Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2014
05/08/2014US20140124919 Semiconductor device and semiconductor process
05/08/2014US20140124918 Thermal improvement of integrated circuit packages
05/08/2014US20140124917 Method and system for controlling chip inclination during flip-chip mounting
05/08/2014US20140124916 Molded Underfilling for Package on Package Devices
05/08/2014US20140124915 Semiconductor module
05/08/2014US20140124914 Semiconductor packaging structure and method
05/08/2014US20140124913 Open solder mask and or dielectric to increase lid or ring thickness and contact area to improve package coplanarity
05/08/2014US20140124912 Semiconductor device and method of manufacturing the same
05/08/2014US20140124911 Semiconductor device
05/08/2014US20140124910 Semiconductor package and method of forming the same
05/08/2014US20140124909 Semiconductor device
05/08/2014US20140124907 Semiconductor packages
05/08/2014US20140124906 Semiconductor package and method of manufacturing the same
05/08/2014US20140124905 Vibration noise shield in a semiconductor sensor
05/08/2014US20140124901 Integrated circuit chips having vertically extended through-substrate vias therein
05/08/2014US20140124900 Through-silicon via (tsv) die and method to control warpage
05/08/2014US20140124899 Integrated bondline spacers for wafer level packaged circuit devices
05/08/2014US20140124894 Semiconductor device comprising a diode and a method for producing such a device
05/08/2014US20140124892 Semiconductor device and method for forming the same
05/08/2014US20140124891 Fuse device
05/08/2014US20140124890 Semiconductor Package Having Multi-Phase Power Inverter with Internal Temperature Sensor
05/08/2014US20140124889 Die seal ring for integrated circuit system with stacked device wafers
05/08/2014US20140124877 Conductive interconnect including an inorganic collar
05/08/2014US20140124867 Nitride semiconductor device
05/08/2014US20140124842 Contact Structure of Semiconductor Device
05/08/2014US20140124803 Display panel, chip on film and display device including the same
05/08/2014US20140124792 Ni-rich schottky contact
05/08/2014US20140124777 Built-up substrate, method for manufacturing same, and semiconductor integrated circuit package
05/08/2014US20140124700 ALN Substrate And Method For Producing Same
05/08/2014US20140124589 Apparatus and method for reducing acoustical noise in synthetic jets
05/08/2014US20140124566 Flip chip assembly apparatus employing a warpage-suppressor assembly
05/08/2014US20140124565 Microelectronic assembly with joined bond elements having lowered inductance
05/08/2014US20140124182 Cooling system of power semiconductor device
05/08/2014DE202014001943U1 LED-Streifen, Lampe LED strip light
05/08/2014DE112012003439T5 Rührreibschweißstruktur und Leistungshalbleitervorrichtung Rührreibschweißstruktur and power semiconductor device
05/08/2014DE112012003296T5 Halbleitermodul, Halbleitervorrichtung mit dem Halbleitermodul und Verfahren zur Herstellung des Halbleitermoduls A semiconductor module, the semiconductor device with the semiconductor module and method for manufacturing the semiconductor module
05/08/2014DE112012003228T5 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same
05/08/2014DE112008002348B4 Schaltungsanordnung zum Schutz vor elektrostatischen Entladungen und Verfahren zur Ableitung derselben Circuitry to protect against electrostatic discharges and methodology used to derive the same
05/08/2014DE102013222147A1 Spannungsentlastung für in Kunststoff verkapselte Bauelemente Stress relief for encapsulated in plastic components
05/08/2014DE102013221954A1 Halbleitereinheit Semiconductor unit
05/08/2014DE102013214132A1 Semiconductor device e.g. integrated circuit for electronic product e.g. computer, has N-type drain region which is formed below the second diffusion region of transistor and within first device portion
05/08/2014DE102013206868A1 Method for cooling power semiconductor switch e.g. rectifier, involves thermally connecting semiconductor device to phase-change material that is arranged in container or reservoir
05/08/2014DE102013112215A1 Gekapselte nanostrukturierte Komponente und Verfahren zum Herstellen einer gekapselten nanostrukturierten Komponente Encapsulated nanostructured component and method of manufacturing an encapsulated nanostructured component
05/08/2014DE102013111581A1 Halbleiterpackages mit integrierter Antenne und Verfahren zu deren Herstellung Semiconductor packages with an integrated antenna and processes for their preparation
05/08/2014DE102013107065A1 Bolzenkontakthügelstruktur und Verfahren zum Herstellen derselben Stud bump structure and methods for manufacturing the same
05/08/2014DE102013101620A1 Wärmeabführvorrichtung und Wärmeabführlamelle davon Heat dissipation and Wärmeabführlamelle thereof
05/08/2014DE102013018381A1 Ohne Lotmaske definierte Kupferanschlussflächen und eingebettete Kupferanschlussflächen zur Reduzierung der Gehäusesystemhöhe Without solder mask defined pads and embedded copper copper pads to reduce the housing system height
05/08/2014DE102013018379A1 Substrataufbauschichten zum Erreichen einer feinen Entwurfsregel und einer erhöhten Gehäuse-Planparallelität Substrate structure layers to achieve a fine design rule and increased housing plan parallelism
