Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2006
09/13/2006CN1832643A Organic electroluminescence display and manufacturing method thereof
09/13/2006CN1832216A Casing of LED and its LEd
09/13/2006CN1832212A Led mounting having increased heat dissipation
09/13/2006CN1832184A Active component array substrate
09/13/2006CN1832181A Display substrate
09/13/2006CN1832178A Semiconductor device and method of manufacturing the same
09/13/2006CN1832177A Picture element structure and liquid crystal display and manufacturing method thereof
09/13/2006CN1832174A Semiconductor apparatus
09/13/2006CN1832170A Optical semiconductor device and method for manufacturing the same, electronic device,
09/13/2006CN1832166A Semiconductor device and a method for manufacturing the same
09/13/2006CN1832165A Stacked dram memory chip for a dual inline memory module (dimm)
09/13/2006CN1832162A Rectangular nitride semiconductor substrate with identified inner and outer surfaces
09/13/2006CN1832161A Test key structure
09/13/2006CN1832160A Interconnect arrangement and associated production methods
09/13/2006CN1832159A Semiconductor component
09/13/2006CN1832158A Lead frame, sensor including lead frame, resin composition, and sensor including the resin mold
09/13/2006CN1832157A Semiconductor power module
09/13/2006CN1832156A Structure of heat sink and manufacturing method
09/13/2006CN1832155A Structure for heat dissipation of integrated circuit chip and display module including the same
09/13/2006CN1832154A Heat spreader and package structure utilizing the same
09/13/2006CN1832153A Positioning fixture of heat sink module and assembling method
09/13/2006CN1832152A Semiconductor package and fabrication method thereof
09/13/2006CN1832151A Underlay with pattern and method of manufacturing the same, semiconductor device and method of manufacturing the same
09/13/2006CN1832149A Film transistor array substrate and its manufacturing method
09/13/2006CN1832130A Semiconductor device and method of manufacturing the same
09/13/2006CN1832129A Integrate circuit and method for making the same
09/13/2006CN1832128A Method of manufacturing interconnection structure and interconnection structure forming by thereof
09/13/2006CN1832127A A semiconductor device and a method of manufacturing thereof
09/13/2006CN1832121A Signal redistribution using bridge layer for multichip module
09/13/2006CN1275502C Electronic device used water cooling device
09/13/2006CN1275460C Cloche for solid camera element
09/13/2006CN1275331C Semiconductor device with reduced line-to-line capacitance and cross talk noise
09/13/2006CN1275330C Optical module, circuit board and its electronic machine
09/13/2006CN1275328C Semiconductor chip and semiconductor device using said semiconductor chip
09/13/2006CN1275326C Electrostatic discharge protection circuit
09/13/2006CN1275325C Semiconductor device and making method thereof
09/13/2006CN1275324C Semiconductor device and producing method thereof
09/13/2006CN1275312C Semiconductor device and its producing method, laminated semiconductor device and circuit base board
09/13/2006CN1275307C Wiring basilar plate with position information
09/13/2006CN1275306C Electronic parts bonding method and electronic parts bonding apparatus
09/13/2006CN1275305C Extension of fatigue life for C4 solder ball in chip to substrate connection
09/13/2006CN1275304C Bump formation method and bump forming appts appts. to semiconductor wafer
09/13/2006CN1275297C Material for forming low dielectric constant insulation film, low dielectric constant insulation film, its forming method and semiconductor
09/13/2006CN1275264C Structure of transient over-voltage protector element
09/13/2006CN1274744C Flame retardant molding compositions
09/13/2006CN1274491C Stripping film
09/13/2006CN1274425C Waveform generating apparatus for microdeposition control system
09/12/2006US7107019 Methods of operating microelectronic devices, and methods of providing microelectronic devices
09/12/2006US7106766 Optical device, method of manufacturing the same, optical module, optical transmission system
09/12/2006US7106644 Memory device and method for burn-in test
09/12/2006US7106592 Coolant cooled type semiconductor device
09/12/2006US7106591 Locking device for heat sink
09/12/2006US7106590 Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems
09/12/2006US7106589 Heat sink, assembly, and method of making
09/12/2006US7106588 Power electronic system with passive cooling
09/12/2006US7106164 Apparatus and method for electronic fuse with improved ESD tolerance
09/12/2006US7106108 Semiconductor integrated circuit and evaluation method of wiring in the same
09/12/2006US7106091 Circuit configuration and method for detecting an unwanted attack on an integrated circuit
09/12/2006US7105933 Semiconductor integrated circuit device and manufacturing method of the same
09/12/2006US7105932 Power semiconductor module
09/12/2006US7105931 Electronic package and method
09/12/2006US7105930 Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same
09/12/2006US7105929 Semiconductor device
09/12/2006US7105928 Copper wiring with high temperature superconductor (HTS) layer
09/12/2006US7105927 Structure of dummy pattern in semiconductor device
09/12/2006US7105926 Routing scheme for differential pairs in flip chip substrates
09/12/2006US7105925 Differential planarization
09/12/2006US7105924 Integrated circuit housing
09/12/2006US7105923 Device and method for including passive components in a chip scale package
09/12/2006US7105922 Electrode-type heat sink
09/12/2006US7105921 Semiconductor assemblies having electrophoretically insulated vias
09/12/2006US7105920 Substrate design to improve chip package reliability
09/12/2006US7105919 Semiconductor package having ultra-thin thickness and method of manufacturing the same
09/12/2006US7105918 Interposer with flexible solder pad elements and methods of manufacturing the same
09/12/2006US7105917 Semiconductor device having a fuse connected to a pad and fabrication method thereof
09/12/2006US7105916 Inlet for an electronic tag
09/12/2006US7105915 Chip carrier a chip module and method of manufacturing the chip module
09/12/2006US7105914 Integrated circuit and seed layers
09/12/2006US7105913 Two-layer patterned resistor
09/12/2006US7105910 Semiconductor device having SOI construction
09/12/2006US7105898 Electronic circuit
09/12/2006US7105896 Thin film transistor circuit device, production method thereof and liquid crystal display using the think film transistor circuit device
09/12/2006US7105895 Epitaxial SiOx barrier/insulation layer
09/12/2006US7105882 Semiconductor device memory cell
09/12/2006US7105873 Semiconductor device and method for patterning
09/12/2006US7105871 Semiconductor device
09/12/2006US7105860 Flip chip light-emitting diode package
09/12/2006US7105858 Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density
09/12/2006US7105464 Semiconductor device and method of fabricating the same
09/12/2006US7105462 Lamination of organic semiconductor
09/12/2006US7105451 Method for manufacturing semiconductor device
09/12/2006US7105437 Methods for creating electrophoretically insulated vias in semiconductive substrates
09/12/2006US7105436 Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing
09/12/2006US7105428 Systems and methods for nanowire growth and harvesting
09/12/2006US7105423 Method of manufacturing semiconductor device
09/12/2006US7105422 Thin film circuit device, manufacturing method thereof, electro-optical apparatus, and electronic system
09/12/2006US7105420 Method to fabricate horizontal air columns underneath metal inductor
09/12/2006US7105419 Thin-film semiconductor substrate, method of manufacturing thin-film semiconductor substrate, method of crystallization, apparatus for crystallization, thin-film semiconductor device, and method of manufacturing thin-film semiconductor device
09/12/2006US7105388 Method of forming at least one interconnection to a source/drain region in silicon-on-insulator integrated circuitry
09/12/2006US7105384 Circuit device manufacturing method including mounting circuit elements on a conductive foil, forming separation grooves in the foil, and etching the rear of the foil