| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 10/03/2006 | US7115502 Structure and manufacturing process of localized shunt to reduce electromigration failure of copper dual damascene process |
| 10/03/2006 | US7115497 Method for forming storage node contact plug of DRAM (dynamic random access memory) |
| 10/03/2006 | US7115496 Method for protecting the redistribution layer on wafers/chips |
| 10/03/2006 | US7115495 Methods of making projected contact structures for engaging bumped semiconductor devices |
| 10/03/2006 | US7115493 Antifuse structures, methods, and applications |
| 10/03/2006 | US7115483 Stacked chip package having upper chip provided with trenches and method of manufacturing the same |
| 10/03/2006 | US7115454 Thin film semiconductor device, polycrystalline semiconductor thin film production and process and production apparatus |
| 10/03/2006 | US7115451 Methods of forming semiconductor circuitry |
| 10/03/2006 | US7115445 Semiconductor package having reduced thickness |
| 10/03/2006 | US7115444 Semiconductor device with improved heat dissipation, and a method of making semiconductor device |
| 10/03/2006 | US7115443 Method and apparatus for manufacturing a packaged semiconductor device, packaged semiconductor device obtained with such a method and metal carrier suitable for use in such a method |
| 10/03/2006 | US7115442 Ball grid array package with stacked center pad chips and method for manufacturing the same |
| 10/03/2006 | US7115441 Semiconductor package with semiconductor chips stacked therein and method of making the package |
| 10/03/2006 | US7115435 Manufacturing method for wiring substrates |
| 10/03/2006 | US7115433 Contact structure of wiring and a method for manufacturing the same |
| 10/03/2006 | US7115425 Integrated circuit process monitoring and metrology system |
| 10/03/2006 | US7115218 Low temperature method and composition for producing electrical conductors |
| 10/03/2006 | US7115182 Anodic bonding process for ceramics |
| 10/03/2006 | US7114960 Compliant interconnect assembly |
| 10/03/2006 | US7114551 Liquid cooling module |
| 10/03/2006 | US7114550 Cooling device for heat-generating elements |
| 10/03/2006 | US7114256 Cooling device and apparatus and method for making the same |
| 10/03/2006 | US7114252 Large scale simultaneous circuit encapsulating apparatus |
| 10/03/2006 | US7114251 Method of producing of circuit board; for semiconductor device |
| 10/03/2006 | US7114250 Method of making components with releasable leads |
| 09/28/2006 | WO2006102589A1 Flip-attached and underfilled semiconductor device and method |
| 09/28/2006 | WO2006101886A2 A plasma enhanced atomic layer deposition system and method |
| 09/28/2006 | WO2006101861A2 Microelectronic packages and methods therefor |
| 09/28/2006 | WO2006101646A1 Method for forming a ruthenium metal layer on a patterned substrate |
| 09/28/2006 | WO2006101577A2 Lead frame panel and a plurality of half-etched connection bars |
| 09/28/2006 | WO2006101460A1 Embedded capacitor structure |
| 09/28/2006 | WO2006101302A2 Preparation of xylylendiamine using imidazole as a solvent |
| 09/28/2006 | WO2006101274A1 Method of manufacturing solid state imaging device |
| 09/28/2006 | WO2006101270A1 Solid state imaging device and manufacturing method thereof |
| 09/28/2006 | WO2006101199A1 Area mounting semiconductor device, and die bonding resin composition and sealing resin composition for use therein |
| 09/28/2006 | WO2006101130A1 Film-forming apparatus and film-forming method |
| 09/28/2006 | WO2006101124A1 Heating device, reflow device, heating method, and bump forming method |
| 09/28/2006 | WO2006101008A1 Epoxy resin composition, cured product thereof, novel epoxy resin, process for production thereof, and novel phenol resin |
| 09/28/2006 | WO2006100909A1 Semiconductor device and method for manufacturing same |
| 09/28/2006 | WO2006100769A1 Metal substrate/metal impregnated carbon composite material structure and method for manufacturing said structure |
| 09/28/2006 | WO2006100768A1 Semiconductor device and method for manufacturing same |
| 09/28/2006 | WO2006100759A1 Semiconductor device and method for manufacturing same |
| 09/28/2006 | WO2006100738A1 Semiconductor device and method for manufacturing same |
| 09/28/2006 | WO2006100444A1 Apparatus and method for increased device lifetime in an organic electro-luminescent device. |
| 09/28/2006 | WO2006099977A1 Method for producing an electronic appliance, and corresponding electronic appliance |
| 09/28/2006 | WO2006099936A2 Device and method for determining the temperature of a heat sink |
| 09/28/2006 | WO2006099831A1 Arrangement for heat dissipation |
