| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/19/2006 | US7109573 Thermally enhanced component substrate |
| 09/19/2006 | US7109572 Quad flat no lead (QFN) grid array package |
| 09/19/2006 | US7109570 Integrated circuit package with leadframe enhancement and method of manufacturing the same |
| 09/19/2006 | US7109568 Semiconductor device including n-channel fets and p-channel fets with improved drain current characteristics |
| 09/19/2006 | US7109564 Low power fuse structure and method of making the same |
| 09/19/2006 | US7109563 Films deposited at glancing incidence for multilevel metallization |
| 09/19/2006 | US7109562 High voltage laterally double-diffused metal oxide semiconductor |
| 09/19/2006 | US7109560 Micro-electromechanical system and method for production thereof |
| 09/19/2006 | US7109547 Non-volatile semiconductor memory device having memory cell array suitable for high density and high integration |
| 09/19/2006 | US7109545 Integrated circuit memory with offset capacitor |
| 09/19/2006 | US7109538 Nonvolatile semiconductor memory device |
| 09/19/2006 | US7109524 Metal carrier (leadframe) for receiving and contact-connecting electrical and/or optoelectronic components |
| 09/19/2006 | US7109520 Heat sinks |
| 09/19/2006 | US7109427 Two stage molded memory cards |
| 09/19/2006 | US7109410 EMI shielding for electronic component packaging |
| 09/19/2006 | US7109273 Solid silane coupling agent composition, process for producing the same, and resin composition containing the same |
| 09/19/2006 | US7109127 Manufacturing method of semiconductor device |
| 09/19/2006 | US7109115 Methods of providing ohmic contact |
| 09/19/2006 | US7109109 Contact plug in semiconductor device and method of forming the same |
| 09/19/2006 | US7109107 Method for creating flip-chip conductive-polymer bumps using photolithography and polishing |
| 09/19/2006 | US7109106 Methods for providing support for conductive structures protruding from semiconductor device components |
| 09/19/2006 | US7109105 Methods of making semiconductor fuses |
| 09/19/2006 | US7109101 Capping layer for reducing amorphous carbon contamination of photoresist in semiconductor device manufacture; and process for making same |
| 09/19/2006 | US7109093 Crackstop with release layer for crack control in semiconductors |
| 09/19/2006 | US7109089 Semiconductor fabrication using a collar |
| 09/19/2006 | US7109088 Multilayer analog interconnecting line layout for a mixed-signal integrated circuit |
| 09/19/2006 | US7109067 Semiconductor device and method for fabricating same |
| 09/19/2006 | US7109065 Bumped chip carrier package using lead frame and method for manufacturing the same |
| 09/19/2006 | US7109064 Method of forming a semiconductor package and leadframe therefor |
| 09/19/2006 | US7109063 Semiconductor substrate for build-up packages |
| 09/19/2006 | US7109062 Semiconductor integrated device including support substrate fastened using resin, and manufacturing method thereof |
| 09/19/2006 | US7109061 Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith |
| 09/19/2006 | US7109060 Manufacturing method of semiconductor device, semiconductor device, circuit substrate and electronic equipment |
| 09/19/2006 | US7109059 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
| 09/19/2006 | US7109058 Bumpless semiconductor device |
| 09/19/2006 | US7109054 Image sensor with recessed planarizing layers and method for making same |
| 09/19/2006 | US7109050 Solid state image pickup device and method of fabricating the same |
| 09/19/2006 | US7108914 Microcapsule containing a flowable polymerizable material, and having a polymerization agent(s) in the outer surface for inducing polymerization upon rupture of the microcapsule; electronics, packaging, sealants, coatings, tire parts |
| 09/19/2006 | US7108899 Chip tray with tacky surface |
| 09/19/2006 | US7108807 Methods for producing a dielectric, dielectric having self-generating pores, monomer for porous dielectrics, process for preparing poly-o-hydroxyamides, process for preparing polybenzoxazoles, and processes for producing an electronic component |
| 09/19/2006 | US7108806 Mixing epoxy resin, amine, filler, corrosion inhibitor and oxygen scavenger, imidazole curing agent and solvent |
| 09/19/2006 | US7108516 Flexible board, connection method thereof, and connection structure thereof |
| 09/19/2006 | US7108055 Optimized heat sink using high thermal conducting base and low thermal conducting fins |
| 09/19/2006 | US7108051 CPU heat dissipating unit |
| 09/19/2006 | US7107777 MEMS heat pumps for integrated circuit heat dissipation |
| 09/19/2006 | US7107674 Method for manufacturing a chip carrier |
| 09/19/2006 | US7107672 Method of mounting electronic parts on a flexible printed circuit board |
| 09/19/2006 | US7107666 Method of manufacturing an ultra-miniature magnetic device |
