| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/06/2006 | CN1828885A Transistor array and active-matrix substrate |
| 09/06/2006 | CN1828884A Semiconductor device and its manufacture method |
| 09/06/2006 | CN1828883A Semiconductor device and manufacturing method of the same |
| 09/06/2006 | CN1828882A Semiconductor device |
| 09/06/2006 | CN1828881A 电子装置 Electronic devices |
| 09/06/2006 | CN1828880A Semiconductor device for fingerprint recognition |
| 09/06/2006 | CN1828879A Flip-chip semiconductor device with improved power pad arrangement |
| 09/06/2006 | CN1828878A Microelectrode short-circuit-proof squeegee structure |
| 09/06/2006 | CN1828877A Heat sink, heat interface and cooling method for resistor |
| 09/06/2006 | CN1828876A Method and device for heat dissipation in semiconductor modules |
| 09/06/2006 | CN1828875A Liquid cooling type heat radiation module |
| 09/06/2006 | CN1828874A Semiconductor device and method for producing the same |
| 09/06/2006 | CN1828868A Image sensor with improved sensitivity and its production method |
| 09/06/2006 | CN1828853A Heat radiation type packaging structure and its making method |
| 09/06/2006 | CN1828638A Identification code, formation method of identification code, liquid droplet ejection apparatus, and electro-optic apparatus |
| 09/06/2006 | CN1827684A Cured product of epoxy resin composition and method for producing the same, and photosemiconductor device using the same |
| 09/06/2006 | CN1274186C Wiring board and its mfg. method |
| 09/06/2006 | CN1274020C 半导体集成电路装置 The semiconductor integrated circuit device |
| 09/06/2006 | CN1274019C Method of attaching pipe core on to substrate |
| 09/06/2006 | CN1274013C Semiconductor device and process for designing mask |
| 09/06/2006 | CN1274011C Crystalline grain in metal film growth control method |
| 09/06/2006 | CN1273986C Sound coding and decoding method, and transmitting and receiving method |
| 09/06/2006 | CN1273881C Heat-radiating module |
| 09/06/2006 | CN1273544C Electronic element for high frequency using low-dielectric loss angle tangent insulating material |
| 09/06/2006 | CN1273537C Wavelength exchange pouring material, its application and preparation method |
| 09/06/2006 | CN1273535C High-temp. under mould-filling material with low heat generating in use |
| 09/06/2006 | CN1273287C Composite film and lead wire frame covered with the same composite film |
| 09/06/2006 | CN1273249C Metal alloy particles without lead and its production method and use |
| 09/05/2006 | US7103869 Method of verifying IC mask sets |
| 09/05/2006 | US7103867 Method for manufacturing a power bus on a chip |
| 09/05/2006 | US7103861 Test structure for automatic dynamic negative-bias temperature instability testing |
| 09/05/2006 | US7102896 Electronic component module |
| 09/05/2006 | US7102890 Heat sink retention device |
| 09/05/2006 | US7102524 Die frame apparatus and method of transferring dies therewith |
| 09/05/2006 | US7102420 Semiconductor device and manufacturing method thereof |
| 09/05/2006 | US7102376 Power semiconductor module with detector for detecting main circuit current through power semiconductor element |
| 09/05/2006 | US7102363 Method and system for non-contact measurement of microwave capacitance of miniature structures of integrated circuits |
| 09/05/2006 | US7102268 Micromachine and method of fabricating the same |
| 09/05/2006 | US7102243 Mask-making member and its production method, mask and its making method, exposure process, and fabrication method of semiconductor device |
| 09/05/2006 | US7102242 Glass permits a protective encapsulation at relatively low temperatures, does not damage the diode despite high alkali content because of their low melt and working temperatures; diode is stress free during melting with the metallic connection wires |
| 09/05/2006 | US7102241 Leadless semiconductor package |
| 09/05/2006 | US7102240 Embedded integrated circuit packaging structure |
| 09/05/2006 | US7102239 Chip carrier for semiconductor chip |
| 09/05/2006 | US7102238 Semiconductor device and manufacturing method thereof |
| 09/05/2006 | US7102237 ASIC customization with predefined via mask |
| 09/05/2006 | US7102236 Carbon containing silicon oxide film having high ashing tolerance and adhesion |
| 09/05/2006 | US7102235 Conformal lining layers for damascene metallization |
| 09/05/2006 | US7102234 Method and structure for reduction of contact resistance of metal silicides using a metal-germanium alloy |
| 09/05/2006 | US7102233 Structure for strained channel field effect transistor pair having underlapped dual liners |
