| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/07/2006 | US20060197197 Surface acoustic wave device and manufacruring method thereof |
| 09/07/2006 | US20060197196 Semiconductor device |
| 09/07/2006 | US20060197195 Integrated circuit package |
| 09/07/2006 | US20060197194 Laser-based technique for the fabrication of embedded electrochemical cells and electronic components |
| 09/07/2006 | US20060197191 Chip structure and wafer structure |
| 09/07/2006 | US20060197190 Method of fabricating wafer-level packaging with sidewall passivation and related apparatus |
| 09/07/2006 | US20060197188 Photodiode array and method for making thereof |
| 09/07/2006 | US20060197182 High frequency integrated circuits |
| 09/07/2006 | US20060197180 Three-dimensional memory structure and manufacturing method thereof |
| 09/07/2006 | US20060197168 Semiconductor device, magnetic sensor, and magnetic sensor unit |
| 09/07/2006 | US20060197162 Semiconductor devices having a buried and enlarged contact hole and methods of fabricating the same |
| 09/07/2006 | US20060197119 Method for forming suspended transmission line structures in back end of line processing |
| 09/07/2006 | US20060197118 Detection of molecular interactions using a field effect transistor |
| 09/07/2006 | DE19830820B4 Oberflächenmontierbares elektronisches Keramikbauteil Surface mount ceramic electronic part |
| 09/07/2006 | DE19781646B4 Spannungstolerante elektrostatische Entladungsschutzeinrichtung Voltage tolerant electrostatic discharge protection device |
| 09/07/2006 | DE19651566B4 Chip-Modul sowie Verfahren zu dessen Herstellung und eine Chip-Karte -Chip module and method for its production and a chip card |
| 09/07/2006 | DE10347622B4 Substrat mit Lötpad zur Herstellung einer Lötverbindung Substrate with solder pad for making a solder connection |
| 09/07/2006 | DE102006009504A1 Component module with cooling fins consisting of connector and numerous cooling fins and made of heat conductive materials containing metal and crystalline carbon with high heat conductive coefficient |
| 09/07/2006 | DE102006007527A1 Coated metal element for cooler of electronic installation consisting of at least one metal element and one coating formed of crystalline carbon with high thermal conductivity coefficient |
| 09/07/2006 | DE102006005050A1 Semiconductor device for controlling motor, has electrode wiring parts coming out from respective side sections of extraction electrode and electrically connected only with respective connection electrodes arranged on emitter electrode |
| 09/07/2006 | DE102006004636A1 Cooling system for electronic microchips has a heat sink, a heat exchanger and a pump to circulate a liquid between the heat sink and the heat exchanger via connection tubes |
| 09/07/2006 | DE102006003754A1 Air cooler system for chips with fan, numerous cooling fins, cooler body and heat exchange tube, with cooler body formed by metal and crystalline carbon of high heat |
| 09/07/2006 | DE102006002889A1 Erzeugen einer internen Referenzspannung zum Testen von integrierten Schaltkreisen Generating an internal reference voltage for testing of integrated circuits |
| 09/07/2006 | DE102005019375A1 LED-Array LED array |
| 09/07/2006 | DE102005009163A1 Halbleiterbauteil mit einem Halbleiterchip, der Signalkontaktflächen und Versorgungskontaktflächen aufweist, sowie Verfahren zur Herstellung des Halbleiterbauteils A semiconductor component comprising a semiconductor chip, the signal pads and supply pads, and methods for producing the semiconductor device |
| 09/07/2006 | DE102005009138A1 Resistor circuit for use in IC (integrated circuit), has MOSFET whose drain is connected to feedback resistor which is operated by pre-loading based on reference current, and current mirror circuit for producing reference current |
| 09/07/2006 | DE102005009060A1 Modul mit strahlungsemittierenden Halbleiterkörpern Module with radiation-emitting semiconductor bodies |
| 09/07/2006 | DE102005008772A1 Chip, has substrate with substrate surface having stress dependence of performance of electrical component, inclined area with area surface having another stress dependence of performance of component, where two dependences are different |
| 09/07/2006 | DE102005008361A1 Cooling assembly for electronic components, has cooling material that contacts heat-side of cooling unit, which converts heat energy of material into current energy that is supplied to cooling fan via contact bridge |
| 09/07/2006 | DE102005007840A1 Semiconductor device, has contact channel with specified angle in direction normal to planar interfaces, conducting paths arranged vertically and isolated, and paths arranged vertically that are connected by contact channel |
| 09/07/2006 | DE10196240B4 Flammschutzmittel für Epoxyharze auf Basis von rotem Phosphor und Verfahren zur Herstellung derselben Flame retardants for epoxy resins based on red phosphorus, and methods for making same |
| 09/07/2006 | DE10123818B4 Anordnung mit Schutzfunktion für ein Halbleiterbauelement Arrangement with a protective function for a semiconductor device |
| 09/06/2006 | EP1699277A1 Ceramic multilayer substrate |
| 09/06/2006 | EP1699082A1 Solid-state image sensing device |
| 09/06/2006 | EP1699081A1 Solid-state imaging device, its production method, camera with the solid-state imaging device, and light-receiving chip |
| 09/06/2006 | EP1699080A1 Ceramic circuit sustrate and manufacturing method thereof |
| 09/06/2006 | EP1699079A2 Electronic device, standoff member, and method of manufacturing electronic device |