| 09/28/2006 | WO2006099741A1 Solid-state lighting device package |
| 09/28/2006 | WO2006099713A1 Device and applications for passive rf components in leadframes |
| 09/28/2006 | WO2006085188A3 Electronic component protected against the attacks |
| 09/28/2006 | WO2006072107A3 Semiconductor device with embedded heat spreader |
| 09/28/2006 | US20060218518 Semiconductor integrated device and apparatus for designing the same |
| 09/28/2006 | US20060217278 A mixture of solvents with no corrosion of copper properties and a corrosion inhibitor; during the photolithographic process, removing photoresist remaining after forming copper line |
| 09/28/2006 | US20060216967 Device for controlling a vehicle |
| 09/28/2006 | US20060216927 Methods and systems for processing a device, methods and systems for modeling same and the device |
| 09/28/2006 | US20060216925 Semiconductor integrated circuit device and a method of manufacturing the same |
| 09/28/2006 | US20060216866 Universal interconnect die |
| 09/28/2006 | US20060216865 Direct cooling of leds |
| 09/28/2006 | US20060216864 Stacked die in die BGA package |
| 09/28/2006 | US20060216862 Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices |
| 09/28/2006 | US20060216860 Flip chip interconnection having narrow interconnection sites on the substrate |
| 09/28/2006 | US20060216858 Vertically Stacked Semiconductor Device |
| 09/28/2006 | US20060216854 Circuit board and process for producing the same |
| 09/28/2006 | US20060215715 Heat sink, laser module, laser device, and laser-processing device |
| 09/28/2006 | US20060215382 Integrated circuit carrier |
| 09/28/2006 | US20060215372 Dissipating apparatus for integrated circuit chip and display module including the same |
| 09/28/2006 | US20060214314 Method for fabricating flip-attached an underfilled semiconductor devices |
| 09/28/2006 | US20060214313 Die attach methods and apparatus |
| 09/28/2006 | US20060214312 Electronic devices |
| 09/28/2006 | US20060214311 Capillary underfill and mold encapsulation method and apparatus |
| 09/28/2006 | US20060214310 Aluminum cap with electroless nickel/immersion gold |
| 09/28/2006 | US20060214309 Integrated circuit and methods of redistributing bondpad locations |
| 09/28/2006 | US20060214308 Flip-chip semiconductor package and method for fabricating the same |
| 09/28/2006 | US20060214307 Method for designing chip package by re-using existing mask designs |
| 09/28/2006 | US20060214306 Semiconductor Chip and Method for Manufacturing the Same |
| 09/28/2006 | US20060214305 Semiconductor device having oxidized metal film and manufacture method of the same |
| 09/28/2006 | US20060214304 Memory device with improved data retention |
| 09/28/2006 | US20060214303 Organic-framework zeolite interlayer dielectrics |
| 09/28/2006 | US20060214302 Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus |
| 09/28/2006 | US20060214301 Connection device |
| 09/28/2006 | US20060214300 Method for manufacturing semiconductor device |
| 09/28/2006 | US20060214299 Electronic assembly including multiple substrates |
| 09/28/2006 | US20060214298 Dummy via for reducing proximity effect and method of using the same |
| 09/28/2006 | US20060214297 Wiring board, electronic circuit board, electronic apparatus and manufacturing method of electronic circuit board |
| 09/28/2006 | US20060214296 Semiconductor device and semiconductor-device manufacturing method |
| 09/28/2006 | US20060214295 Circuit board and manufacturing method thereof |
| 09/28/2006 | US20060214294 Semiconductor device and a semiconductor device manufacturing method |
| 09/28/2006 | US20060214293 Wafer level chip scale package having a gap and method for manufacturing the same |
| 09/28/2006 | US20060214292 C4 joint reliability |
| 09/28/2006 | US20060214291 Semiconductor device |
| 09/28/2006 | US20060214290 Semiconductor device with interlocking clip |
| 09/28/2006 | US20060214289 Gallium nitride material-based monolithic microwave integrated circuits |
| 09/28/2006 | US20060214288 Semiconductor device |
| 09/28/2006 | US20060214287 Semiconductor composite apparatus, print head, and image forming apparatus |
| 09/28/2006 | US20060214286 Integrated circuit thermal management method and apparatus |
| 09/28/2006 | US20060214285 Integrated circuit package |
| 09/28/2006 | US20060214284 Apparatus and method for data capture |
| 09/28/2006 | US20060214283 Semiconductor packaging mold and method of manufacturing semiconductor package using the same |
| 09/28/2006 | US20060214282 Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device |
| 09/28/2006 | US20060214281 Stress absorption layer and cylinder solder joint method and apparatus |