotube arrays, and thermal interfaces using same
08/24/2006	US20060190846 Building metal pillars in a chip for structure support
08/24/2006	US20060189740 Method for producing particulate alumina and composition containing particulate alumina
08/24/2006	US20060189176 Electrical contact
08/24/2006	US20060189164 Hafnium alloy target and process for producing the same
08/24/2006	US20060189153 Structures with improved interfacial strength of SiCOH dielectrics and method for preparing the same
08/24/2006	US20060189137 Method of forming damascene filament wires and the structure so formed
08/24/2006	US20060189135 Trench interconnect structure and formation method
08/24/2006	US20060189134 Ta-TaN selective removal process for integrated device fabrication
08/24/2006	US20060189133 Reliable BEOL integration process with direct CMP of porous SiCOH dielectric
08/24/2006	US20060189125 Multilayer wiring substrate, and method of producing same
08/24/2006	US20060189124 Semiconductor device having a through contact through a housing composition and method for producing the same
08/24/2006	US20060189123 Etchant and method of etching
08/24/2006	US20060189118 Microfeature devices and methods for manufacturing microfeature devices
08/24/2006	US20060189117 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
08/24/2006	US20060189083 Field Effect Transistor With Etched-Back Gate Dielectric
08/24/2006	US20060189077 Method for making high-density nonvolatile memory
08/24/2006	US20060189041 Semi-custom-made semiconductor integrated circuit device, method for customization and method for redesign
08/24/2006	US20060189040 Method of manufacturing an electronic device
08/24/2006	US20060189031 Semiconductor device and manufacturing method thereof
08/24/2006	US20060189030 Heat shrinkable insulated packaging
08/24/2006	US20060189028 Wafer having alternating design structure and method for manufacturing semiconductor package using the same
08/24/2006	US20060189022 MEMS heat pumps for integrated circuit heat dissipation
08/24/2006	US20060189009 Apparatus for controlling semiconductor manufacturing process
08/24/2006	US20060189006 Method and apparatus for detecting end point
08/24/2006	US20060188727 Thermally conductive resin sheet and power module using the same
08/24/2006	US20060187642 Structure for heat dissipation of integrated circuit chip and display module including the same
08/24/2006	US20060186983 On-chip inductor with magnetic core
08/24/2006	US20060186576 Resin sealing method for electronic part and mold used for the method
08/24/2006	US20060186559 Semiconductor device, and method for manufacturing the same
08/24/2006	US20060186556 Semiconductor-on-diamond devices and methods of forming
08/24/2006	US20060186555 Semiconductor device with chip-on-board structure
08/24/2006	US20060186554 Semiconductor device with a number of bonding leads and method for producing the same
08/24/2006	US20060186553 Semiconductor device
08/24/2006	US20060186552 High reflectivity p-contacts for group lll-nitride light emitting diodes
08/24/2006	US20060186551 Flip chip package with advanced electrical and thermal properties for high current designs
08/24/2006	US20060186550 Semiconductor device and manufacturing method thereof
08/24/2006	US20060186549 Semiconductor device and method of manufacturing the same
08/24/2006	US20060186548 Method of manufacturing semiconductor device and semiconductor device
08/24/2006	US20060186547 Light shield for CMOS imager
08/24/2006	US20060186546 Nonvolatile semiconductor memory device
08/24/2006	US20060186545 Semiconductor chip capable of implementing wire bonding over active circuits
08/24/2006	US20060186544 Copper bonding wire for semiconductor packaging
08/24/2006	US20060186542 Semiconductor device and manufacturing method thereof
08/24/2006	US20060186541 Method and system for bonding a semiconductor chip onto a carrier using micro-pins
08/24/2006	US20060186540 Method to create flexible connections for integrated circuits
08/24/2006	US20060186539 Trace design to minimize electromigration damage to solder bumps
08/24/2006	US20060186538 Land grid array package
08/24/2006	US20060186537 Delamination reduction between vias and conductive pads
08/24/2006	US20060186536 Substrate assembly with direct electrical connection as a semiconductor package
