| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/12/2006 | US7105383 Packaged semiconductor with coated leads and method therefore |
| 09/12/2006 | US7105382 Self-aligned electrodes contained within the trenches of an electroosmotic pump |
| 09/12/2006 | US7105379 Implementation of protection layer for bond pad protection |
| 09/12/2006 | US7105378 Method of forming a leadframe for a semiconductor package |
| 09/12/2006 | US7104804 Method and apparatus for memory module circuit interconnection |
| 09/12/2006 | US7104313 Apparatus for using fluid laden with nanoparticles for application in electronic cooling |
| 09/12/2006 | US7104312 Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device |
| 09/12/2006 | CA2433462C Printed circuit board, method for producing same and semiconductor device |
| 09/12/2006 | CA2398613C Substrate and production method therefor |
| 09/08/2006 | WO2006094132A1 Full coverage spray and drainage system and method for orientation-independent removal of high heat flux |
| 09/08/2006 | WO2006094040A2 A method for pattern metalization of substrates |
| 09/08/2006 | WO2006093625A1 Conductive pad with high abrasion |
| 09/08/2006 | WO2006093378A1 Marking method of fiber laser marker |
| 09/08/2006 | WO2006093293A1 Ceramic multilayer board and method for manufacturing same |
| 09/08/2006 | WO2006093263A1 Method for forming tantalum nitride film |
| 09/08/2006 | WO2006093262A1 Method for forming tantalum nitride film |
| 09/08/2006 | WO2006093261A1 Method for forming tantalum nitride film |
| 09/08/2006 | WO2006093260A1 Method for forming tantalum nitride film |
| 09/08/2006 | WO2006093259A1 Method for forming tantalum nitride film |
| 09/08/2006 | WO2006093258A1 Method for forming tantalum nitride film |
| 09/08/2006 | WO2006093233A1 Copper alloy and method for production thereof |
| 09/08/2006 | WO2006093203A1 Epoxy resin composition, cured object obtained therefrom, semiconductor-encapsulating material, novel phenolic resin, and novel epoxy resin |
| 09/08/2006 | WO2006093191A1 Semiconductor package and its manufacturing method |
| 09/08/2006 | WO2006093129A1 Functional element mounting module and mounting method of functional element mounting module |
| 09/08/2006 | WO2006093023A1 Semiconductor device and method for manufacturing same |
| 09/08/2006 | WO2006092756A1 Electronic device and use thereof |
| 09/08/2006 | WO2006092754A2 A method of manufacturing a semiconductor packages and packages made |
| 09/08/2006 | WO2006092200A1 Weldable contact and method for the production thereof |
| 09/08/2006 | WO2006092117A1 Semiconductor element and method for production of a semiconductor element |
| 09/08/2006 | WO2006072102A3 Systems for integrated pump and cold plate |
| 09/08/2006 | WO2006071617A3 Semiconductor structures utilizing thin film resistors and tungsten plug connectors and methods for making the same |
| 09/08/2006 | WO2006055906A3 Assembly for regulating the temperature of an integrated circuit |
| 09/08/2006 | WO2006050205A3 Refractory metal substrate with improved thermal conductivity |
| 09/08/2006 | WO2006017345A3 Apparatus for suspending a chip-scale device and atomic clock system |
| 09/08/2006 | WO2006012110A3 Integrated transistor module and method of fabricating same |
| 09/08/2006 | WO2005109498A3 Cut-out heat slug for integrated circuit device packaging |
| 09/08/2006 | WO2005086223A3 Multi-layer overlay measurement and correction technique for ic manufacturing |
| 09/08/2006 | WO2005013319A3 Semiconductor device with strain relieving bump design |
| 09/07/2006 | US20060199915 Modified cycloolefin copolymer, process for producing the same, and use of the polymer |
| 09/07/2006 | US20060199406 Particle Distribution Interposer and Method of Manufacture Thereof |
| 09/07/2006 | US20060199405 Anisotropic conductive connector and circuit-device electrical inspection device |
| 09/07/2006 | US20060199390 Simultaneous and selective partitioning of via structures using plating resist |
| 09/07/2006 | US20060199387 Local multilayered metallization |
| 09/07/2006 | US20060199376 Manufacturing method for semiconductor device |
| 09/07/2006 | US20060199368 Interconnect arrangement and associated production methods |
| 09/07/2006 | US20060199363 Microelectronic devices and methods for forming interconnects in microelectronic devices |
| 09/07/2006 | US20060199360 Cladded silver and silver alloy metallization for improved adhesion and electromigration resistance |
| 09/07/2006 | US20060199353 Wafer bonding of thinned electronic materials and circuits to high performance substrate |
| 09/07/2006 | US20060199313 Thin film semiconductor device and method of manufacturing a thin film semiconductor device |
| 09/07/2006 | US20060199310 Semiconductor integrated circuit and semiconductor device |
| 09/07/2006 | US20060199309 High thermal conductive compounds |
