| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 10/04/2006 | CN1841731A Circuit of protecting integrated circuit element and integrated circuit element containing same |
| 10/04/2006 | CN1841729A Heavy current three-phase rectification power electronic device module |
| 10/04/2006 | CN1841728A Semiconductor module and method of manufacturing the same |
| 10/04/2006 | CN1841727A Connecting member used for semiconductor device and semiconductor device provided with the same |
| 10/04/2006 | CN1841726A 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 10/04/2006 | CN1841725A Semiconductor device with power module housed in casing |
| 10/04/2006 | CN1841724A Semiconductor device and designing method for the same |
| 10/04/2006 | CN1841723A Semiconductor interconnect structure and NOR type quickflashing memory and method of manufacture |
| 10/04/2006 | CN1841722A Electronic component mounting package and package assembled substrate |
| 10/04/2006 | CN1841721A Flip-chip type packaging structure and method for manufacturing same |
| 10/04/2006 | CN1841720A Substrate of display device for packaging driving integrated circuit |
| 10/04/2006 | CN1841719A Multilayer wiring board and its manufacturing method |
| 10/04/2006 | CN1841718A Semiconductor device and manufacturing method of the same |
| 10/04/2006 | CN1841717A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof |
| 10/04/2006 | CN1841716A Heat pipe radiator and mounting method thereof |
| 10/04/2006 | CN1841715A Electric circuit module as well as power converter and vehicle-mounted electric system that include the module |
| 10/04/2006 | CN1841714A Semiconductor unit package structure |
| 10/04/2006 | CN1841713A Thermal interface material and its making method |
| 10/04/2006 | CN1841712A Ceramic substrate and its disjunction method |
| 10/04/2006 | CN1841691A Method and apparatus for bonding electronic components |
| 10/04/2006 | CN1841689A Semiconductor device and semiconductor-device manufacturing method |
| 10/04/2006 | CN1841687A Sensor semiconductor device and its making method |
| 10/04/2006 | CN1841686A Method for producing flexible printed wiring board, and flexible printed wiring board |
| 10/04/2006 | CN1841265A 冷却套 Cooling jacket |
| 10/04/2006 | CN1841253A Heat radiator |
| 10/04/2006 | CN1841003A Thermal interface incorporating nanotubes |
| 10/04/2006 | CN1840258A Heat pipe with flat end surface and method for manufacturing the same |
| 10/04/2006 | CN1278430C Photoelectranic packing strucure and technology of plane type passive optical and photoelectronic apparatus |
| 10/04/2006 | CN1278417C Electrostatic discharge protecter and its producing method |
| 10/04/2006 | CN1278416C Static electricity protection method of analog signal input pin with common mode electrical level as its lowest electric potential in CMOS IC |
| 10/04/2006 | CN1278415C Semiconductor device with multiple wiring layers and mfg. method thereof |
| 10/04/2006 | CN1278414C Thermally driven heat exchanger |
| 10/04/2006 | CN1278413C Semiconductor element and method of manufacturing and multi-layer printed wiring board and mfg. method |
| 10/04/2006 | CN1278412C Press-contacting type semiconductor device |
| 10/04/2006 | CN1278409C Manufacturing method of semiconductor device and semiconductor device |
| 10/04/2006 | CN1278404C Electrified estimating apparatus, producing method thereof and electrified estimating method |
| 10/04/2006 | CN1278401C Manufacturing method for mounting substrate and method for making circuit device |
| 10/04/2006 | CN1278399C Process for making multiplayer wire distributed board having film capacitor |
| 10/04/2006 | CN1278202C Liquid-circulating refrigeration system for computer heat radiation |
| 10/04/2006 | CN1277952C Method for preparing low dielectric nano-porous film on substrate, products and integrated circuit |
| 10/04/2006 | CN1277881C Epoxy composition for light semiconductor packing |
| 10/03/2006 | US7117467 Methods for optimizing package and silicon co-design of integrated circuit |
| 10/03/2006 | US7117414 Method for identifying an integrated circuit |
| 10/03/2006 | US7117064 Method of depositing dielectric films |
| 10/03/2006 | US7116556 Heat sink mounting apparatus |
| 10/03/2006 | US7116555 Acoustic and thermal energy management system |
| 10/03/2006 | US7116544 Capacitor structure in a semiconductor device |
| 10/03/2006 | US7116348 Member to be recognized for alignment; head unit and electronic device provided therewith; method of manufacturing LCD, organic EL device, electron emission device, PDP device, electrophoretic display device, color filter, and organic EL; method of forming spacer, metallic wire, lens, resist, and light diffusion member, each of said methods using said head unit |
