Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2015
03/05/2015US20150061123 Semiconductor Device and Method for Forming Openings and Trenches in Insulating Layer by First LDA and Second LDA for RDL Formation
03/05/2015US20150061122 Semiconductor device and manufacturing method of semiconductor device
03/05/2015US20150061121 Method for wafer level packaging and a package structure thereof
03/05/2015US20150061120 Stack packages and methods of manufacturing the same
03/05/2015US20150061119 Circuit substrate, semicondutor package structure and process for fabricating a circuit substrate
03/05/2015US20150061118 Three-Dimensional Chip Stack and Method of Forming the Same
03/05/2015US20150061117 Chip package and method for forming the same
03/05/2015US20150061116 Semiconductor device and manufacturing method thereof
03/05/2015US20150061115 Interconnect structure and manufacturing method thereof
03/05/2015US20150061114 Semiconductor device and method of manufacturing the same
03/05/2015US20150061113 Semiconductor Dies Having Opposing Sides with Different Reflectivity
03/05/2015US20150061112 Power semiconductor device and method for producing a power semiconductor device
03/05/2015US20150061111 Semiconductor device
03/05/2015US20150061110 Stacked chip layout and method of making the same
03/05/2015US20150061109 Semiconductor device
03/05/2015US20150061108 Packaged Semiconductor Device
03/05/2015US20150061107 Insulation sheet made from silicon nitride, and semiconductor module structure using the same
03/05/2015US20150061105 Semiconductor module
03/05/2015US20150061104 Semiconductor device
03/05/2015US20150061103 Embedded die package
03/05/2015US20150061102 Electronic device package and fabrication method thereof
03/05/2015US20150061101 Semiconductor packages and methods of packaging semiconductor devices
03/05/2015US20150061100 Semiconductor Arrangement, Method for Producing a Number of Chip Assemblies, Method for Producing a Semiconductor Arrangement and Method for Operating a Semiconductor Arrangement
03/05/2015US20150061099 Dense-pitch small-pad copper wire bonded double ic chip stack packaging piece and preparation method therefor
03/05/2015US20150061098 Semiconductor device and method for manufacturing the same
03/05/2015US20150061097 Edge coupling of semiconductor dies
03/05/2015US20150061096 Semiconductor Package with Multi-Level Die Block
03/05/2015US20150061095 Package-on-package devices, methods of fabricating the same, and semiconductor packages
03/05/2015US20150061094 Cavity package with pre-molded cavity leadframe
03/05/2015US20150061093 Interposer and semiconductor package using the same, and method of manufacturing interposer
03/05/2015US20150061092 Apparatus and methods for reducing impact of high rf loss plating
03/05/2015US20150061091 Functionalised redistribution layer
03/05/2015US20150061085 Package interconnects
03/05/2015US20150061084 Substrate, method of fabricating the same, and application the same
03/05/2015US20150061083 Metal trench de-noise structure and method for forming the same
03/05/2015US20150061082 Contact plug and method for manufacturing the same
03/05/2015US20150061081 Crack deflector structure for improving semiconductor device robustness against saw-induced damage
03/05/2015US20150061080 Guard ring structure of semiconductor apparatus
03/05/2015US20150061079 Wafer Level Dicing Method
03/05/2015US20150061075 Metal trench de-coupling capacitor structure and method for forming the same
03/05/2015US20150061073 Semiconductor device comprising capacitor and method of manufacturing the same
03/05/2015US20150061068 Non-volatile memory device, method for fabricating pattern on wafer and method for manufacturing non-volatile memory device using same
03/05/2015US20150061036 Novel 3d semiconductor device and structure
03/05/2015US20150061034 Devices having inhomogeneous silicide schottky barrier contacts
03/05/2015US20150061026 Semiconductor Logic Circuits Fabricated Using Multi-Layer Structures
03/05/2015US20150061025 Memory device
03/05/2015US20150061020 Semiconductor device and method of manufacturing semiconductor device
03/05/2015US20150060988 Semiconductor devices and methods of fabricating the same
03/05/2015US20150060978 Semiconductor device
03/05/2015US20150060977 Semiconductor devices with vertical channel structures
03/05/2015US20150060943 Nitride-based transistors and methods of fabricating the same
03/05/2015US20150060942 Semiconductor device
03/05/2015US20150060931 Semiconductor packages and display devices including semiconductor packages
03/05/2015US20150060898 Method for low temperature bonding of electronic components
03/05/2015US20150060891 Optoelectronics assembly and method of making optoelectronics assembly
03/05/2015US20150060878 Semiconductor Packages Having Multiple Lead Frames and Methods of Formation Thereof
03/05/2015US20150060872 Encapsulated Semiconductor Device
03/05/2015US20150060868 Array substrate, method for manufacturing the same and display device
03/05/2015US20150060856 Beol compatible fet structure
