| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/28/2006 | US20060214280 Semiconductor device and IC card |
| 09/28/2006 | US20060214279 Contacting device, testing method and corresponding production method |
| 09/28/2006 | US20060214278 Shield and semiconductor die assembly |
| 09/28/2006 | US20060214277 Semiconductor device and manufacturing method thereof |
| 09/28/2006 | US20060214276 Systems and methods for testing packaged dies |
| 09/28/2006 | US20060214275 Semiconductor device |
| 09/28/2006 | US20060214274 Semiconductor device and manufacturing method thereof |
| 09/28/2006 | US20060214273 LED package structure and method making of the same |
| 09/28/2006 | US20060214272 Leadframe for semiconductor device |
| 09/28/2006 | US20060214271 Device and applications for passive RF components in leadframes |
| 09/28/2006 | US20060214270 Semiconductor device and fabrication method therefor, capacitive element and fabrication method therefor, and MIS type semiconductor device and fabrication method therefor |
| 09/28/2006 | US20060214269 Semiconductor device which prevents peeling of low-permittivity film by using multilevel interconnection |
| 09/28/2006 | US20060214267 Device and method for manufacturing the same |
| 09/28/2006 | US20060214265 Integrated circuit with capacitor and method for the production thereof |
| 09/28/2006 | US20060214246 Methods and apparatuses for microelectronic assembly having a material with a variable viscosity around a MEMS device |
| 09/28/2006 | US20060214235 Semiconductor device |
| 09/28/2006 | US20060214234 Semiconductor integrated circuit |
| 09/28/2006 | US20060214222 Power semiconductor devices and methods of manufacture |
| 09/28/2006 | US20060214221 Power semiconductor devices and methods of manufacture |
| 09/28/2006 | US20060214189 Semiconductor device with two or more bond pad connections for each input/output cell and method of manufacture thereof |
| 09/28/2006 | US20060214186 Insulated power semiconductor module with reduced partial discharge and manufacturing method |
| 09/28/2006 | US20060214178 Light emitting diode package and fabrication method thereof |
| 09/28/2006 | US20060214177 Cooling method and apparatus |
| 09/28/2006 | US20060214164 Semiconductor device and method of manufacturing the device based on evaluation data of test transistors uniformly arranged on test wafer |
| 09/28/2006 | US20060214153 Epoxy resin molding material for sealing use and semiconductor device |
| 09/28/2006 | US20060214139 Methods for producing a dielectric, dielectric having self-generating pores, monomer for porous dielectrics, process for preparing poly-o-hydroxyamides, process for preparing ploybenzoxazoles, and processes for producing an electronic component |
| 09/28/2006 | US20060213865 Method and device for plasma-etching organic material film |
| 09/28/2006 | US20060213643 Cooling apparatus and electronic equipment |
| 09/28/2006 | US20060213599 Fiber adhesive material |
| 09/28/2006 | DE112004002072T5 Lösbares, am Paket angeordnetes Spannungsregelungsmodul Detachable, arranged on the pack voltage regulation module |
| 09/28/2006 | DE10323394B4 Verfahren zum Erzeugen einer elektrischen Kontaktierung zwischen zwei Halbleiterstücken und Verfahren zum Herstellen einer Anordnung von Halbleiterstücken A method of producing an electrical contact between two semiconductor pieces and methods of making an array of semiconductor pieces |
| 09/28/2006 | DE102006012007A1 Power semiconductor module, has insulation layer covering upper and edge sides of chip, and inner housing section under release of source and gate contact surfaces of chip and contact terminal surfaces on source and gate outer contacts |
| 09/28/2006 | DE102006004189A1 Cooling system for IC (integrated circuit) chips used in e.g. personal computer, has heat sink connected to heat exchanger by connecting tubes through which liquid from pump circulates to cool IC chip |
| 09/28/2006 | DE102005043557A1 Semiconductor device for electronic device, has through contact arranged in prefabricated through contact flat rod, which is positioned in end region of device and exhibits through opening which is filled with metal |
| 09/28/2006 | DE102005036996A1 Halbleitervorrichtung Semiconductor device |
| 09/28/2006 | DE102005036324A1 Semiconductor device for use as digital memory device, has semiconductor chip comprising bond wire guiding unit in edge area of top side of chip, where guiding unit has structures for guiding bond wire |
| 09/28/2006 | DE102005013227A1 Optoelectronic transmitting and receiving device has cooling body formed with openings and arranged within module housing to ensure air flow for cooling transmitting and receiving module inside module housing |
| 09/28/2006 | DE102005012494A1 Bonding procedure for connecting microwave circuits, involves using bonding wire that has round cross-section, has no loss or low loss, and is covered with electrically non-conductive dielectric |
| 09/28/2006 | DE10153763B4 Überwachung der Void-Bildung in einem Damascence-Prozess Monitoring of the Void formation in a Damascence process |
| 09/28/2006 | DE10147890B4 Verfahren zur Herstellung eines Substrats aus Keramikmaterial mit einer strukturierten Metallschicht und derartiges Substrat A method of manufacturing a substrate made of ceramic material having a structured metal layer and such a substrate |