| 09/05/2006 | US7102232 Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer |
| 09/05/2006 | US7102231 Display device and manufacturing method thereof |
| 09/05/2006 | US7102230 Circuit carrier and fabrication method thereof |
| 09/05/2006 | US7102229 Capacitor containing high purity tantalum |
| 09/05/2006 | US7102228 Semiconductor device |
| 09/05/2006 | US7102227 Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof |
| 09/05/2006 | US7102226 Device and method for package warp compensation in an integrated heat spreader |
| 09/05/2006 | US7102225 Die-up ball grid array package with printed circuit board attachable heat spreader |
| 09/05/2006 | US7102224 Encapsulated component and method for the production thereof |
| 09/05/2006 | US7102223 Semiconductor device and a method of manufacturing the same |
| 09/05/2006 | US7102222 Conductive trace structure and semiconductor package having the conductive trace structure |
| 09/05/2006 | US7102221 Memory-Module with an increased density for mounting semiconductor chips |
| 09/05/2006 | US7102220 Multiple cavity/compartment package |
| 09/05/2006 | US7102219 Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument |
| 09/05/2006 | US7102218 Semiconductor package with chip supporting structure |
| 09/05/2006 | US7102217 Interposer substrates with reinforced interconnect slots, and semiconductor die packages including same |
| 09/05/2006 | US7102216 Semiconductor package and leadframe with horizontal leads spaced in the vertical direction and method of making |
| 09/05/2006 | US7102215 Surface-mountable light-emitting diode structural element |
| 09/05/2006 | US7102214 Pre-molded leadframe |
| 09/05/2006 | US7102213 Leadframe-based housing, leadframe strip, surface-mounted optoelectronic-component, and production method |
| 09/05/2006 | US7102212 Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof |
| 09/05/2006 | US7102211 Semiconductor device and hybrid integrated circuit device |
| 09/05/2006 | US7102210 Lead frame, manufacturing method of the same, and semiconductor device using the same |
| 09/05/2006 | US7102209 Substrate for use in semiconductor manufacturing and method of making same |
| 09/05/2006 | US7102208 Leadframe and semiconductor package with improved solder joint strength |
| 09/05/2006 | US7102206 Semiconductor substrate, method for fabricating the same, and method for fabricating semiconductor device |
| 09/05/2006 | US7102199 Low voltage transient voltage suppressor and method of making |
| 09/05/2006 | US7102198 Organic electroluminescent display device |
| 09/05/2006 | US7102197 Semiconductor device including first and second transistor groups and semiconductor integrated circuit device |
| 09/05/2006 | US7102196 Multi-layered printed circuit board for efficient electrostatic discharge protection |
| 09/05/2006 | US7102195 Transistor structure for electrostatic discharge protection circuit |
| 09/05/2006 | US7102165 Semiconductor device and manufacturing method thereof |
| 09/05/2006 | US7102159 Ultra thin image sensor package structure and method for fabrication |
| 09/05/2006 | US7102158 Light-based system for detecting analytes |
| 09/05/2006 | US7102085 Wiring substrate |
| 09/05/2006 | US7101804 Method for forming fuse integrated with dual damascene process |
| 09/05/2006 | US7101792 Methods of plating via interconnects |
| 09/05/2006 | US7101790 Method of forming a robust copper interconnect by dilute metal doping |
| 09/05/2006 | US7101785 Formation of a contact in a device, and the device including the contact |
| 09/05/2006 | US7101784 Method to generate porous organic dielectric |
| 09/05/2006 | US7101782 Method of making a circuitized substrate |
| 09/05/2006 | US7101781 Integrated circuit packages without solder mask and method for the same |
| 09/05/2006 | US7101779 Method of forming barrier layers |
| 09/05/2006 | US7101778 Transmission lines for CMOS integrated circuits |
| 09/05/2006 | US7101773 Method of producing a contact system on the rear of a component with stacked substrates |
| 09/05/2006 | US7101770 Capacitive techniques to reduce noise in high speed interconnections |
| 09/05/2006 | US7101751 Versatile system for limiting electric field degradation of semiconductor structures |
| 09/05/2006 | US7101738 Gate dielectric antifuse circuit to protect a high-voltage transistor |
| 09/05/2006 | US7101735 Manufacturing method of semiconductor device |
| 09/05/2006 | US7101734 Flip chip substrate design |
| 09/05/2006 | US7101733 Leadframe with a chip pad for two-sided stacking and method for manufacturing the same |