| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/21/2006 | WO2005036606A3 Method and apparatus for performing power routing on a voltage island within an integrated circuit chip |
| 09/21/2006 | US20060211429 Wireless local loop antenna |
| 09/21/2006 | US20060211280 Anisotropic conductive connector, conductive paste composition, probe member, wafer inspection device and wafer inspection method |
| 09/21/2006 | US20060211278 Interconnect for microelectronic structures with enhanced spring characteristics |
| 09/21/2006 | US20060211276 Electrical contact |
| 09/21/2006 | US20060211247 Lapping of gold pads in a liquid medium for work hardening the surface of the pads |
| 09/21/2006 | US20060211234 Re-assembly process for mems structures |
| 09/21/2006 | US20060211177 Structure and process for packaging RF MEMS and other devices |
| 09/21/2006 | US20060211176 Manufacturing method for physical quantity sensor using lead frame and bonding device therefor |
| 09/21/2006 | US20060211174 Flip-chip adaptor package for bare die |
| 09/21/2006 | US20060211170 Semiconductor device and manufacturing method of the same |
| 09/21/2006 | US20060211167 Methods and systems for improving microelectronic i/o current capabilities |
| 09/21/2006 | US20060211166 Methods of producing a package for semiconductor chips |
| 09/21/2006 | US20060210812 Insulating film and method of forming the same |
| 09/21/2006 | US20060210723 Plasma enhanced atomic layer deposition system and method |
| 09/21/2006 | US20060210323 Endless belt type transferring apparatus and image forming apparatus |
| 09/21/2006 | US20060209519 Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof |
| 09/21/2006 | US20060209515 Processor/memory module with foldable substrate |
| 09/21/2006 | US20060209497 Pad structure of wiring board and wiring board |
| 09/21/2006 | US20060209479 ESD protection circuit for low voltages |
| 09/21/2006 | US20060209223 Thin film transistor array substrate using low dielectric insulating layer and method of fabricating the same |
| 09/21/2006 | US20060208765 High frequency integrated circuit (hfic) microsystems assembly and method for fabricating the same |
| 09/21/2006 | US20060208366 Microelectronic component assemblies with recessed wire bonds and methods of making same |
| 09/21/2006 | US20060208365 Flip-chip-on-film package structure |
| 09/21/2006 | US20060208364 LED device with flip chip structure |
| 09/21/2006 | US20060208363 Three-dimensional package and method of forming same |
| 09/21/2006 | US20060208362 Carbon nanotubes with controlled diameter, length, and metallic contacts |
| 09/21/2006 | US20060208361 Semiconductor chip |
| 09/21/2006 | US20060208360 Top via pattern for bond pad structure |
| 09/21/2006 | US20060208359 Double density method for wirebond interconnect |
| 09/21/2006 | US20060208358 Stacked package integrated circuit |
| 09/21/2006 | US20060208357 Integrated device and electronic system |
| 09/21/2006 | US20060208356 Wiring board and method of manufacturing the same |
| 09/21/2006 | US20060208355 Routing configuration for high frequency signals in an integrated circuit package |
| 09/21/2006 | US20060208354 Thermal interface structure and process for making the same |
| 09/21/2006 | US20060208353 Semiconductor cooling system and process for manufacturing the same |
| 09/21/2006 | US20060208352 Strain silicon wafer with a crystal orientation (100) in flip chip BGA package |
| 09/21/2006 | US20060208351 Semiconductor devices including peripherally located bond pads, intermediates thereof, and assemblies and packages including the semiconductor devices |
| 09/21/2006 | US20060208350 Support elements for semiconductor devices with peripherally located bond pads |
| 09/21/2006 | US20060208349 Semiconductor device and manufacturing method for the same |
| 09/21/2006 | US20060208348 Stacked semiconductor package |
| 09/21/2006 | US20060208347 Semiconductor device package |
| 09/21/2006 | US20060208346 Flat-shaped battery |
| 09/21/2006 | US20060208345 Semiconductor chip and semiconductor device including the same |
| 09/21/2006 | US20060208344 Lead frame panel and method of packaging semiconductor devices using the lead frame panel |
| 09/21/2006 | US20060208335 Films deposited at glancing incidence for multilevel metallization |
| 09/21/2006 | US20060208333 Image sensor |
| 09/21/2006 | US20060208331 Miniature optical element for wireless bonding in an electronic instrument |
| 09/21/2006 | US20060208327 Acceleration sensor and method of manufacturing acceleration sensor |
| 09/21/2006 | US20060208321 Selectable open circuit and anti-fuse element |
| 09/21/2006 | US20060208276 Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device |
| 09/21/2006 | US20060208274 Electrical fuse for silicon-on-insulator devices |
| 09/21/2006 | US20060208256 Self-calibration in non-contact surface photovoltage measurement of depletion capacitance and dopant concentration |
| 09/21/2006 | US20060208248 Nonvolatile nanochannel memory device using organic-inorganic complex mesoporous material |
| 09/21/2006 | US20060208182 Solid-state image sensing device |
| 09/21/2006 | US20060208030 Structure to accommodate increase in volume expansion during solder reflow |
| 09/21/2006 | US20060207975 High-speed, precision, laser-based method and system for processing material of one or more targets within a field |
| 09/21/2006 | US20060207965 Method to form both high and low-k materials over the same dielectric region, and their application in mixed mode circuits |
