| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 10/05/2006 | US20060220209 Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides |
| 10/05/2006 | US20060220208 Stacked-type semiconductor device and method of manufacturing the same |
| 10/05/2006 | US20060220207 Stacked semiconductor package |
| 10/05/2006 | US20060220206 Vertically integrated system-in-a-package |
| 10/05/2006 | US20060220205 Electronic component mounting package and package assembled substrate |
| 10/05/2006 | US20060220204 Memory card |
| 10/05/2006 | US20060220203 Memory card |
| 10/05/2006 | US20060220202 Ic card and method of manufacturing the same |
| 10/05/2006 | US20060220201 Structure of memory card packaging and method of forming the same |
| 10/05/2006 | US20060220200 Substrate for IC package |
| 10/05/2006 | US20060220199 Low cost hermetically sealed package |
| 10/05/2006 | US20060220198 Semiconductor integrated circuit (IC) packaging with carbon nanotubes (CNT) to reduce IC/package stress |
| 10/05/2006 | US20060220197 Method of forming self-passivating interconnects and resulting devices |
| 10/05/2006 | US20060220196 Semiconductor device and method of manufacturing the same, metal component and method of manufacturing the same |
| 10/05/2006 | US20060220195 Structure and method to control underfill |
| 10/05/2006 | US20060220194 Controlling warping in integrated circuit devices |
| 10/05/2006 | US20060220193 Manufacturing method for magnetic sensor and lead frame therefor |
| 10/05/2006 | US20060220192 Semiconductor substrate, substrate for semiconductor crystal growth, semiconductor device, optical semiconductor device, and manufacturing method thereof |
| 10/05/2006 | US20060220191 Electronic package with a stepped-pitch leadframe |
| 10/05/2006 | US20060220190 Lead frame and semiconductor device |
| 10/05/2006 | US20060220189 Semiconductor module and method of manufacturing the same |
| 10/05/2006 | US20060220188 Package structure having mixed circuit and composite substrate |
| 10/05/2006 | US20060220187 Heatsink moldlocks |
| 10/05/2006 | US20060220186 Semiconductor constructions |
| 10/05/2006 | US20060220185 Optical information storage medium |
| 10/05/2006 | US20060220184 Antireflective coating for use during the manufacture of a semiconductor device |
| 10/05/2006 | US20060220174 E-Fuse and anti-E-Fuse device structures and methods |
| 10/05/2006 | US20060220173 Wafer level package including a device wafer integrated with a passive component |
| 10/05/2006 | US20060220154 Semiconductor device comprising a field-effect transitor and method of operating the same |
| 10/05/2006 | US20060220136 Electro-static discharge protection circuit and semiconductor device having the same |
| 10/05/2006 | US20060220135 Electrostatic discharge input protection circuit |
| 10/05/2006 | US20060220123 Chip scale surface mounted device and process of manufacture |
| 10/05/2006 | US20060220087 Method of forming a contact structure including a vertical barrier structure and two barrier layers |
| 10/05/2006 | US20060220045 Micromirror array device with compliant adhesive |
| 10/05/2006 | US20060220013 Techniques for facilitating identification updates in an integrated circuit |
| 10/05/2006 | US20060220012 Test key having a chain circuit and a kelvin structure |
| 10/05/2006 | US20060219436 Current sensor |
| 10/05/2006 | US20060219267 System, method and apparatus for self-cleaning dry etch |
| 10/05/2006 | DE19615481B4 Gewölbtes Metall-Keramik-Substrat Corrugated metal-ceramic substrate |
| 10/05/2006 | DE102006012322A1 Substrat für eine elektronische Einheit und Verfahren zu deren Herstellung, elektronische Einheit und Verfahren zu deren Herstellung A substrate for an electronic unit and methods for their preparation, electronic unit and methods for their preparation |
| 10/05/2006 | DE102006009505A1 Interface coolant e.g., for placing between semiconductor chip and heat-sink, is manufactured by mixing plastics material and crystalline carbon |
| 10/05/2006 | DE102005061959A1 Eliminierung von niederfrequenten Schwingungen bei Halbleiterschaltungsanordnungen Elimination of low-frequency vibrations in semiconductor circuitry |
| 10/05/2006 | DE102005033249B3 Cooling arrangement for computer system, has retaining plate provided between base plate and system circuit board in area of processor, and cooling device movably connected with retaining plate by screws and springs |
| 10/05/2006 | DE102005020059B3 Relining material`s thermal and mechanical characteristics improving method for carrier substrate and semiconductor chip arrangement, involves introducing material such that chip is positioned under substrate |
| 10/05/2006 | DE102005015454A1 Semiconductor sensor component comprises a cavity container and components arranged in a cavity of container, which exhibit a sensor chip with a sensor range, where cavity container exhibits opening and sensor range is turned to opening |
| 10/05/2006 | DE102005015334A1 Prober for testing substrate of e.g. semiconductor chip, has chuck with retaining surface to retain and cool substrate and fixed on carrier such that it is thermally uncoupled from another chuck and connected to cold head by connecting unit |
| 10/05/2006 | DE102005015109A1 Semiconductor chip assembling method, involves lifting component region of chip from substrate such that region indirectly contacts substrate via soldering material and chip is assembled on substrate by flip-chip technique |
