| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/05/2006 | US7101732 Semiconductor device and method of manufacturing the same |
| 09/05/2006 | US7101620 Thermal release wafer mount tape with B-stage adhesive |
| 09/05/2006 | US7101502 Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings |
| 09/05/2006 | US7101149 Axial fan for computer |
| 09/05/2006 | US7101061 Light emission apparatus |
| 09/05/2006 | US7100836 Module for contactless chip cards or identification systems |
| 09/05/2006 | US7100814 Method for preparing integrated circuit modules for attachment to printed circuit substrates |
| 09/05/2006 | US7100680 Integrated circuit heat pipe heat spreader with through mounting holes |
| 09/05/2006 | US7100679 Integrated circuit heat pipe heat spreader with through mounting holes |
| 09/05/2006 | US7100678 Phase-change heat dissipating device and method for manufacturing it |
| 09/05/2006 | US7100677 Integrated liquid cooling system for electrical components |
| 09/05/2006 | US7100676 Fan duct |
| 09/05/2006 | US7100279 Method of mounting an electronic part |
| 08/31/2006 | WO2006091940A1 Integrated circuit package with lead stops |
| 08/31/2006 | WO2006091856A1 Structure and method for fabricating flip chip devices |
| 08/31/2006 | WO2006091793A1 Microelectronic assemblies having compliancy |
| 08/31/2006 | WO2006091311A1 Apparatus and method for bonding wires |
| 08/31/2006 | WO2006091264A1 Method and system for treating a dielectric film |
| 08/31/2006 | WO2006091032A1 Lead frame |
| 08/31/2006 | WO2006090827A1 Electronic device and method for manufacturing same |
| 08/31/2006 | WO2006090684A1 Semiconductor element mounting member and semiconductor device using same |
| 08/31/2006 | WO2006090305A1 An integrated circuit device package with an additional contact pad, a lead frame and an electronic device |
| 08/31/2006 | WO2006090304A1 An integrated circuit package device with improved bond pad connections, a leadframe and an electronic device |
| 08/31/2006 | WO2006090204A1 Lead-frame circuit package |
| 08/31/2006 | WO2006089959A1 Metal interconnect structure and method |
| 08/31/2006 | WO2006089597A1 Micro-heat exchanger |
| 08/31/2006 | WO2006089337A1 Method of bonding substrates |
| 08/31/2006 | WO2006061792A3 Hermetically sealed integrated circuit package |
| 08/31/2006 | WO2006056648A3 Electronics module and method for manufacturing the same |
| 08/31/2006 | WO2006050690A3 Electronic component and method for the production thereof |
| 08/31/2006 | WO2006020822A3 Integrated circuit chip packaging assembly |
| 08/31/2006 | US20060195276 Configurable voltage regulator |
| 08/31/2006 | US20060194920 Thermally conductive adhesive composition and process for device attachment |
| 08/31/2006 | US20060194696 Oxygen-scavenging packaging |
| 08/31/2006 | US20060194453 Silicon dioxide film and process for preparation of the same |
| 08/31/2006 | US20060194451 High-k dielectric film, method of forming the same and related semiconductor device |
| 08/31/2006 | US20060194450 Semiconductor device and fabrication process of semiconductor device |
| 08/31/2006 | US20060194446 Plasma nitridization for adjusting transistor threshold voltage |
| 08/31/2006 | US20060194433 Anodized aluminum alloy coating on substrate |
| 08/31/2006 | US20060194425 Anisotropic conductive adhesive, electrode connection structure and method using the adhesive |
| 08/31/2006 | US20060194424 Microfeature devices and methods for manufacturing microfeature devices |
| 08/31/2006 | US20060194407 Application of impressed-current cathodic protection to prevent metal corrosion and oxidation |
| 08/31/2006 | US20060194390 Semiconductor device and method of manufacturing the same |
| 08/31/2006 | US20060194373 Methods for assembling semiconductor devices and interposers |
| 08/31/2006 | US20060194370 Radio frequency module and fabrication method thereof |
| 08/31/2006 | US20060194369 Carrier for substrate film |
| 08/31/2006 | US20060194367 Semiconductor device production method and semiconductor device |
| 08/31/2006 | US20060194366 Multi-chip ball grid array package |
| 08/31/2006 | US20060194365 Microelectronic assemblies having compliancy |
| 08/31/2006 | US20060194364 Micro-component packaging process and set of micro-components resulting from this process |
| 08/31/2006 | US20060194352 Semiconductor device test system |
| 08/31/2006 | US20060194348 Ferroelectric and high dielectric constant integrated circuit capacitors with three-dimensional orientation for high-density memories, and method of making the same |
