| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/14/2006 | US20060202346 Copper interconnection with conductive polymer layer and method of forming the same |
| 09/14/2006 | US20060202345 Barrier layers for conductive features |
| 09/14/2006 | US20060202344 Printed Wiring Board and Method for Manufacturing The Same |
| 09/14/2006 | US20060202343 Oxygen doped SiC for Cu barrier and etch stop layer in dual damascene fabrication |
| 09/14/2006 | US20060202342 Method to fabricate interconnect structures |
| 09/14/2006 | US20060202341 Semiconductor device, and method of manufacturing the same |
| 09/14/2006 | US20060202340 Semiconductor device and method of manufacturing the same |
| 09/14/2006 | US20060202338 Integrated interconnect arrangement |
| 09/14/2006 | US20060202337 Electronic device and use thereof |
| 09/14/2006 | US20060202336 Semiconductor device and method of fabricating a semiconductor device |
| 09/14/2006 | US20060202335 Tape ball grid array package with electromagnetic interference protection and method for fabricating the package |
| 09/14/2006 | US20060202334 Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same |
| 09/14/2006 | US20060202333 Package of a semiconductor device with a flexible wiring substrate and method for the same |
| 09/14/2006 | US20060202332 Semiconductor chip packaging apparatus and method of manufacturing semiconductor chip package |
| 09/14/2006 | US20060202331 Conductive bump structure of circuit board and method for fabricating the same |
| 09/14/2006 | US20060202329 Chip package and fabricating method thereof |
| 09/14/2006 | US20060202328 Memory module and memory configuration with stub-free signal lines and distributed capacitive loads |
| 09/14/2006 | US20060202327 Semiconductor device, semiconductor body and method of manufacturing thereof |
| 09/14/2006 | US20060202326 Heat spreader and package structure utilizing the same |
| 09/14/2006 | US20060202325 Method and structure to provide balanced mechanical loading of devices in compressively loaded environments |
| 09/14/2006 | US20060202324 Semiconductor power module |
| 09/14/2006 | US20060202323 Semiconductor module |
| 09/14/2006 | US20060202322 Interposer, and multilayer printed wiring board |
| 09/14/2006 | US20060202321 Impedance matching external component connections with uncompensated leads |
| 09/14/2006 | US20060202320 Power semiconductor package |
| 09/14/2006 | US20060202319 Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads |
| 09/14/2006 | US20060202318 Imaging module and method for forming the same |
| 09/14/2006 | US20060202317 Method for MCP packaging for balanced performance |
| 09/14/2006 | US20060202316 Semiconductor component having stiffener, circuit decal and terminal contacts |
| 09/14/2006 | US20060202315 Microelectronic devices having conductive complementary structures and methods of manufacturing microelectronic devices have conductive complementary structures |
| 09/14/2006 | US20060202314 Semiconductor package and method for manufacturing the same |
| 09/14/2006 | US20060202313 High performance chip scale leadframe with t-shape die pad and method of manufacturing package |
| 09/14/2006 | US20060202311 LOW k DIELECTRIC CVD FILM FORMATION PROCESS WITH IN-SITU IMBEDDED NANOLAYERS TO IMPROVE MECHANICAL PROPERTIES |
| 09/14/2006 | US20060202302 Adjustable self-aligned air gap dielectric for low capacitance wiring |
| 09/14/2006 | US20060202283 Metal silicide adhesion layer for contact structures |
| 09/14/2006 | US20060202282 Semiconductor device and a method of manufacturing the same and designing the same |
| 09/14/2006 | US20060202273 Method of manufacturing semiconductor device |
| 09/14/2006 | US20060202228 Semiconductor device |
| 09/14/2006 | US20060202217 Nitride semiconductor light emitting device and method of manufacturing the same |
| 09/14/2006 | US20060202201 Wafer-level package having test terminal |
| 09/14/2006 | US20060202041 Integrated circuit card and a method for manufacturing the same |
| 09/14/2006 | US20060201997 Fine pad pitch organic circuit board with plating solder and method for fabricating the same |
| 09/14/2006 | US20060201907 etching to form a plurality of electrically conductive islands in a working layer of a multilayer structure made from semiconductor materials; selectively masking certain regions to define several islands therein; use in microelectronics, optics and optoelectronics |
| 09/14/2006 | US20060201709 Low profile small outline leadless semiconductor device package |
| 09/14/2006 | US20060201705 Electrical device allowing for increased device densities |
| 09/14/2006 | US20060201704 Stacked microfeature devices and associated methods |
| 09/14/2006 | US20060201703 Flip chip mounting substrate |
| 09/14/2006 | US20060201279 Methods of refining lead-containing materials |
| 09/14/2006 | US20060201161 Cooling device for electronic component using thermo-electric conversion material |
| 09/14/2006 | US20060200977 Method of making circuitized substrate with signal wire shielding |
| 09/14/2006 | US20060200958 Method of manufacture of ceramic composite wiring structures for semiconductor devices |
| 09/14/2006 | DE202006006333U1 Heat radiator for computer, has heat radiating modules with cooling fins connected with pipelines, respectively, where waste heat produced by heat source e.g. central processing unit, is discharged through paths of modules and cooler |