03/05/2015US20150060527 Non-uniform heater for reduced temperature gradient during thermal compression bonding
03/05/2015US20150060123 Locking dual leadframe for flip chip on leadframe packages
03/05/2015US20150060116 Cavity package with pre-molded substrate
03/05/2015US20150060039 Structure and method for cooling three-dimensional integrated circuits
03/05/2015US20150059985 Bonding system
03/05/2015US20150059957 Systems and methods for measuring physical characteristics of semiconductor device elements using structured light
03/05/2015US20150059361 In-situ thermoelectric cooling
03/05/2015DE112012006469T5 Mikroelektronisches Gehäuse mit nicht komplanaren gekapselten mikroelektronischen Bauelementen und einer Aufbauschicht ohne Kontaktierhügel Microelectronic housing with non-coplanar encapsulated microelectronic components and a build-up layer without Kontaktierhügel
03/05/2015DE10322135B9 Bauelement mit einer Lötverbindung und Verfahren zur Herstellung der Lötverbindung Component having a solder joint and process for producing the soldered joint
03/05/2015DE102014213084A1 Halbleitervorrichtung Semiconductor device
03/05/2015DE102014212521A1 Halbleitervorrichtung Semiconductor device
03/05/2015DE102014212519A1 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
03/05/2015DE102014112497A1 Funktionalisierte Redistribution-Layer Functionalized Redistribution Layer
03/05/2015DE102014112429A1 Halbleiterpackage mit Mehrebenen-Chipblock Semiconductor package with multilevel chip block
03/05/2015DE102014112411A1 Eingekapselte Halbleitervorrichtung Encapsulated semiconductor device
03/05/2015DE102014112342A1 Halbleiter-Dies mit gegenüberliegenden Seiten mit unterschiedlichem Reflexionsvermögen Semiconductor die having opposing sides with different reflectivity
03/05/2015DE102014112330A1 Überspritzte Substrat-Chip-Anordnung mit Wärmesenke Overmolded substrate chip assembly with heat sink
03/05/2015DE102014112217A1 Gegossenes Halbleitergehäuse mit steckbarer Leitung Cast semiconductor package with pluggable cable
03/05/2015DE102014112186A1 Leistungshalbleiterchipgehäuse Power semiconductor chip package
03/05/2015DE102014112174A1 Anschlussrahmenstreifen mit elektrischer Isolierung von Chipträgern Leadframe strip with electrical insulation of chip carriers
03/05/2015DE102014112025A1 Eingehauste Halbleitervorrichtung Encapsulated semiconductor device
03/05/2015DE102014105066B3 Verfahren und Vorrichtungen zur Abscheidung einer Metallschicht auf einem Halbleiterbauelement Methods and apparatus for depositing a metal layer on a semiconductor device
03/05/2015DE102014104247A1 Oled-display-vorrichtung und zugehörige flexible leiterplatte Oled-display-device and associated flexible printed circuit board
03/05/2015DE102013217802A1 Halbleiteranordnung, verfahren zur herstellung einer halbleiterbaugruppe, verfahren zur herstellung einer halbleiteranordnung und verfahren zum betrieb einer halbleiteranordnung A semiconductor device, method for manufacturing a semiconductor module, process for manufacturing a semiconductor assembly and method for operating a semiconductor arrangement
03/05/2015DE102013217801A1 Halbleiteranordnung, verfahren zur herstellung einer anzahl von chipbaugruppen, verfahren zur herstellung einer halbleiteranordnung und verfahren zum betrieb einer halbleiteranordnung A semiconductor device, method for manufacturing a number of chip modules, process to manufacture a semiconductor assembly and method for operating a semiconductor arrangement
03/05/2015DE102013217625A1 Vorrichtung zur passiven Entwärmung von Metallgehäusen A passive cooling of metal housings
03/05/2015DE102013217349A1 Mikromechanische Sensoranordnung und entsprechendes Herstellungsverfahren Micro-mechanical sensor device and manufacturing method thereof
03/05/2015DE102013217303A1 Stanzgitter für ein Premold-Sensorgehäuse Stamped grid for a premold sensor housing
03/05/2015DE102013217301A1 Bauteil Component
03/05/2015DE102013113844A1 Flüssigkristall-Anzeigevorrichtung und Verfahren zum Herstellen derselben A liquid crystal display device and method of manufacturing the same
03/05/2015DE102013109589B3 Leistungshalbleitereinrichtung und Verfahren zur Herstellung einer Leistungshalbleitereinrichtung Power semiconductor device and method of manufacturing a power semiconductor device
03/05/2015DE102010016517B4 Halbleiterbauelement Semiconductor device
03/05/2015DE102009061167B3 Halbleiterkörper mit einer Anschlusszelle Semiconductor body having a connection cell
03/04/2015EP2844052A2 Power converter unit of an electric or hybrid vehicle
03/04/2015EP2844050A1 Cooler, electrical component unit, and refrigeration device
03/04/2015EP2843700A2 Apparatus for cooling inverter
03/04/2015EP2843699A1 Assembled aluminum extrusion heat dissipator
03/04/2015EP2843698A2 Cavity package with pre-molded substrate
03/04/2015EP2843697A2 Cavity package with pre-molded cavity leadframe
03/04/2015EP2843693A1 Method for producing a conductive pad on a conductive member
03/04/2015EP2843347A1 Radiator and method for manufacturing radiator
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