| 09/06/2006 | EP1699078A1 Ic chip mounting body manufacturing method and manufacturing device |
| 09/06/2006 | EP1699056A1 A semiconductor memory module and a multi-layer circuit bord for |
| 09/06/2006 | EP1698664A1 Curable resin composition |
| 09/06/2006 | EP1698460A1 Multilayer body |
| 09/06/2006 | EP1697991A1 Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same |
| 09/06/2006 | EP1697990A1 Assembly of a component mounted on a transfer surface |
| 09/06/2006 | EP1697989A2 Connector for making electrical contact at semiconductor scales and method for forming same |
| 09/06/2006 | EP1697988A2 Customized microelectronic device and method for making customized electrical interconnections |
| 09/06/2006 | EP1697987A1 Electronic packaging materials for use with low-k dielectric-containing semiconductor devices |
| 09/06/2006 | EP1697985A1 Combinations of resin compositions and methods of use thereof |
| 09/06/2006 | EP1697973A1 Small volume process chamber with hot inner surfaces |
| 09/06/2006 | EP1697966A2 Method and device for the alternating contacting of two wafers |
| 09/06/2006 | EP1697255A1 Method for containing a device and a corresponding device |
| 09/06/2006 | EP1697239A2 Manufacturing system and apparatus for balanced product flow with application to low-stress underfiling of flip-chip electronic devices |
| 09/06/2006 | EP1697175A1 Control unit and method for producing the same |
| 09/06/2006 | EP1611610A4 Thermal apparatus for engaging electronic device |
| 09/06/2006 | EP1470588B1 Split-gate power module and method for suppressing oscillation therein |
| 09/06/2006 | EP1430533A4 Test structures and models for estimating the yield impact of dishing and/or voids |
| 09/06/2006 | EP1430007B1 Brazeable matallizations for diamond components |
| 09/06/2006 | EP1285463B1 Fuse link |
| 09/06/2006 | EP1018161B1 Method and device for reducing electric field concentrations in soi semiconductor components |
| 09/06/2006 | CN2814674Y Novel integrated circuit or discrete component ultrathin pinless packaging structure |
| 09/06/2006 | CN2814673Y Inverted welding packaging structure with low-fusing point large area convex point |
| 09/06/2006 | CN2814672Y Radiator fixing base |
| 09/06/2006 | CN2814671Y Semiconductor cooling and radiating device of CPU |
| 09/06/2006 | CN2814670Y Flow guiding assembly |
| 09/06/2006 | CN2814669Y Radiating device |
| 09/06/2006 | CN2814668Y CPU radiator and substrate thereof |
| 09/06/2006 | CN2814498Y Notebook computer liquid radiating device |
| 09/06/2006 | CN1830091A H-bridge with single lead frame |
| 09/06/2006 | CN1830084A Integrated circuit package having stacked integrated circuits and method therefor |
| 09/06/2006 | CN1830083A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 09/06/2006 | CN1830082A Phase change thermal interface materials using polyester resin and clay filled |
| 09/06/2006 | CN1830081A Semiconductor device and method of fabricating the same |
| 09/06/2006 | CN1830080A High-heat-resistant semiconductor device |
| 09/06/2006 | CN1830079A Crack stop for low K dielectrics |
| 09/06/2006 | CN1829999A RFID device and method of making |
| 09/06/2006 | CN1829430A Minitype thermoacoustic refrigerator module device |
| 09/06/2006 | CN1829420A Printed circuit board with embedded capacitors therein and manufacturing process thereof |
| 09/06/2006 | CN1829416A Embedded chip printed circuit board and method of manufacturing the same |
| 09/06/2006 | CN1829415A Composite structure of flexible printed circuit and electronic component |
| 09/06/2006 | CN1829414A Transmission line and wiring forming method |
| 09/06/2006 | CN1829008A Socket and package power/ground bar apparatus that increases current carrying capacity resulting in higher IC power delivery |
| 09/06/2006 | CN1828959A Semiconductor light emitting device |
| 09/06/2006 | CN1828956A Heat radiation packaging for high power LED |
| 09/06/2006 | CN1828954A Diode structure with anti-spike and static electricity and making process |
| 09/06/2006 | CN1828932A Semiconductor device, electronic device, and method of manufacturing semiconductor device |
| 09/06/2006 | CN1828931A Semiconductor device, electronic device, and method of manufacturing semiconductor device |
| 09/06/2006 | CN1828926A 有机发光显示装置 The organic light emitting display device |
| 09/06/2006 | CN1828921A Heterogeneous integrated high voltage DC/AC light emitter |
| 09/06/2006 | CN1828920A Solid-state image sensing device |
| 09/06/2006 | CN1828918A Solid state imaging apparatus and method for fabricating the same |
| 09/06/2006 | CN1828898A 半导体装置 Semiconductor device |
| 09/06/2006 | CN1828897A 半导体装置 Semiconductor device |
| 09/06/2006 | CN1828896A Static discharge protection circuit and its diode |
| 09/06/2006 | CN1828895A Electrical fuse circuit capable of multiple-time fuse and multiple-time electrical fuse executing method |
| 09/06/2006 | CN1828893A Esd protection apparatus for an electrical device |
| 09/06/2006 | CN1828892A Semiconductor integrated circuit, D-A converter device, and A-D converter device |
| 09/06/2006 | CN1828890A IC and stack chip set with routing layer |
| 09/06/2006 | CN1828889A Ultrafast recovery diode module |
| 09/06/2006 | CN1828888A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof |
| 09/06/2006 | CN1828887A Chip type minitype connector and its packaging method |
| 09/06/2006 | CN1828886A Signal line, thin film transistor array panel with the signal line, and method for manufacturing the same |