| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 08/31/2006 | US20060191712 Interconnect |
| 08/31/2006 | US20060191711 Embedded chip printed circuit board and method of manufacturing the same |
| 08/31/2006 | US20060191710 Multilayer printed wiring board and a process of producing same |
| 08/31/2006 | US20060191708 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| 08/31/2006 | US20060191629 Anodically bonding a stack of two conductive ceramic components separated by an intermediate film at low temperatures wherein a transition layer is formed |
| 08/31/2006 | US20060191475 Apparatus for spin coating semiconductor substrates |
| 08/31/2006 | DE19908979B4 Anschlusssockel mit darin eingeschobenem Halbleiterbauteil für photoelektrische Elemente Terminal block with inserted therein semiconductor device for photoelectric elements |
| 08/31/2006 | DE112005000051T5 Hermetische Abdichtkappe, Verfahren zur Herstellung einer hermetischen Abdichtkappe sowie Aufbewahrungsverpackung für eine elektronische Komponente Hermetic sealing method for manufacturing a hermetic sealing and storage package for an electronic component |
| 08/31/2006 | DE10208714B4 Herstellungsverfahren für einen Kontakt für eine integrierte Schaltung Manufacturing method of a contact for an integrated circuit |
| 08/31/2006 | DE102006006538A1 Heat sink for e.g. north bridge chip, has housing and heat contact layer provided between upper surface of chip and lower surface of housing, where housing is made of heat conducting material having metal and crystalline carbon |
| 08/31/2006 | DE102005008600A1 Chip carrier used as heat sink for semiconductor chips, comprises two recesses in respective surface of chip carrier, and dimensioned to receive two semiconductor chips |
| 08/31/2006 | DE102005008482A1 Cooling module for electronic components, has cooling unit e.g. thermocouple arranged at side of components, where cooling unit converts heat energy of chilled goods into current energy, so that waste heat of chilled goods is dissipated |
| 08/31/2006 | DE102005007643A1 Verfahren und Anordnung zum Kontaktieren von Halbleiterchips auf einem metallischen Substrat Method and apparatus for bonding semiconductor chips on a metallic substrate |
| 08/31/2006 | DE102005007486A1 Halbleiterbauteil mit oberflächenmontierbarem Gehäuse und Verfahren zur Herstellung desselben Of the same semiconductor device with oberflächenmontierbarem housing and methods for preparing |
| 08/31/2006 | DE102005007343A1 Heat radiation structure for CPU, has heat conduction layer partly installed into base board and radiation fins |
| 08/31/2006 | DE102005006333A1 Halbleiterbauteil mit mehreren Bondanschlüssen und Verfahren zur Herstellung desselben Of the same semiconductor device having a plurality of bonding pads and methods for preparing |
| 08/31/2006 | DE102004044686B4 Integrierte Schaltungsanordnung mit Vias, die zwei Abschnitte haben, und Herstellungsverfahren An integrated circuit device with vias, which have two portions, and manufacturing processes |
| 08/31/2006 | DE102004040414B4 Verfahren zur Herstellung eines Verdrahtungssubstrats eines Halbleiterbauteils mit Außenkontaktanschlussflecken für Außenkontakte Process for the preparation of a wiring substrate of a semiconductor device with external contact pads for external contacts |
| 08/31/2006 | DE102004033645B4 Herstellungswerkzeug für eine Waferebene-Packung und Verfahren zum Anordnen von Chips Production tool for a wafer level package and method for disposing of chips |
| 08/31/2006 | CA2598311A1 Superconductive articles having density characteristics |
| 08/30/2006 | EP1696717A2 Electric range |
| 08/30/2006 | EP1696526A1 Semiconductor laser device and method of producing the same |
| 08/30/2006 | EP1696487A1 High frequency arrangement |
| 08/30/2006 | EP1696486A1 Integrated circuit and wireless ic tag |
| 08/30/2006 | EP1696485A1 Process for manufacturing semiconductor devices in a SOI substrate with alignment marks |
| 08/30/2006 | EP1696484A1 Process for assembling a double-sided circuit component |
| 08/30/2006 | EP1696483A1 Electronic device cooler, electronic device cooling method, and electronic device cooling control program |
| 08/30/2006 | EP1696482A2 Semiconductor device package and method of manufacturing the same |
| 08/30/2006 | EP1696481A2 Method of integrating an electronic component into a substrate cavity |
| 08/30/2006 | EP1696478A1 Insulating film, method for forming same and composition for forming film |
| 08/30/2006 | EP1696129A2 Liquid-Cooled heat dissipation module |
| 08/30/2006 | EP1696046A1 Metal base carbon fiber composite material and process for producing the same |
| 08/30/2006 | EP1695601A1 Flat plate heat transfer device and method for manufacturing the same |
| 08/30/2006 | EP1695387A2 Low crosstalk substrate for mixed-signal integrated circuits |
| 08/30/2006 | EP1695385A1 Method and arrangement for shielding a component against electrostatic interference |
| 08/30/2006 | EP1695384A2 Wire-bonded semiconductor component with reinforced inner connection metallization |