| 10/05/2006 | DE102005014929A1 Inductor for integrated circuit, has number of vias connecting part of electrically conductive layers with each other to form three-dimensional conductive coil structure, where width of lower conductive strip is n-times width of upper strip |
| 10/05/2006 | DE102005014513A1 Vorrichtung und Verfahren zum Temperieren einen Substrats Apparatus and method for tempering a substrate |
| 10/05/2006 | DE102005014176A1 Protection arrangement providing method for e.g. ball grid array package, involves producing electrical connection between one line and terminal of circuit section, where connection has high impedance and does not runs over another line |
| 10/05/2006 | DE102005014094A1 Integration device for semiconductor components, has interposer having recess with contact surfaces, in which semiconductor component is inserted into recess with contact points of semiconductor component engaged with contact surfaces |
| 10/05/2006 | DE102005013686A1 ESD-Schutzschaltung mit skalierbarer Stromfestigkeit und Spannungsfestigkeit ESD protection circuit with scalable current strength and dielectric strength |
| 10/05/2006 | DE102005013500A1 Halbleiteranordnung und Verfahren zum Herstellen einer Halbleiteranordnung A semiconductor device and method of manufacturing a semiconductor device |
| 10/05/2006 | DE102005013478A1 Electrostatic discharge protection method for semiconductor circuit, involves arranging contact hole and metal layer exhibiting high heat conductivity compared to materials of circuit, in electrostatic discharge protection device |
| 10/05/2006 | DE102005012642A1 Energiespeicher zur Stützung der Versorgungsspannung einer integrierten Schaltung Energy storage to support the supply voltage of an integrated circuit |
| 10/05/2006 | DE102005010513A1 Integrated coaxial conductor arrangement has coaxial conductors circularly enclosed and arranged in tubular conductor trench formed underneath top side of substrate |
| 10/04/2006 | EP1708322A1 Semiconductor cooling device and stack of semiconductor cooling devices |
| 10/04/2006 | EP1708264A2 Cooling device for an electrical control device |
| 10/04/2006 | EP1708263A1 Cooling jacket |
| 10/04/2006 | EP1708262A2 Thermal conductor and use thereof |
| 10/04/2006 | EP1708261A1 Heat pipe radiator of heat-generating electronic component |
| 10/04/2006 | EP1708260A2 Electric circuit module as well as power converter and vehicle-mounted electric system that include the module |
| 10/04/2006 | EP1708258A1 Composite ceramic substrate |
| 10/04/2006 | EP1708250A2 Identification of a reference integrated circuit for a pick and place device |
| 10/04/2006 | EP1706900A2 A method for manufacturing a superjunction device with wide mesas |
| 10/04/2006 | EP1706897A2 Method of treating microelectronic substrates |
| 10/04/2006 | EP1706895A2 Silicon carbide on diamond substrates and related devices and methods |
| 10/04/2006 | EP1706750A2 Thermal protection for electronic components during processing |
| 10/04/2006 | EP1706666A1 Lighting assembly, heat sink and heat recovery system therefor |
| 10/04/2006 | EP1459375B1 Method of manufacturing an electronic device |
| 10/04/2006 | EP1423995B1 Sheet material and its use in circuit boards |
| 10/04/2006 | EP1325280A4 Method and structure for temperature stabilization in semiconductor devices |
| 10/04/2006 | EP0979854B1 Circuit connecting material, and structure and method of connecting circuit terminal |
| 10/04/2006 | CN2824514Y Radiator combination |
| 10/04/2006 | CN2824348Y 芯片连接器 Chip Connectors |
| 10/04/2006 | CN2824291Y Radiating structure |
| 10/04/2006 | CN2824290Y Fixing part of supporter for radiator |
| 10/04/2006 | CN2824289Y Full system evaporation cooler for switch power |
| 10/04/2006 | CN2824288Y Precise casing for high power integrated gate electrode converting thyristor |
| 10/04/2006 | CN1842915A Surface mount electronic component and process for manufacturing same |
| 10/04/2006 | CN1842914A Interposer and interposer producing method |
| 10/04/2006 | CN1842913A Electronic part and method of manufacturing the same |
| 10/04/2006 | CN1842912A Cap for airtight sealing, process for producing the same and package for electronic part accommodation |
| 10/04/2006 | CN1842911A Package for integrated circuit lead |
| 10/04/2006 | CN1842910A 复合电子部件 Composite electronic component |
| 10/04/2006 | CN1842907A Substrate for device bonding, device bonded substrate, and method for producing same |
| 10/04/2006 | CN1842906A Reversible leadless package and methods of making and using same |
| 10/04/2006 | CN1842905A Method of forming a bond pad |
| 10/04/2006 | CN1842903A Semiconductor device and method for fabricating same |
| 10/04/2006 | CN1842902A Semiconductor device and method for manufacturing same |
| 10/04/2006 | CN1842711A 电流传感器 Current Sensors |
| 10/04/2006 | CN1842265A Heat pipe radiator |
| 10/04/2006 | CN1842139A 光学装置模块 The optical device module |
| 10/04/2006 | CN1841873A ESD protection circuit and its layout |
| 10/04/2006 | CN1841866A Cooler and cooler laminated body for semiconductor |
| 10/04/2006 | CN1841859A Contact assembly and socket for use with semiconductor packages |
| 10/04/2006 | CN1841795A Structure of package using coupling and its forming method |
| 10/04/2006 | CN1841767A Semiconductor device and method of manufacturing the same |
| 10/04/2006 | CN1841757A Semiconductor device module and manufacturing method of semiconductor device module |
| 10/04/2006 | CN1841744A Semiconductor device incorporating protective diode with stable ESD protection capabilities |