| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/30/2006 | CN1272688C Semiconductor memory device inverted chip interface circuit and inverted chip interface method |
| 08/30/2006 | CN1272632C Wafer-level burn-in and test |
| 08/30/2006 | CN1272234C Method for forming microelectronic spring structures on a substrate |
| 08/29/2006 | US7100138 Method and apparatus for circuit design |
| 08/29/2006 | US7099647 Single chip direct conversion transceiver for reducing DC offset and method of manufacturing the same |
| 08/29/2006 | US7099224 Memory device and method for burn-in test |
| 08/29/2006 | US7099175 Semiconductor memory integrated circuit |
| 08/29/2006 | US7099174 Metal wiring pattern for memory devices |
| 08/29/2006 | US7099173 Stacked layered type semiconductor memory device |
| 08/29/2006 | US7099156 Locking device for heat dissipating device |
| 08/29/2006 | US7099139 Integrated circuit package substrate having a thin film capacitor structure |
| 08/29/2006 | US7099010 Due to the symmetry of the structure, the overlay accuracy in the first direction may be determined on the basis of the same reference data as used for the second, so that establishing libraries is simplified. |
| 08/29/2006 | US7098985 Multilayer external connection structure having third layer covering sidewalls of the first and second, made of reflective conductive material |
| 08/29/2006 | US7098842 Vehicle-mounted millimeter wave radar device, millimeter wave radar module, and manufacturing method thereof |
| 08/29/2006 | US7098683 Motor driving system having power semiconductor module life detection function |
| 08/29/2006 | US7098676 Multi-functional structure for enhanced chip manufacturibility and reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor |
| 08/29/2006 | US7098580 Piezoelectric oscillator |
| 08/29/2006 | US7098546 Alignment marks with salicided spacers between bitlines for alignment signal improvement |
| 08/29/2006 | US7098545 Semiconductor device and method of enveloping an integrated circuit |
| 08/29/2006 | US7098544 Edge seal for integrated circuit chips |
| 08/29/2006 | US7098542 Multi-chip configuration to connect flip-chips to flip-chips |
| 08/29/2006 | US7098541 Interconnect method for directly connected stacked integrated circuits |
| 08/29/2006 | US7098540 Electrical interconnect with minimal parasitic capacitance |
| 08/29/2006 | US7098539 Electronic device, method of manufacture of the same, and sputtering target |
| 08/29/2006 | US7098538 System semiconductor device and method of manufacturing the same |
| 08/29/2006 | US7098537 Interconnect structure diffusion barrier with high nitrogen content |
| 08/29/2006 | US7098536 Structure for strained channel field effect transistor pair having a member and a contact via |
| 08/29/2006 | US7098535 Semiconductor package and packaging method using flip-chip bonding technology |
| 08/29/2006 | US7098534 Sacrificial component |
| 08/29/2006 | US7098533 Printed circuit board with a heat dissipation element and package comprising the printed circuit board |
| 08/29/2006 | US7098532 Ceramic package and chip resistor, and methods for production of the same |
| 08/29/2006 | US7098531 Jumper chip component and mounting structure therefor |
| 08/29/2006 | US7098530 Package for a high-frequency electronic device |
| 08/29/2006 | US7098529 System and method for packaging a semiconductor device |
| 08/29/2006 | US7098528 Embedded redistribution interposer for footprint compatible chip package conversion |
| 08/29/2006 | US7098527 Integrated circuit package electrical enhancement with improved lead frame design |
| 08/29/2006 | US7098526 Bumped IC, display device and electronic device using the same |
| 08/29/2006 | US7098525 Organic polymers, electronic devices, and methods |
| 08/29/2006 | US7098524 Electroplated wire layout for package sawing |
| 08/29/2006 | US7098518 Die-level opto-electronic device and method of making same |
| 08/29/2006 | US7098515 Semiconductor chip with borderless contact that avoids well leakage |
| 08/29/2006 | US7098511 ESD protection circuit |
| 08/29/2006 | US7098510 Multifinger-type electrostatic discharge protection element |
| 08/29/2006 | US7098509 High energy ESD structure and method |
| 08/29/2006 | US7098503 Circuitry and capacitors comprising roughened platinum layers |
| 08/29/2006 | US7098501 Thin capacitive structure |
| 08/29/2006 | US7098491 Protection circuit located under fuse window |
| 08/29/2006 | US7098476 Multilayer interconnect structure containing air gaps and method for making |
| 08/29/2006 | US7098475 Apparatuses configured to engage a conductive pad |
| 08/29/2006 | US7098407 Non-solder mask defined (NSMD) type wiring substrate for ball grid array (BGA) package and method for manufacturing such a wiring substrate |
| 08/29/2006 | US7098276 Flame-retardant epoxy resin composition and semiconductor device made using the same |
| 08/29/2006 | US7098139 Method of manufacturing a semiconductor device with copper wiring treated in a plasma discharge |