| 08/30/2006 | EP1695383A1 Bipolar and cmos integration with reduced contact height |
| 08/30/2006 | EP1695382A1 Thermal interface material and solder preforms |
| 08/30/2006 | EP1694769A1 Dual-stage wafer applied underfills |
| 08/30/2006 | EP1694597A1 Microcomponent comprising a hermetic microcavity and method for production of such a microcomponent |
| 08/30/2006 | EP1570572A4 Single package multi-chip rf power amplifier |
| 08/30/2006 | EP1483816A4 Header assembly having integrated cooling device |
| 08/30/2006 | EP1035568B1 Method of plasma processing |
| 08/30/2006 | EP0993039B1 Substrate for mounting semiconductor chips |
| 08/30/2006 | EP0910125B1 Method and device for sealing ic chip |
| 08/30/2006 | CN2812517Y Radiating fin combining structure for radiator |
| 08/30/2006 | CN2812306Y Large power LED package structure |
| 08/30/2006 | CN2812302Y Thin film transistor structure capable of reducing starting voltage excursion |
| 08/30/2006 | CN2812300Y Plastic package diode lead |
| 08/30/2006 | CN2812299Y Improvement of fan structure for wafer heat elimination |
| 08/30/2006 | CN2812298Y Thermal pipe radiator support |
| 08/30/2006 | CN2812297Y A liquid-cooled device for CPU with heat pipe in rows |
| 08/30/2006 | CN2812296Y Assembly and radiator with same |
| 08/30/2006 | CN2812295Y Flat panel power semiconductor device and press-loading device for its radiator |
| 08/30/2006 | CN1826849A Housing arrangement |
| 08/30/2006 | CN1826846A Land grid array connector |
| 08/30/2006 | CN1826845A Land grid array connector |
| 08/30/2006 | CN1826695A Electronic assembly having a die with rounded corner edge portions and a method of fabricating the same |
| 08/30/2006 | CN1826689A Wiring board embedded with spherical semiconductor element |
| 08/30/2006 | CN1826688A Semiconductor device manufacturing method |
| 08/30/2006 | CN1826687A Wiring structure and method for producing same |
| 08/30/2006 | CN1826686A 集成传感器芯片单元 Integrated sensor chip unit |
| 08/30/2006 | CN1826671A Compact impedance transformation circuit |
| 08/30/2006 | CN1826670A Inductive and capacitive elements for semiconductor technologies with minimum pattern density requirements |
| 08/30/2006 | CN1826664A Conductive ball, method of forming electrode of electronic part, electronic part and electronic equipment |
| 08/30/2006 | CN1826045A Cooling device for an electronic apparatus |
| 08/30/2006 | CN1825648A Radiator for LED |
| 08/30/2006 | CN1825645A Led housing and fabrication method thereof |
| 08/30/2006 | CN1825644A High power led housing and fabrication method thereof |
| 08/30/2006 | CN1825636A Carrier structure of luminescent wafer |
| 08/30/2006 | CN1825623A Bi-carrier scr circuit and method of forming the same |
| 08/30/2006 | CN1825610A 固态成像装置 The solid-state imaging device |
| 08/30/2006 | CN1825604A Sensor packing structure, sensor packing process, sensor module and mfg. method thereof |
| 08/30/2006 | CN1825592A NAND-type flash memory devices and fabrication methods thereof |
| 08/30/2006 | CN1825588A Electrostatic discharge circuit and method of dissipating an electrostatic current |
| 08/30/2006 | CN1825586A Led assembly and method of making the same |
| 08/30/2006 | CN1825584A Electronic package and packaging method |
| 08/30/2006 | CN1825583A Multistage interconnection structure and method of forming cu interconnection on IC wafer |
| 08/30/2006 | CN1825582A Multilayer inner-dielectric-ayer of semiconductor component and manufacture method of the same |
| 08/30/2006 | CN1825581A Printed circuit board, flip chip ball grid array board and method of fabricating the same |
| 08/30/2006 | CN1825580A Semiconductor device |
| 08/30/2006 | CN1825579A Circuit substrate structure and circuit apparatus |
| 08/30/2006 | CN1825578A Semiconductor device manufacturing method |
| 08/30/2006 | CN1825577A Method for making radiating structure of rectifier |
| 08/30/2006 | CN1825576A Thermal interface material and heat sink configuration |
| 08/30/2006 | CN1825575A Heat sink, an electronic component package, and a method of manufacturing a heat sink |
| 08/30/2006 | CN1825574A Electronic assembly radiator unit |
| 08/30/2006 | CN1825573A Radiating fin with flow guiding function |
| 08/30/2006 | CN1825572A Sheet for circuit substrates and sheet of a circuit substrate for displays |
| 08/30/2006 | CN1825563A Semiconductor chip and method of fabricating the same |
| 08/30/2006 | CN1825553A Manufacturing method for a semiconductor device |
| 08/30/2006 | CN1825246A Cooler for several heating elements |
| 08/30/2006 | CN1272992C Switching power supply for high frequency heater |
| 08/30/2006 | CN1272881C Cam holding mechanism of zero inserting force electric connector |
| 08/30/2006 | CN1272850C High-frequency throwing structure |
| 08/30/2006 | CN1272849C Flexible electronic device |
| 08/30/2006 | CN1272848C Semiconductor package having heat sink |
| 08/30/2006 | CN1272845C Method for producing contact plug of semiconductor device |
| 08/30/2006 | CN1272838C Resin moulding-die and method for making semiconductor device using same |
| 08/30/2006 | CN1272837C Semiconductor device and circuit substrate |