| 10/03/2006 | US7116184 Method of terminating bus, bus termination resistor, and wiring substrate having terminated buses and method of its manufacture |
| 10/03/2006 | US7116175 Semiconductor device |
| 10/03/2006 | US7116125 Semiconductor test device using leakage current and compensation system of leakage current |
| 10/03/2006 | US7116122 Method for ball grid array chip packages having improved testing and stacking characteristics |
| 10/03/2006 | US7116002 Overhang support for a stacked semiconductor device, and method of forming thereof |
| 10/03/2006 | US7116001 Bumped die and wire bonded board-on-chip package |
| 10/03/2006 | US7116000 Underfilled, encapsulated semiconductor die assemblies and methods of fabrication |
| 10/03/2006 | US7115999 Semiconductor device and method of manufacturing the same |
| 10/03/2006 | US7115998 Multi-component integrated circuit contacts |
| 10/03/2006 | US7115997 Seedless wirebond pad plating |
| 10/03/2006 | US7115996 Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped |
| 10/03/2006 | US7115994 Semiconductor substrate and method of fabricating semiconductor device |
| 10/03/2006 | US7115993 Structure comprising amorphous carbon film and method of forming thereof |
| 10/03/2006 | US7115992 Electrode structure for use in an integrated circuit |
| 10/03/2006 | US7115991 Method for creating barriers for copper diffusion |
| 10/03/2006 | US7115990 Bumped die and wire bonded board-on-chip package |
| 10/03/2006 | US7115989 Capable of keeping a sufficient elastic modulus even at high temperature, and does not cause a problem that paste remains |
| 10/03/2006 | US7115988 Bypass capacitor embedded flip chip package lid and stiffener |
| 10/03/2006 | US7115987 Integrated stacked microchannel heat exchanger and heat spreader |
| 10/03/2006 | US7115986 Flexible ball grid array chip scale packages |
| 10/03/2006 | US7115985 Reinforced bond pad for a semiconductor device |
| 10/03/2006 | US7115984 Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices |
| 10/03/2006 | US7115983 Multilayer, thin-film electronic devices |
| 10/03/2006 | US7115982 Semiconductor component having stiffener, stacked dice and circuit decals |
| 10/03/2006 | US7115981 Semiconductor device assemblies including interposers with dams protruding therefrom |
| 10/03/2006 | US7115980 Mounting structure, electro-optical device, and electronic apparatus |
| 10/03/2006 | US7115979 Light emitting diode package |
| 10/03/2006 | US7115978 Package Structure |
| 10/03/2006 | US7115977 Multi-chip package type semiconductor device |
| 10/03/2006 | US7115976 Method and apparatus for epoxy LOC die attachment |
| 10/03/2006 | US7115975 Semiconductor device, process of producing semiconductor device, and ink jet recording head |
| 10/03/2006 | US7115974 Silicon oxycarbide and silicon carbonitride based materials for MOS devices |
| 10/03/2006 | US7115972 Semiconductor device and chip-stack semiconductor device |
| 10/03/2006 | US7115968 Method of closing an antifuse using laser energy |
| 10/03/2006 | US7115967 Three-dimensional memory |
| 10/03/2006 | US7115966 Semiconductor device |
| 10/03/2006 | US7115964 Manufacturing method for SOI semiconductor device, and SOI semiconductor device |
| 10/03/2006 | US7115962 Housing for a photoactive semiconductor chip and a method for the production thereof |
| 10/03/2006 | US7115957 Semiconductor raised source-drain structure |
| 10/03/2006 | US7115952 System and method for ESD protection |
| 10/03/2006 | US7115951 Low triggering voltage ESD protection structure and method for reducing the triggering voltage |
| 10/03/2006 | US7115931 Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device |
| 10/03/2006 | US7115930 Semiconductor memory device including multi-layer gate structure |
| 10/03/2006 | US7115912 Device for defeating reverse engineering of integrated circuits by optical means |
| 10/03/2006 | US7115818 Flexible multilayer wiring board and manufacture method thereof |
| 10/03/2006 | US7115817 Heat sink and electromagnetic interference reduction device |
| 10/03/2006 | US7115812 Radiation shielded semiconductor package |
| 10/03/2006 | US7115516 Method of depositing a material layer |
| 10/03/2006 | US7115512 Methods of forming semiconductor constructions |
| 10/03/2006 | US7115509 Method for forming polysilicon local interconnects |
| 10/03/2006 | US7115505 Methods for electrically isolating portions of wafers |
| 10/03/2006 | US7115504 Method of forming electrode structure for use in an integrated circuit |