| 08/31/2006 | US20060194124 Semiconductor device, method of manufacturing the same, and phase shift mask |
| 08/31/2006 | US20060194064 Underfill encapsulant for wafer packaging and method for its application |
| 08/31/2006 | US20060194063 Alicyclic epoxy resins, their preparation process, their compositions, epoxy resin cured product, and uses of alicyclic epoxy resin compositions |
| 08/31/2006 | US20060193116 Package for high frequency usages and its manufacturing method |
| 08/31/2006 | US20060192907 Method of fabricating array substrate having double-layered patterns |
| 08/31/2006 | US20060192845 Methods and systems for thermal-based laser processing a multi-material device |
| 08/31/2006 | US20060192647 Inductor formed in an integrated circuit |
| 08/31/2006 | US20060192577 Anisotropically conductive sheet |
| 08/31/2006 | US20060192572 Method and structure for measuring a bonding resistance |
| 08/31/2006 | US20060192303 Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus |
| 08/31/2006 | US20060192302 Self-compensating mark design for stepper alignment |
| 08/31/2006 | US20060192301 Semiconductor device with a protected active die region and method therefor |
| 08/31/2006 | US20060192300 Integrated circuit with staggered differential wire bond pairs |
| 08/31/2006 | US20060192299 Manufacturing method for electronic device |
| 08/31/2006 | US20060192298 Semiconductor device with surface-mountable outer contacts, and process for producing it |
| 08/31/2006 | US20060192297 System and method for reducing voltage drops in integrated circuits |
| 08/31/2006 | US20060192296 Chip carrier and system including a chip carrier and semiconductor chips |
| 08/31/2006 | US20060192295 Semiconductor package flip chip interconnect having spacer |
| 08/31/2006 | US20060192294 Chip scale package having flip chip interconnect on die paddle |
| 08/31/2006 | US20060192293 Electronic device, standoff member, and method of manufacturing electronic device |
| 08/31/2006 | US20060192292 Semiconductor chip package and method of manufacture |
| 08/31/2006 | US20060192291 Electronic device |
| 08/31/2006 | US20060192290 Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours |
| 08/31/2006 | US20060192289 Integrated connection arrangements |
| 08/31/2006 | US20060192288 Semiconductor integrated device and method of providing shield interconnection therein |
| 08/31/2006 | US20060192287 Interconnecting substrate and semiconductor device |
| 08/31/2006 | US20060192286 Semiconductor device |
| 08/31/2006 | US20060192285 Method for producing a plurality of electronic devices |
| 08/31/2006 | US20060192284 Heating mold and moving the mold surface to press the encapsulation layer on back surface of wafer so as not only to form a flat protection layer on back surface of wafer more quickly but also simplify the process flow by eliminating the step of smoothing the protecting layer |
| 08/31/2006 | US20060192283 Semiconductor wafer assemblies |
| 08/31/2006 | US20060192282 Semiconductor device |
| 08/31/2006 | US20060192281 Methods for sealing chambers of microelectronic packages |
| 08/31/2006 | US20060192280 Method of forming electronic devices |
| 08/31/2006 | US20060192279 Ultra thin dual chip image sensor package structure and method for fabrication |
| 08/31/2006 | US20060192278 Interface module for connecting LSI packages, and LSI-incorporating apparatus |
| 08/31/2006 | US20060192277 Chip stack employing a flex circuit |
| 08/31/2006 | US20060192276 Integrated circuit and wireless IC tag |
| 08/31/2006 | US20060192275 Encapsulation method for semiconductor device having center pad |
| 08/31/2006 | US20060192274 Semiconductor package having double layer leadframe |
| 08/31/2006 | US20060192273 Integrated circuit package and method of manufacture thereof |
| 08/31/2006 | US20060192272 Wafer level hermetically sealed MEMS device |
| 08/31/2006 | US20060192271 Method of manufacturing a dielectric layer and corresponding semiconductor device |
| 08/31/2006 | US20060192270 Semiconductor integrated circuit device and process for manufacturing the same |
| 08/31/2006 | US20060192260 Process for packaging micro-components using a matrix |
| 08/31/2006 | US20060192251 Bipolar-based SCR for electrostatic discharge protection |
| 08/31/2006 | US20060192236 Semiconductor device |
| 08/31/2006 | US20060192200 Test key structure |
| 08/31/2006 | US20060191714 High frequency multilayer circuit structure and method for the manufacture thereof |