| 09/07/2006 | US20060199307 Ultra thin dual chip image sensor package structure and method for fabrication |
| 09/07/2006 | US20060199306 Chip structure and manufacturing process thereof |
| 09/07/2006 | US20060199303 Carrier for substrate film |
| 09/07/2006 | US20060199300 IC chip solder bump structure and method of manufacturing same |
| 09/07/2006 | US20060199298 Creation of hermetically sealed dielectrically isolating trenches |
| 09/07/2006 | US20060199286 System for reviewing defects, a computer implemented method for reviewing defects, and a method for fabricating electronic devices |
| 09/07/2006 | US20060199012 Manufacture of porous diamond films |
| 09/07/2006 | US20060198982 Pivot ring |
| 09/07/2006 | US20060198179 Multi-resistive integrated circuit memory |
| 09/07/2006 | US20060198105 Method and Apparatus for Cooling a Circuit Component |
| 09/07/2006 | US20060197237 Semiconductor device and semiconductor wafer |
| 09/07/2006 | US20060197236 Curable composition having low coefficient of thermal expansion, method of making an integrated circuit, and an integrated circuit made there from |
| 09/07/2006 | US20060197235 Electronic device components including protective layers on surfaces thereof |
| 09/07/2006 | US20060197234 Semiconductor device including a semiconductor chip with signal contact areas and supply contact areas, and method for producing the semiconductor device |
| 09/07/2006 | US20060197233 Die attach material for TBGA or flexible circuitry |
| 09/07/2006 | US20060197232 Planar microspring integrated circuit chip interconnection to next level |
| 09/07/2006 | US20060197231 Backend metallization method and device obtained therefrom |
| 09/07/2006 | US20060197229 Semiconductor device |
| 09/07/2006 | US20060197228 Single mask process for variable thickness dual damascene structures, other grey-masking processes, and structures made using grey-masking |
| 09/07/2006 | US20060197227 Semiconductor structures and methods for fabricating semiconductor structures comprising high dielectric constant stacked structures |
| 09/07/2006 | US20060197226 Nonvolatile semiconductor memory device having element isolating region of trench type |
| 09/07/2006 | US20060197225 Electrically conductive line, method of forming an electrically conductive line, and method of reducing titanium silicide agglomeration in fabrication of titanium silicide over polysilicon transistor gate lines |
| 09/07/2006 | US20060197224 Multilayered cap barrier in microelectronic interconnect structures |
| 09/07/2006 | US20060197223 System for different bond pads in an integrated circuit package |
| 09/07/2006 | US20060197222 Arrangement of an electrical component placed on a substrate, and method for producing the same |
| 09/07/2006 | US20060197221 Integrated Circuit Having Memory Disposed Thereon and Method of Making Thereof |
| 09/07/2006 | US20060197220 Semiconductor device having a plastic housing and external connections and method for producing the same |
| 09/07/2006 | US20060197219 Heat sink and package structure |
| 09/07/2006 | US20060197218 Hip package structure |
| 09/07/2006 | US20060197217 Semiconductor package structure and method for manufacturing the same |
| 09/07/2006 | US20060197216 Semiconductor package structure and method for manufacturing the same |
| 09/07/2006 | US20060197215 Hermetic MEMS package and method of manufacture |
| 09/07/2006 | US20060197214 Integrated circuit chip |
| 09/07/2006 | US20060197213 Magnetic self-assembly for integrated circuit packages |
| 09/07/2006 | US20060197212 Semiconductor device, method for designing the same and recording medium that can be read by computer in which program for designing semiconductor device is recorded |
| 09/07/2006 | US20060197211 Semiconductor device and method of stacking semiconductor chips |
| 09/07/2006 | US20060197210 Stack semiconductor package formed by multiple molding and method of manufacturing the same |
| 09/07/2006 | US20060197209 Stacked integrated circuits package system with dense routability and high thermal conductivity |
| 09/07/2006 | US20060197208 Chip-packaging with bonding options having a plurality of package substrates |
| 09/07/2006 | US20060197207 Integrated circuit package system with die and package combination |
| 09/07/2006 | US20060197206 Stacked device package for peripheral and center device pad layout device |
| 09/07/2006 | US20060197205 Stacked semiconductor packages and method therefor |
| 09/07/2006 | US20060197204 Semiconductor device |
| 09/07/2006 | US20060197203 Die structure of package and method of manufacturing the same |
| 09/07/2006 | US20060197202 Photo detector package |
| 09/07/2006 | US20060197201 Image sensor structure |
| 09/07/2006 | US20060197200 Semiconductor device |
| 09/07/2006 | US20060197199 Leadframe, coining tool, and method |
| 09/07/2006 | US20060197198 Semiconductor package with passive device integration |