| 09/21/2006 | US20060207748 Cooling apparatus and electronic equipment |
| 09/21/2006 | DE202006009000U1 Fastener for heat sink, has movable side piece, comprising one hook that is hooked to central processing unit by rotation of lever, guided through opening of bow-shaped or U-shaped or C-shaped spring unit |
| 09/21/2006 | DE202006006336U1 High speed-LED-package assembly, has metallic-cooling unit mounted on heat-conducting base and heat-conducting insulation layer provided between heat-conducting base and metallic-cooling unit |
| 09/21/2006 | DE112004002022T5 Messsonden-Prüfstruktur Measuring probe test structure |
| 09/21/2006 | DE10358423B4 Modulbrücken für Smart Labels Module bridges for Smart Labels |
| 09/21/2006 | DE10310617B4 Elektronisches Bauteil mit Hohlraum und ein Verfahren zur Herstellung desselben An electronic part having the cavity and a method of manufacturing the same |
| 09/21/2006 | DE10297355B4 Breitbandhochfrequenz-Signalverstärker Broadband high-frequency signal amplifier |
| 09/21/2006 | DE102006010995A1 Vertical surge voltage protection diode for protection of semiconductor element or circuitry from electricity has forms pn-transition by first electrically conductive semiconductor region with low resistivity |
| 09/21/2006 | DE102006008454A1 Pads layout structure for use in e.g. semiconductor memory component, has subsets of wire and non-wire bonding pads, where non-wire bonding pad subset is used to test component, while wire bonding pad subset is used for bonding component |
| 09/21/2006 | DE102006003755A1 Heat-radiation pipe structure for semiconductor chip, has tubular element including carbon coating having diamond structure |
| 09/21/2006 | DE102005016930A1 RFID chip and strip substrate contact surfaces electrical and mechanical connection establishing method for transponder, involves hooking chip surfaces having hooks/lugs with substrate surfaces having hooks/lugs with size in nanometer range |
| 09/21/2006 | DE102005012501A1 Vorrichtung zur Kühlung von elektronischen Bauteilen A device for cooling electronic components |
| 09/21/2006 | DE102005012218A1 Ball grid array type semiconductor component, has cooling unit from made of e.g. copper and including two sections, where one section is partially arranged between chip and substrate, and other section partially runs on housing surface |
| 09/21/2006 | DE102005012216A1 Kühlkörper für oberflächenmontierte Halbleiterbauteile und Montageverfahren Heat sink for semiconductor components and surface mount assembly process |
| 09/21/2006 | DE102005011159A1 Semiconductor component has surface mountable external contacts, which has external contact surface on lower surface of housing of semiconductor components whereby drain contact surface is provided at rear surface of semiconductor chip |
| 09/21/2006 | DE102004037336B4 Verfahren zum Herstellen einer Schicht-Anordnung und Schicht-Anordnung A method for producing a layer arrangement and layer arrangement |
| 09/21/2006 | DE102004029023B4 Leistungshalbleitermodul mit einem Detektor zum Erfassen eines durch ein Leistungshalbleiterbauteil fliessenden Schaltungshauptstroms Power semiconductor module with a detector for detecting a current flowing through a power semiconductor device circuit the main current |
| 09/21/2006 | DE10128419B4 Festkörper-Bildaufnahmeeinrichtung mit Mikrolinse und Unterfüllung Solid-state image pickup device with microlens and underfill |
| 09/21/2006 | DE10052890B4 Anordnung zur Verringerung des Widerstandes von Leiterbahnen im Layout einer integrierten Halbleiterschaltung Arrangement for reducing the resistance of interconnects in the layout of a semiconductor integrated circuit |
| 09/21/2006 | CA2604517A1 Circuitry module |
| 09/20/2006 | EP1703578A1 Reformer-fuel cell system with external burner |
| 09/20/2006 | EP1703559A1 Low voltage ESD protection circuit |
| 09/20/2006 | EP1703558A2 Wiring board with embedded semiconductor chip, embedded reinforcing member and method of manufacturing the same |
| 09/20/2006 | EP1703557A2 Electronic assembly with integral thermal transient suppression |
| 09/20/2006 | EP1703556A1 Heat sink |
| 09/20/2006 | EP1703555A2 Printed wiring board and method for manufacturing the same |
| 09/20/2006 | EP1703554A2 Power semiconductor module |
| 09/20/2006 | EP1702362A1 Monolithically integrated circuit for radio frequency applications |
| 09/20/2006 | EP1702361A2 Integrated circuit fuse and method of fabrication |
| 09/20/2006 | EP1702360A2 A cooling system with a bubble pump |
| 09/20/2006 | EP1702192A2 Heat exchanger |
| 09/20/2006 | EP1558678B1 Toughened epoxy / polyanhydride no- flow underfill encapsulant composition |
| 09/20/2006 | EP1547394A4 Packaged rf power transistor having rf bypassing/output matching network |
| 09/20/2006 | EP1476500A4 Method of making a nanoporous film |
| 09/20/2006 | EP1468449B1 Multi-chip module semiconductor devices |
| 09/20/2006 | EP1174921B1 Semiconductor device |
| 09/20/2006 | EP0951066B1 Method of manufacturing semiconductor device |
| 09/20/2006 | CN2819721Y Fixing structure of radiating molding set |
| 09/20/2006 | CN2819709Y Circuit board combination |
| 09/20/2006 | CN2819647Y Ceramic sealer of crystal oscillator |
| 09/20/2006 | CN2819477Y Stacking structure of module cards |
| 09/20/2006 | CN2819476Y Integrated circuit or separated component planar button sealing structure |