08/24/2006	US20060186535 Semi-conductor die mount assembly
08/24/2006	US20060186534 Lid made of resin for case for accommodating solid-state imaging device and solid-state imaging apparatus
08/24/2006	US20060186533 Chip scale package with heat spreader
08/24/2006	US20060186532 High frequency arrangement
08/24/2006	US20060186531 Package structure with chip embedded in substrate
08/24/2006	US20060186530 Memory device power distribution in memory assemblies
08/24/2006	US20060186529 Lead frame, sensor including lead frame and method of forming sensor including lead frame
08/24/2006	US20060186528 Semiconductor device
08/24/2006	US20060186527 Array substrate for liquid crystal display device and method for manufacturing the same
08/24/2006	US20060186526 Semiconductor device and its wiring method
08/24/2006	US20060186525 Electronic component with stacked semiconductor chips and method for producing the same
08/24/2006	US20060186524 Semiconductor device
08/24/2006	US20060186523 Chip-type micro-connector and method of packaging the same
08/24/2006	US20060186522 Molded part and electronic device using the same
08/24/2006	US20060186521 Semiconductor packages and methods for making and using same
08/24/2006	US20060186520 Semiconductor device and manufacturing method thereof
08/24/2006	US20060186519 Semiconductor device and unit equipped with the same
08/24/2006	US20060186518 Module card structure
08/24/2006	US20060186517 Semiconductor package having improved adhesiveness and ground bonding
08/24/2006	US20060186516 Semiconductor device with semiconductor chip mounted in package
08/24/2006	US20060186515 Dual row leadframe and fabrication method
08/24/2006	US20060186514 Package stacking lead frame system
08/24/2006	US20060186513 High frequency unit
08/24/2006	US20060186512 Flexible device and method of manufacturing the same
08/24/2006	US20060186508 Reverse blocking semiconductor device and a method for manufacturing the same
08/24/2006	US20060186507 Semiconductor device
08/24/2006	US20060186500 Laser diode packaging
08/24/2006	US20060186479 Semiconductor memory device having local etch stopper and method of manufacturing the same
08/24/2006	US20060186448 Semiconductor device memory cell
08/24/2006	US20060186435 Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
08/24/2006	US20060186406 Method and system for qualifying a semiconductor etch process
08/24/2006	US20060186405 Semiconductor device and manufacturing process therefor
08/24/2006	US20060186404 Dummy wafer
08/24/2006	US20060186403 Semiconductor device
08/24/2006	US20060186096 High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby
08/24/2006	US20060185976 Plating apparatus and method
08/24/2006	US20060185897 Electronic package and packaging method
08/24/2006	US20060185894 Conductive contamination reliability solution for assembling substrates
08/24/2006	US20060185832 Heat radiation module with transverse flow fan
08/24/2006	US20060185823 Porous media cold plate
08/24/2006	US20060185821 Thermal dissipation device
08/24/2006	US20060185546 System and method for vacuum generated imprinting
08/24/2006	US20060185394 Renewability and shortened renewing time, preventing elements in a substrate thereof from diffusing into the surface of diamond-like carbon (DLC), heat resistance of the molding die and adhesion between the DLC layer and substrate
08/24/2006	US20060185141 Multilayer wiring board and manufacture method thereof
08/24/2006	DE202006009643U1 Die-cast metal housing for storing electronic components on printed circuit board, has metallic cover partially resting against electronic components or pressed against heat dissipation surface in housing and secured to housing by screws
08/24/2006	DE19540140B4 Substrat, Modul und Verfahren zum Befestigen von Komponenten des Moduls auf dem Substrat Substrate module and method for attaching components of the module on the substrate
08/24/2006	DE10317675B4 Keramisches Multilayersubstrat und Verfahren zu seiner Herstellung A ceramic multilayer substrate and process for its preparation
08/24/2006	DE102006006820A1 IC-Chip-Beschichtungsmaterial und dasselbe verwendende Vakuumfluoreszendisplayvorrichtung IC chip coating material used and the same Vakuumfluoreszendisplayvorrichtung

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