| 09/14/2006 | DE202006005492U1 Cooling module, has cooling ventilator comprising frame and blade wheel, and heat sink provided with cooling fins having openings for accommodating cooling ventilator horizontally or vertically |
| 09/14/2006 | DE19602436B4 Verfahren zur Montage eines Rahmens auf ein Trägermaterial und Vorrichtung zur Durchführung des Verfahrens Method for mounting a frame on a carrier material and apparatus for carrying out the method |
| 09/14/2006 | DE112004002172T5 Mikropin-Wärmetauscher Mikropin heat exchanger |
| 09/14/2006 | DE10345395B4 Halbleitermodul und Verfahren zur Herstellung eines Halbleitermoduls Semiconductor module and method for manufacturing a semiconductor module |
| 09/14/2006 | DE102006009561A1 Stapel aus Chips mit einer flexiblen Verbindung Stack of chips with a flexible connection |
| 09/14/2006 | DE102006006930A1 LED-Baugruppe mit einer LED-Positionierungsschablone und ein Verfahren zur Herstellung einer LED-Baugruppe unter Verwendung einer LED-Positionierungsschablone LED assembly having an LED positioning plate and a method for manufacturing a LED package using a LED positioning plate |
| 09/14/2006 | DE102006004192A1 Heat exchange tube for cooling chip, comprises closed tube with capillary structure for carrying condensed fluid back to heat-receiving end |
| 09/14/2006 | DE102005056263A1 Äußere Impedanzabgleichskomponentenverbindungen mit nicht kompensierten Anschlussleitungen External impedance matching components connections with non-compensated connection cables |
| 09/14/2006 | DE102005011028A1 Kupferbonddraht mit verbesserten Bond- und Korrosionseigenschaften Copper bonding wire with improved bonding and corrosion properties |
| 09/14/2006 | DE102005010582A1 Verfahren und Vorrichtung zur Inaktivierung von Trapping-Effekten in dotierten Halbleitern Method and apparatus for the inactivation of trapping effects in doped semiconductors |
| 09/14/2006 | DE102005010337A1 Semiconductor body component arrangement, has load failure detector with measuring zone of circuit type complementary to connection zone and evaluation circuit with comparator circuit providing load failure signal |
| 09/14/2006 | DE102005010311A1 Verfahren und Gießform zur Herstellung eines optischen Halbleitermoduls A method and mold for producing an optical semiconductor module |
| 09/14/2006 | DE102005010013A1 Current regulator for use in IC (integrated circuit), has evaluation and control circuit connected to sensing resistor, provided in load path of transistor, to control transistor based on voltage of sensing resistor |
| 09/14/2006 | DE102005009164A1 Contact connector surface for semiconductor component, has heater structure electrically isolated from surface and including metallic conducting paths, which surround surface at its edges and arranged meander shaped under surface |
| 09/14/2006 | DE102005008476A1 Leitbahnanordnung sowie zugehörige Herstellungsverfahren Interconnect arrangement and associated manufacturing processes |
| 09/14/2006 | DE10134187B4 Kühleinrichtung für Halbleitermodule Cooling device for semiconductor modules |
| 09/13/2006 | EP1701385A1 Semiconductor device comprising electrostatic breakdown protection element |
| 09/13/2006 | EP1701383A1 Contact pad adapter for semiconductor package |
| 09/13/2006 | EP1701382A1 Chip-based CPU cooler and cooling method thereof |
| 09/13/2006 | EP1701381A2 Ceramic circuit board |
| 09/13/2006 | EP1701380A2 Semiconductor power module |
| 09/13/2006 | EP1701379A2 Semiconductor device and manufacturing method of the same |
| 09/13/2006 | EP1700875A2 Curable composition having low coefficient of thermal expansion, method of making an integrated circuit, and an integrated circuit made there from |
| 09/13/2006 | EP1700341A1 Wafer with optical control modules in ic fields |
| 09/13/2006 | EP1700340A1 Wafer with optical control modules in dicing paths |
| 09/13/2006 | EP1700337A2 Process for packaging components and packaged components |
| 09/13/2006 | EP1700256A1 Protection for an integrated circuit chip containing confidential data |
| 09/13/2006 | EP1700003A2 High temperature circuits |
| 09/13/2006 | EP1700002A2 High temperature environment tool system and method |
| 09/13/2006 | EP1668686A4 Reversible leadless package and methods of making and using same |
| 09/13/2006 | EP1135803B1 Interlayer between titanium nitride and high density plasma oxide |
| 09/13/2006 | EP1103168B1 High density printed circuit substrate and method of fabrication |
| 09/13/2006 | EP1029354B1 Porous silicon oxycarbide integrated circuit insulator |
| 09/13/2006 | CN2817318Y Radiator fixing seat |
| 09/13/2006 | CN2817317Y Radiating device structure |
| 09/13/2006 | CN2817316Y 散热片 Fins |
| 09/13/2006 | CN2817202Y Air-cooled radiator for rectifier |
| 09/13/2006 | CN2817074Y Multi-substrate thick-film circuit |
| 09/13/2006 | CN2817073Y High-voltage large-current coaxial structured inductance-free thyratron oil-tank |
| 09/13/2006 | CN2817072Y 散热器 Heat sink |
| 09/13/2006 | CN2817071Y Radiating apparatus structur |
| 09/13/2006 | CN2817070Y Central processor rediating device structure |
| 09/13/2006 | CN2817069Y Porcelain-shell power diode |
| 09/13/2006 | CN1833317A Ground arch for wirebond ball grid arrays |
| 09/13/2006 | CN1833316A Multilayered cap barrier in microelectronic interconnect structures |
| 09/13/2006 | CN1832839A Resin sealing method for electronic part and mold used for the method |
| 09/13/2006 | CN1832677A Electronic structure with water-proof and radiation structure |
| 09/13/2006 | CN1832659A Circuit device and method of manufacturing thereof |