Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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09/20/2006 | CN2819475Y Hot pipe radiator and radiating fins |
09/20/2006 | CN2819474Y Radiating aluminum structure |
09/20/2006 | CN2819473Y Forming structure of radiating mould set |
09/20/2006 | CN2819472Y High-efficient CPU radiator |
09/20/2006 | CN2819296Y Radiator of computer processor |
09/20/2006 | CN1836474A Digital micromirror device mounting system |
09/20/2006 | CN1836330A 半导体集成电路 The semiconductor integrated circuit |
09/20/2006 | CN1836329A Circuit device and method for manufacturing same |
09/20/2006 | CN1836328A Module for EPAS/EHPAS applications |
09/20/2006 | CN1836327A Integrated connection arrangement and production method |
09/20/2006 | CN1836326A Semiconductor device and method for making the same |
09/20/2006 | CN1836325A Methods and apparatus for packaging integrated circuit devices |
09/20/2006 | CN1836324A Microelectromechanical device packages with integral heaters |
09/20/2006 | CN1836319A Lead frame routed chip pads for semiconductor packages |
09/20/2006 | CN1836317A Method for forming film, method for manufacturing semiconductor device, semiconductor device and substrate treatment system |
09/20/2006 | CN1836146A Heat transfer device and method of making same |
09/20/2006 | CN1836145A Heat transfer device and method of making same |
09/20/2006 | CN1835675A Electronic component housing structural body |
09/20/2006 | CN1835673A Radiator of electronic component |
09/20/2006 | CN1835672A Elastic fastemer of radiator |
09/20/2006 | CN1835315A Device, arrangement and system for ESD protection |
09/20/2006 | CN1835246A Image sensor device and manufacturing method of the same |
09/20/2006 | CN1835242A Liquid crystal display device using thin-film transistor and method for manufacturing the same |
09/20/2006 | CN1835236A 静电放电装置 Electrostatic discharge device |
09/20/2006 | CN1835234A Esd protection circuit with a settable withstand voltage and current |
09/20/2006 | CN1835233A System single chip with electromagnetic interference shielding functional design |
09/20/2006 | CN1835230A Stacked semiconductor package |
09/20/2006 | CN1835229A Semiconductor device and method of manufacturing semiconductor device |
09/20/2006 | CN1835228A Three-dimensional package and method of forming same |
09/20/2006 | CN1835227A 半导体封装 The semiconductor package |
09/20/2006 | CN1835226A Semiconductor device and manufacturing process therefor |
09/20/2006 | CN1835225A 半导体芯片 Semiconductor chip |
09/20/2006 | CN1835224A 半导体器件 Semiconductor devices |
09/20/2006 | CN1835223A Semiconductor device and insulating substrate for the same |
09/20/2006 | CN1835222A Semiconductor device and a manufacturing method of the same |
09/20/2006 | CN1835221A Electronic component mounting package and package assembled substrate |
09/20/2006 | CN1835220A 半导体器件 Semiconductor devices |
09/20/2006 | CN1835219A Mounting structure and mounting method of a semiconductor device, and liquid crystal display device |
09/20/2006 | CN1835218A Contact pad |
09/20/2006 | CN1835217A Methods and systems for improving microelectronic |
09/20/2006 | CN1835216A Liquid cooling radiation module |
09/20/2006 | CN1835215A Luminous modular and its light source device |
09/20/2006 | CN1835214A Semiconductor device and manufacturing method therefor |
09/20/2006 | CN1835213A Fixture mechanism of radiator |
09/20/2006 | CN1835212A Electronic device substrate and its fabrication method, and electronic device and its fabrication method |
09/20/2006 | CN1835211A Circuit board of electronic device and mfg method thereof |
09/20/2006 | CN1835206A Method of forming double-setting line arrange for semiconductor device using protective access cover layer |
09/20/2006 | CN1835196A Method for manufacturing semiconductor device and semiconductor device |
09/20/2006 | CN1834175A Primer composition for semiconductor-encapsulating epoxy resin molding compound and semiconductor device |
09/20/2006 | CN1833582A Cooling/heating electronic sleeping bag based on semiconductor refrigerating and heat superconducting tech |