| 09/28/2006 | CA2613974A1 Solid-state lighting device package |
| 09/27/2006 | EP1705974A2 Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same |
| 09/27/2006 | EP1705972A1 Multilayer printed wiring board |
| 09/27/2006 | EP1705968A2 Electronic assembly including multiple substrates |
| 09/27/2006 | EP1705966A2 Circuit board and manufacturing method thereof |
| 09/27/2006 | EP1705693A2 Semiconductor device having stacked transistors and decoupling capacitors |
| 09/27/2006 | EP1704594A1 Various structure/height bumps for wafer level-chip scale package |
| 09/27/2006 | EP1704593A2 Multilayer ceramic substrate with single via anchored pad and method of forming |
| 09/27/2006 | EP1704592A1 Chip-sized filp-chip semiconductor package and method for making the same |
| 09/27/2006 | EP1704583A1 Capacitor |
| 09/27/2006 | EP1704179A1 Thermally conductive thermoplastic resin compositions |
| 09/27/2006 | EP1520296B1 Wearable silicon chip |
| 09/27/2006 | EP1454349B1 Trilayered beam mems device and related methods |
| 09/27/2006 | EP1195081B1 Transition between asymmetric stripline and microstrip in cavity |
| 09/27/2006 | EP1190607B1 Integrated circuits with copper metallization for interconnections |
| 09/27/2006 | EP1150384B1 Connector module for integrated circuit device, and integrated circuit device suitable for use with the same |
| 09/27/2006 | EP1145313B1 Methods for forming co-axial interconnect lines in a cmos process |
| 09/27/2006 | EP0929909B1 Method of manufacturing a semiconductor device |
| 09/27/2006 | CN2822119Y Compact matching stracture of heat rdiator bottom base and heat conduit |
| 09/27/2006 | CN2822117Y Heat radiation system using fan to disperse heat of heat exchanger |
| 09/27/2006 | CN2821872Y Power type LED heat radiator |
| 09/27/2006 | CN2821866Y Buckle connection structure |
| 09/27/2006 | CN2821865Y Novel cool dispersing aluminum for semiconductor refrigeration structure |
| 09/27/2006 | CN2821864Y Improved heat radiation fin structure |
| 09/27/2006 | CN2821863Y Thin film sheet and heat conduct compact structure |
| 09/27/2006 | CN2821679Y CPU fanless heat radiator of passive bottom plate type work control computer |
| 09/27/2006 | CN2821504Y Compact structure of heat conduct and fin sheet |
| 09/27/2006 | CN1839491A Method for sealing thin film transistors |
| 09/27/2006 | CN1839486A Thermoelectric material, thermoelectric element and thermoelectric module, and method for manufacturing same |
| 09/27/2006 | CN1839475A Protection circuit for semiconductor device and semiconductor device including the same |
| 09/27/2006 | CN1839474A Module and mounting structure using the same |
| 09/27/2006 | CN1839473A Semiconductor package and manufacturing method thereof |
| 09/27/2006 | CN1839471A IC package for semiconductor devices with improved electric resistance and inductance |
| 09/27/2006 | CN1839470A Fabrication of conductive metal layer on semiconductor devices |
| 09/27/2006 | CN1839213A PVD targets comprising copper in ternary mixtures, and methods of forming copper-containing PVD targets |
| 09/27/2006 | CN1839096A Boron nitride agglomerated powder |
| 09/27/2006 | CN1839093A Nanograde and atom grade component manufacture |
| 09/27/2006 | CN1838869A Screening can |
| 09/27/2006 | CN1838867A Heat radiator |
| 09/27/2006 | CN1838860A Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device |
| 09/27/2006 | CN1838859A Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device |
| 09/27/2006 | CN1838855A Circuit substrate and making method and multilayer circuit structure using it and information processing system |
| 09/27/2006 | CN1838422A Solid shooting apparatus and method for manufacturing the same |
| 09/27/2006 | CN1838421A Solid shooting apparatus, solid shooting element collection box and method for manufacturing the same |
| 09/27/2006 | CN1838420A Semiconductor device and its forming method |
| 09/27/2006 | CN1838409A Memory module with different types of multi chip packages |
| 09/27/2006 | CN1838408A Semiconductor device and method for forming assistant via |
| 09/27/2006 | CN1838407A Leadframe for semiconductor device |
| 09/27/2006 | CN1838406A Packaging structure and packaging method thereof |
| 09/27/2006 | CN1838405A Heat receiving sheet, electronic apparatus, and fabrication method for heat receiving sheet |
| 09/27/2006 | CN1838404A Heat radiation module assembly |
| 09/27/2006 | CN1838403A Housing for solid shooting element and solid shooting apparatus |
| 09/27/2006 | CN1838395A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 09/27/2006 | CN1837317A Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film |
| 09/27/2006 | CN1837284A Epoxy-organosilicon mixed resin composition and method for preparing same, and light-emitting semiconductor device |
| 09/27/2006 | CN1837220A Method for producing borazine compound |
| 09/27/2006 | CN1277449C Electrostatic discharge protection on circuit board |
| 09/27/2006 | CN1277332C High-frequency assembly and method for providing through-hole in high-frequency assembly |
| 09/27/2006 | CN1277311C Electrostatic discharge protection device and IC |
| 09/27/2006 | CN1277310C Fuse structure for integrated wire welding on low K interconnection and its manufacturing method |