Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2006
09/20/2006CN2819475Y Hot pipe radiator and radiating fins
09/20/2006CN2819474Y Radiating aluminum structure
09/20/2006CN2819473Y Forming structure of radiating mould set
09/20/2006CN2819472Y High-efficient CPU radiator
09/20/2006CN2819296Y Radiator of computer processor
09/20/2006CN1836474A Digital micromirror device mounting system
09/20/2006CN1836330A 半导体集成电路 The semiconductor integrated circuit
09/20/2006CN1836329A Circuit device and method for manufacturing same
09/20/2006CN1836328A Module for EPAS/EHPAS applications
09/20/2006CN1836327A Integrated connection arrangement and production method
09/20/2006CN1836326A Semiconductor device and method for making the same
09/20/2006CN1836325A Methods and apparatus for packaging integrated circuit devices
09/20/2006CN1836324A Microelectromechanical device packages with integral heaters
09/20/2006CN1836319A Lead frame routed chip pads for semiconductor packages
09/20/2006CN1836317A Method for forming film, method for manufacturing semiconductor device, semiconductor device and substrate treatment system
09/20/2006CN1836146A Heat transfer device and method of making same
09/20/2006CN1836145A Heat transfer device and method of making same
09/20/2006CN1835675A Electronic component housing structural body
09/20/2006CN1835673A Radiator of electronic component
09/20/2006CN1835672A Elastic fastemer of radiator
09/20/2006CN1835315A Device, arrangement and system for ESD protection
09/20/2006CN1835246A Image sensor device and manufacturing method of the same
09/20/2006CN1835242A Liquid crystal display device using thin-film transistor and method for manufacturing the same
09/20/2006CN1835236A 静电放电装置 Electrostatic discharge device
09/20/2006CN1835234A Esd protection circuit with a settable withstand voltage and current
09/20/2006CN1835233A System single chip with electromagnetic interference shielding functional design
09/20/2006CN1835230A Stacked semiconductor package
09/20/2006CN1835229A Semiconductor device and method of manufacturing semiconductor device
09/20/2006CN1835228A Three-dimensional package and method of forming same
09/20/2006CN1835227A 半导体封装 The semiconductor package
09/20/2006CN1835226A Semiconductor device and manufacturing process therefor
09/20/2006CN1835225A 半导体芯片 Semiconductor chip
09/20/2006CN1835224A 半导体器件 Semiconductor devices
09/20/2006CN1835223A Semiconductor device and insulating substrate for the same
09/20/2006CN1835222A Semiconductor device and a manufacturing method of the same
09/20/2006CN1835221A Electronic component mounting package and package assembled substrate
09/20/2006CN1835220A 半导体器件 Semiconductor devices
09/20/2006CN1835219A Mounting structure and mounting method of a semiconductor device, and liquid crystal display device
09/20/2006CN1835218A Contact pad
09/20/2006CN1835217A Methods and systems for improving microelectronic
09/20/2006CN1835216A Liquid cooling radiation module
09/20/2006CN1835215A Luminous modular and its light source device
09/20/2006CN1835214A Semiconductor device and manufacturing method therefor
09/20/2006CN1835213A Fixture mechanism of radiator
09/20/2006CN1835212A Electronic device substrate and its fabrication method, and electronic device and its fabrication method
09/20/2006CN1835211A Circuit board of electronic device and mfg method thereof
09/20/2006CN1835206A Method of forming double-setting line arrange for semiconductor device using protective access cover layer
09/20/2006CN1835196A Method for manufacturing semiconductor device and semiconductor device
09/20/2006CN1834175A Primer composition for semiconductor-encapsulating epoxy resin molding compound and semiconductor device
09/20/2006CN1833582A Cooling/heating electronic sleeping bag based on semiconductor refrigerating and heat superconducting tech
09/20/2006CN1276563C Multi-functional energy conditioner
09/20/2006CN1276513C System of integrating circuit on insulation layer and method for integrating system on insulation layer
09/20/2006CN1276507C Double mosaic process
09/20/2006CN1276506C Semiconductor apparatus and mfg. method thereof
09/20/2006CN1276505C Semiconductor device
09/20/2006CN1276504C Base plate capable of preventing warping phenomenon production
09/20/2006CN1276500C Semiconductor device and manufacturing method thereof
09/20/2006CN1276498C Method of forming copper interconnect capping layers with improved interface and adhesion
09/20/2006CN1276495C Laser system and method for processing memory link with burst of laser pulses having ultra-short pulse widths
09/20/2006CN1276492C Method for producing semiconductor
09/20/2006CN1276490C Welding and caulking material for silicon wafer and layered electronic package manufactured using the same
09/20/2006CN1276480C Method and apparatus for processing organosiloxane film
09/20/2006CN1276475C Method for producing semiconductor device and used slurry
09/20/2006CN1276306C Processing method, and mfg. method for semiconductor
09/20/2006CN1276290C Flexible plate, electro-optical unit and electronic equipment
09/20/2006CN1276259C Photoetching contact elements
09/19/2006US7110420 Integrated circuit devices having on-chip adaptive bandwidth buses and related methods
09/19/2006US7110261 Heat dissipation assembly
09/19/2006US7110260 Method and apparatus for cooling heat-generating structure
09/19/2006US7110259 Heat dissipating device incorporating heat pipe
09/19/2006US7110258 Heat dissipating microdevice
09/19/2006US7110255 Heat-dissipating device and a housing thereof
09/19/2006US7110241 Substrate
09/19/2006US7110232 Semiconductor circuit with protective circuit
09/19/2006US7110228 Separated power ESD protection circuit and integrated circuit thereof
09/19/2006US7110227 Universial energy conditioning interposer with circuit architecture
09/19/2006US7110165 Power management for spatial power combiners
09/19/2006US7109917 Intergrated semiconductor component for high-frequency measurement and use thereof
09/19/2006US7109825 Passive devices and modules for transceiver
09/19/2006US7109781 Temperature compensation for internal inductor resistance
09/19/2006US7109593 Systems and methods for performing quantum computations
09/19/2006US7109592 SMT passive device noflow underfill methodology and structure
09/19/2006US7109591 Integrated circuit device
09/19/2006US7109590 Semiconductor component comprising a surface metallization
09/19/2006US7109589 Integrated circuit with substantially perpendicular wire bonds
09/19/2006US7109588 Method and apparatus for attaching microelectronic substrates and support members
09/19/2006US7109587 Apparatus and method for enhanced thermal conductivity packages for high powered semiconductor devices
09/19/2006US7109586 System for reducing or eliminating semiconductor device wire sweep
09/19/2006US7109585 Junction interconnection structures
09/19/2006US7109584 Dendrite growth control circuit
09/19/2006US7109583 Mounting with auxiliary bumps
09/19/2006US7109582 Semiconductor device for testing semiconductors
09/19/2006US7109581 System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler
09/19/2006US7109580 Hermetically sealed package for optical, electronic, opto-electronic and other devices
09/19/2006US7109579 Semiconductor device with improved design freedom of external terminal
09/19/2006US7109578 Semiconductor device and electronic equipment using the same
09/19/2006US7109577 Semiconductor device and power supply system
09/19/2006US7109576 Semiconductor component having encapsulated die stack
09/19/2006US7109575 Low-cost flexible film package module and method of manufacturing the same
09/19/2006US7109574 Integrated circuit package with exposed die surfaces and auxiliary attachment