09/20/2006 | CN1276563C Multi-functional energy conditioner |
09/20/2006 | CN1276513C System of integrating circuit on insulation layer and method for integrating system on insulation layer |
09/20/2006 | CN1276507C Double mosaic process |
09/20/2006 | CN1276506C Semiconductor apparatus and mfg. method thereof |
09/20/2006 | CN1276505C Semiconductor device |
09/20/2006 | CN1276504C Base plate capable of preventing warping phenomenon production |
09/20/2006 | CN1276500C Semiconductor device and manufacturing method thereof |
09/20/2006 | CN1276498C Method of forming copper interconnect capping layers with improved interface and adhesion |
09/20/2006 | CN1276495C Laser system and method for processing memory link with burst of laser pulses having ultra-short pulse widths |
09/20/2006 | CN1276492C Method for producing semiconductor |
09/20/2006 | CN1276490C Welding and caulking material for silicon wafer and layered electronic package manufactured using the same |
09/20/2006 | CN1276480C Method and apparatus for processing organosiloxane film |
09/20/2006 | CN1276475C Method for producing semiconductor device and used slurry |
09/20/2006 | CN1276306C Processing method, and mfg. method for semiconductor |
09/20/2006 | CN1276290C Flexible plate, electro-optical unit and electronic equipment |
09/20/2006 | CN1276259C Photoetching contact elements |
09/19/2006 | US7110420 Integrated circuit devices having on-chip adaptive bandwidth buses and related methods |
09/19/2006 | US7110261 Heat dissipation assembly |
09/19/2006 | US7110260 Method and apparatus for cooling heat-generating structure |
09/19/2006 | US7110259 Heat dissipating device incorporating heat pipe |
09/19/2006 | US7110258 Heat dissipating microdevice |
09/19/2006 | US7110255 Heat-dissipating device and a housing thereof |
09/19/2006 | US7110241 Substrate |
09/19/2006 | US7110232 Semiconductor circuit with protective circuit |
09/19/2006 | US7110228 Separated power ESD protection circuit and integrated circuit thereof |
09/19/2006 | US7110227 Universial energy conditioning interposer with circuit architecture |
09/19/2006 | US7110165 Power management for spatial power combiners |
09/19/2006 | US7109917 Intergrated semiconductor component for high-frequency measurement and use thereof |
09/19/2006 | US7109825 Passive devices and modules for transceiver |
09/19/2006 | US7109781 Temperature compensation for internal inductor resistance |
09/19/2006 | US7109593 Systems and methods for performing quantum computations |
09/19/2006 | US7109592 SMT passive device noflow underfill methodology and structure |
09/19/2006 | US7109591 Integrated circuit device |
09/19/2006 | US7109590 Semiconductor component comprising a surface metallization |
09/19/2006 | US7109589 Integrated circuit with substantially perpendicular wire bonds |
09/19/2006 | US7109588 Method and apparatus for attaching microelectronic substrates and support members |
09/19/2006 | US7109587 Apparatus and method for enhanced thermal conductivity packages for high powered semiconductor devices |
09/19/2006 | US7109586 System for reducing or eliminating semiconductor device wire sweep |
09/19/2006 | US7109585 Junction interconnection structures |
09/19/2006 | US7109584 Dendrite growth control circuit |
09/19/2006 | US7109583 Mounting with auxiliary bumps |
09/19/2006 | US7109582 Semiconductor device for testing semiconductors |
09/19/2006 | US7109581 System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler |
09/19/2006 | US7109580 Hermetically sealed package for optical, electronic, opto-electronic and other devices |
09/19/2006 | US7109579 Semiconductor device with improved design freedom of external terminal |
09/19/2006 | US7109578 Semiconductor device and electronic equipment using the same |
09/19/2006 | US7109577 Semiconductor device and power supply system |
09/19/2006 | US7109576 Semiconductor component having encapsulated die stack |
09/19/2006 | US7109575 Low-cost flexible film package module and method of manufacturing the same |
09/19/2006 | US7109574 Integrated circuit package with exposed die surfaces and auxiliary attachment |