| 08/29/2006 | US7098134 Method for fabricating semiconductor device |
| 08/29/2006 | US7098129 Interlayer insulation film used for multilayer interconnect of semiconductor integrated circuit and method of manufacturing the same |
| 08/29/2006 | US7098127 Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment |
| 08/29/2006 | US7098126 Formation of electroplate solder on an organic circuit board for flip chip joints and board to board solder joints |
| 08/29/2006 | US7098115 Semiconductor device and method of manufacturing the same |
| 08/29/2006 | US7098108 Semiconductor device having reduced effective substrate resistivity and associated methods |
| 08/29/2006 | US7098083 High impedance antifuse |
| 08/29/2006 | US7098082 Microelectronics package assembly tool and method of manufacture therewith |
| 08/29/2006 | US7098081 Semiconductor device and method of manufacturing the device |
| 08/29/2006 | US7098080 Method of making a semiconductor package with integrated heat spreader attached to a thermally conductive substrate core |
| 08/29/2006 | US7098079 Electronic assembly with high capacity thermal interface and methods of manufacture |
| 08/29/2006 | US7098078 Microelectronic component and assembly having leads with offset portions |
| 08/29/2006 | US7098074 Microelectronic assemblies having low profile connections |
| 08/29/2006 | US7098072 Fluxless assembly of chip size semiconductor packages |
| 08/29/2006 | US7098070 Device and method for fabricating double-sided SOI wafer scale package with through via connections |
| 08/29/2006 | US7098054 Method and structure for determining thermal cycle reliability |
| 08/29/2006 | US7098053 Method of producing semiconductor elements using a test structure |
| 08/29/2006 | US7098051 Structure and method of direct chip attach |
| 08/29/2006 | US7098049 Shallow trench isolation void detecting method and structure for the same |
| 08/29/2006 | US7098047 Wafer reuse techniques |
| 08/29/2006 | US7098044 Method of forming an etched metal trace with reduced RF impedance resulting from the skin effect |
| 08/29/2006 | US7098043 PCMO spin-coat deposition |
| 08/29/2006 | US7097921 Sandwich arc structure for preventing metal to contact from shifting |
| 08/29/2006 | US7097914 Composite structural material, and method of producing the same |
| 08/29/2006 | US7097686 Generating an aerosol including a liquid comprising a nickel precursor and a reducing agent and moving the droplets through a heating zone by means of a carrier gas to form nickel particles having small particle size, narrow size distribution, spherical morphology and high crystallinity; pyrometallurgy |
| 08/29/2006 | US7096926 Thermal pouch interface |
| 08/29/2006 | US7096914 Apparatus for bonding a chip using an insulating adhesive tape |
| 08/29/2006 | US7096716 Integration of thermal regulation and electronic fluid sensing |
| 08/29/2006 | US7096581 Method for providing a redistribution metal layer in an integrated circuit |
| 08/29/2006 | US7096580 I/C package/thermal-solution retention mechanism with spring effect |
| 08/24/2006 | WO2006089171A2 Stacked ball grid array package module utilizing one or more interposer layers |
| 08/24/2006 | WO2006088652A2 Semiconductor device having directly attached heat spreader |
| 08/24/2006 | WO2006088609A2 Semiconductor package with low and high-speed signal paths |
| 08/24/2006 | WO2006088270A1 Stacked package and method of fabricating the same |
| 08/24/2006 | WO2006088230A1 Thermosetting composition for solder resist and cured product thereof |
| 08/24/2006 | WO2006088065A1 Heat dissipating member and method for manufacture thereof |
| 08/24/2006 | WO2006088036A1 Process for producing modified porous silica film, modified porous silica film obtained by the process, and semiconductor device employing the modified porous silica film |
| 08/24/2006 | WO2006088015A1 Method for forming organosilicon film, semiconductor device having such organosilicon film and method for manufacturing same |
| 08/24/2006 | WO2006087957A1 Semiconductor device manufacturing method and semiconductor device |
| 08/24/2006 | WO2006087906A1 Novel curable resin, method for producing same, epoxy resin composition and electronic component device |
| 08/24/2006 | WO2006087770A1 Package unit |
| 08/24/2006 | WO2006087769A1 Package mounted module and package board module |
| 08/24/2006 | WO2006086963A1 Semiconductor component having a surface-mount housing and method for producing the same |
| 08/24/2006 | WO2006086806A1 Transparent body provided with an ultrafine metal layer for adapting impedance and suppressing reflections and a method for the production thereof |
| 08/24/2006 | WO2006079104A3 Encapsulation of circuit components to reduce thermal cycling stress |
| 08/24/2006 | WO2006039633A3 Structure and method of making interconnect element, and multilayer wiring board including the interconnect element |
| 08/24/2006 | WO2006020578A3 Self-cleaning lower contact |
| 08/24/2006 | WO2005122284A3 Semiconductor-on-diamond devices and methods of forming |