05/08/2014DE102013018192A1 Vergrabene, für Entkopplungskondensatoren verwendete TSV Buried, used for decoupling capacitors TSV
05/08/2014DE102013018191A1 Offene Lotmaske und oder offenes Dielektrikum zur Vergrösserung einer Dicke einer Abdeckung oder eines Rings und einer Kontaktfläche zur Verbesserung einer Gehäuseebenheit Open and solder mask or open dielectric to enlarge a thickness of a cover or a ring and a contact surface for improving housing flatness
05/08/2014DE102012220323A1 Bauteil und Verfahren zu dessen Herstellung Component and process for its preparation
05/08/2014DE102012219145A1 Electronics assembly has spacer structure that is projected in direction of circuit board when electrical contact is arranged on bottom side of electronic component, and that includes contact portion which is contacted to circuit board
05/08/2014DE102012211424B4 Halbleitervorrichtung und Verfahren für deren Herstellung Semiconductor device and methods for their preparation
05/08/2014DE102011050585B4 Verfahren zur Herstellung eines Kunststoffformkörpers als Anzeige- und/oder Funktionselement und Kunststoffformkörper A process for producing a plastic molded article as a display and / or functional element and plastics moldings
05/08/2014DE102008064789B3 Harzabgedichtete Halbleitervorrichtung Harzabgedichtete semiconductor device
05/08/2014DE102007012154B4 Halbleitermodul mit Halbleiterchips und Verfahren zur Herstellung desselben The same semiconductor module with a semiconductor chip and method for producing
05/07/2014EP2728618A1 Semiconductor device
05/07/2014EP2728617A1 Semiconductor power converter and method of manufacturing the same
05/07/2014EP2728616A1 Circuit board for peripheral circuit in high-capacity module and high-capacity module including peripheral circuit using circuit board
05/07/2014EP2728615A1 Semiconductor device and method for manufacturing semiconductor device
05/07/2014EP2728614A1 Heated-side contact structure of thin heat pipe
05/07/2014EP2728613A1 Method for testing a wire bond joint
05/07/2014EP2727898A1 Brazing filler metal, brazing filler metal paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor module
05/07/2014EP2727444A1 Electronic assembly
05/07/2014EP2727145A2 Lead carrier with thermally fused package components
05/07/2014EP2727144A1 Connecting component equipped with hollow inserts
05/07/2014EP2727143A1 Heat sink for cooling of power semiconductor modules
05/07/2014EP2727142A1 Compact thermal module
05/07/2014EP2727141A1 Electronic circuit arrangement for drawing heat from components which emit heat loss
05/07/2014CN203589042U 一种轴向二极管 An axially diode
05/07/2014CN203589034U 双电极结构led器件的抗短路结构 Anti-short circuit structure double electrode structure led devices
05/07/2014CN203589028U 用于电池组保护mosfet的公共漏极电源夹件 For the battery pack to protect the common drain power mosfet clamps
05/07/2014CN203589016U 抗侵入式攻击的芯片 Anti-invasive attacks chips
05/07/2014CN203589015U 一种再布线金属层和高密度再布线封装结构 One kind of another metal wiring layer and the high-density packaging structure rewiring
05/07/2014CN203589014U 一种带有支撑保护结构的封装结构 A support package with a protective structure
05/07/2014CN203589013U 一种双排的引线框架 A double row of leadframe
05/07/2014CN203589012U 一种加厚的引线框架 A thicker lead frame
05/07/2014CN203589011U 一种引线框架脚 A lead frame pins
05/07/2014CN203589010U 一种防锡球塌陷的fcqfn封装件 An anti-solder balls collapse fcqfn package
05/07/2014CN203589009U 一种采用塑封技术优化fcbga封装的封装件 One kind of technology to optimize the use of plastic encapsulated package fcbga
05/07/2014CN203589008U 一种基于基板采用开槽技术的封装件 A substrate using slotted technology-based package
05/07/2014CN203589007U 一种基于框架的多器件smt扁平封装件 A framework is based on a multi-device smt flat package
05/07/2014CN203589006U 一种aaqfn二次塑封与二次植球优化的封装件 One kind aaqfn secondary plastic and secondary bumping optimization package
05/07/2014CN203589005U 内凹式焊点封装 Recessed joints package
05/07/2014CN203589004U 用于双界面智能卡模块封装的条带 Article for dual interface smart card module package with
05/07/2014CN203589003U 集成电路sip封装结构 IC sip package structure
05/07/2014CN203589002U 一种功率管的封装结构 A power tube package
05/07/2014CN203589001U 一种防止芯片凸点短路的封装件 A bump to prevent short circuit chip package
05/07/2014CN203589000U 一种基于无框架csp封装背面植球塑封封装件 Based frameless csp back of the package bumping plastic package
05/07/2014CN203588999U 一种分布式的薄膜铂电极 A distributed thin-film platinum electrode
05/07/2014CN203588998U 中介体及电子器件 Intermediaries and electronic devices
05/07/2014CN203588997U 一种紊流散热器 One kind of turbulence radiator
05/07/2014CN203588996U 一种散热装置及一种电子产品 A heat sink device and an electronic products
05/07/2014CN203588995U 一种芯片导热装置 A chip thermal device
05/07/2014CN203588994U 绝缘耐高温散热膜 High temperature heat insulating film
05/07/2014CN203588993U 一种功率器件的封装结构 A power device package structure
05/07/2014CN203588992U 一种tec芯片的热端及冷端集成散热结构 Hot side and a cold side one kind tec chip integrated cooling structure
05/07/2014CN203588991U 一种基于基板采用液体塑封的封装件 A substrate using a package-based liquid plastic
05/07/2014CN203588990U 一种用于单粒子激光脉冲试验的功率vdmos器件 Power vdmos device for a single particle laser pulse test
05/07/2014CN203586158U 一种led灯散热片 One kind of led lights fins
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