| 09/14/2006 | WO2006096813A2 Low k dielectric cvd film formation process with in-situ imbedded nanolayers to improve mechanical properties |
| 09/14/2006 | WO2006096718A1 Leadframe, coining tool, and method |
| 09/14/2006 | WO2006096378A1 Magnetic self-assembly for integrated circuit packages |
| 09/14/2006 | WO2006096267A1 Integrated circuit chip package and method |
| 09/14/2006 | WO2006095915A1 Multilayer wiring structure, semiconductor device, pattern transfer mask and method for manufacturing multilayer wiring structure |
| 09/14/2006 | WO2006095914A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| 09/14/2006 | WO2006095655A1 Semiconductor integrated circuit |
| 09/14/2006 | WO2006095503A1 Container for electronic component and piezoelectric oscillation device |
| 09/14/2006 | WO2006095479A1 High frequency device, high frequency module and communication apparatus |
| 09/14/2006 | WO2006095449A1 Self-feeding cooling system |
| 09/14/2006 | WO2006095436A1 Heat absorption member, cooling device, and electronic apparatus |
| 09/14/2006 | WO2006094989A1 Method for establishing an electrical and mechanical connection between chip contact surfaces and antenna contact surfaces and transponder |
| 09/14/2006 | WO2006094654A1 Copper bonding or superfine wire with improved bonding and corrosion properties |
| 09/14/2006 | WO2006094469A1 Device for supplying an integrated circuit with power |
| 09/14/2006 | WO2006076143A3 Semiconductor die package including universal footprint and method for manufacturing the same |
| 09/14/2006 | WO2006051927A3 Electronic circuit device |
| 09/14/2006 | WO2006050403A3 Gallium nitride/silicon based monolithic microwave integrated circuit |
| 09/14/2006 | WO2006019460A3 Method of assembling a semiconductor component and apparatus therefor |
| 09/14/2006 | WO2006011013A3 An active protection device for protecting circuit against mechanical and electromagnetic attack. |
| 09/14/2006 | WO2005124858A3 Package and method for packaging an integrated circuit die |
| 09/14/2006 | WO2005122254A3 Gate stack and gate stack etch sequence for metal gate integration |
| 09/14/2006 | WO2005119757A3 Packaged integrated circuit devices |
| 09/14/2006 | US20060205259 IC package, IC socket, and IC socket assembly |
| 09/14/2006 | US20060205233 Method for manufacturing a semiconductor device |
| 09/14/2006 | US20060205209 Enhanced barrier liner formation for vias |
| 09/14/2006 | US20060205201 Electric device and method for fabricating the same |
| 09/14/2006 | US20060205123 Methods for metal plating of gate conductors and semiconductors formed thereby |
| 09/14/2006 | US20060205117 Solder masks used in encapsulation, assemblies including the solar mask, and methods |
| 09/14/2006 | US20060205116 Methods for packaging microfeature devices and microfeature devices formed by such methods |
| 09/14/2006 | US20060205099 Die testing using top surface test pads |
| 09/14/2006 | US20060204862 Methods, systems and computer program products for correcting photomask using aerial images and boundary regions |
| 09/14/2006 | US20060204762 Liquid epoxy resin composition and semiconductor device |
| 09/14/2006 | US20060204742 Electronic device manufacture |
| 09/14/2006 | US20060203458 Electronic package with integrated capacitor |
| 09/14/2006 | US20060203323 Electrochromic rearview mirror assembly incorporating a display/signal light |
| 09/14/2006 | US20060202831 On die RFID tag antenna |
| 09/14/2006 | US20060202793 Image sensor device and manufacturing method of the same |
| 09/14/2006 | US20060202789 Electrically decoupled integrated transformer having at least one grounded electric shield |
| 09/14/2006 | US20060202360 Semiconductor device featuring overlay-mark used in photolithography process |
| 09/14/2006 | US20060202359 Apparatus and method for predetermined component placement to a target platform |
| 09/14/2006 | US20060202358 Antisymmetric nanowire crossbars |
| 09/14/2006 | US20060202357 Wired circuit board |
| 09/14/2006 | US20060202356 Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device |
| 09/14/2006 | US20060202355 Nanostructured friction enhancement using fabricated microstructure |
| 09/14/2006 | US20060202354 Configuration for testing the bonding positions of conductive drops and test method for using the same |
| 09/14/2006 | US20060202353 Semiconductor device and method of manufacturing the same |
| 09/14/2006 | US20060202352 Magnetron sputtered metallization of a nickel silicon alloy, especially useful as solder bump barrier |
| 09/14/2006 | US20060202351 Underfilling efficiency by modifying the substrate design of flip chips |
| 09/14/2006 | US20060202350 Semiconductor device |
| 09/14/2006 | US20060202349 Circuit substrate and its manufacturing method |
| 09/14/2006 | US20060202348 Semiconductor device and manufacturing method thereof |
| 09/14/2006 | US20060202347 Through electrode, package base having through electrode, and semiconductor chip having through electrode |