| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 10/10/2006 | US7118837 Photoimaged dielectric polymer and film, and circuit package containing the same |
| 10/10/2006 | US7118386 Socket for semiconductor device |
| 10/10/2006 | US7117932 Radiator including a heat sink and a fan |
| 10/10/2006 | US7117930 Heat pipe fin stack with extruded base |
| 10/10/2006 | US7117928 Heat sinks for a cooler |
| 10/10/2006 | US7117592 Method of manufacturing a connector |
| 10/10/2006 | US7117587 Method for fabricating a substrate, including a plurality of chip package substrates |
| 10/10/2006 | US7117581 Method for high volume assembly of radio frequency identification tags |
| 10/10/2006 | CA2275556C A combined electrical and optical edge contact for compact connection of a part to another part, a use thereof and a method of manufacturing such an interconnection |
| 10/05/2006 | WO2006105514A2 Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides |
| 10/05/2006 | WO2006105326A1 Masking of repeated overlay and alignment marks to allow reuse of photomasks in a vertical structure |
| 10/05/2006 | WO2006105220A1 Systems for improved passive liquid cooling |
| 10/05/2006 | WO2006105184A1 Magnetically differential inductors and associated methods |
| 10/05/2006 | WO2006105015A2 Flip chip interconnection having narrow interconnection sites on the substrate |
| 10/05/2006 | WO2006104853A1 Low-temperature chemical vapor deposition of low-resistivity ruthenium layers |
| 10/05/2006 | WO2006104768A2 Anisotropic electrically conductive structure |
| 10/05/2006 | WO2006104583A2 Method and system for increasing tensile stress in a thin film using multi-frequency electromagnetic radiation |
| 10/05/2006 | WO2006104582A2 Method and system for increasing tensile stress in a thin film using collimated electromagnetic radiation |
| 10/05/2006 | WO2006104525A2 Esd foam ground clip |
| 10/05/2006 | WO2006103962A1 Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulation |
| 10/05/2006 | WO2006103620A2 Carbon nanotube bond pad srtucture and manufacturing method thereof |
| 10/05/2006 | WO2006103299A1 Low- thickness electronic module comprising a pile of electronic package provided with connection balls |
| 10/05/2006 | WO2006102874A1 Semiconductor module comprising semiconductor chips that are contained in separate areas of a plastic housing and method for producing said module |
| 10/05/2006 | WO2006102838A1 An heat conductive pipe with flat end and its manufacturing method |
| 10/05/2006 | WO2006102801A1 A packaging method of spot gluing liquid resin |
| 10/05/2006 | WO2006063822A3 Multilayer structure with a temperature control fluid channel, and production method |
| 10/05/2006 | WO2006023034A3 Probe pad arrangement for an integrated circuit and method of forming |
| 10/05/2006 | WO2006007141A3 Lead solder indicator and method |
| 10/05/2006 | WO2005124859A3 Methods and apparatuses for depositing uniform layers |
| 10/05/2006 | US20060223345 Sockets for "springed" semiconductor devices |
| 10/05/2006 | US20060223325 Semiconductor device and method for fabricating the same |
| 10/05/2006 | US20060223323 Method of forming an interconnect structure |
| 10/05/2006 | US20060223322 Method of forming a trench structure |
| 10/05/2006 | US20060223306 Method for forming film, method for manufacturing semiconductor device, semiconductor device and substrate treatment system |
| 10/05/2006 | US20060223304 Semiconductor device and pattern generating method |
| 10/05/2006 | US20060223238 Leadless semiconductor package and manufacturing method thereof |
| 10/05/2006 | US20060223237 Method of manufacturing enhanced thermal dissipation integrated circuit package |
| 10/05/2006 | US20060223230 Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same |
| 10/05/2006 | US20060223229 Ball grid array package and process for manufacturing same |
| 10/05/2006 | US20060223216 Sensor module structure and method for fabricating the same |
| 10/05/2006 | US20060222852 Packaging of integrated circuits with carbon nanotube arrays to enhance heat dissipation through a thermal interface |
| 10/05/2006 | US20060222760 Process for producing a multifunctional dielectric layer on a substrate |
| 10/05/2006 | US20060221686 Integrated circuit that uses a dynamic characteristic of the circuit |
| 10/05/2006 | US20060221586 Packaging substrate having adhesive-overflowing prevention structure |
| 10/05/2006 | US20060221570 Cooling device for heat-generating electronic component |
| 10/05/2006 | US20060220500 Method for manufacturing surface acoustic wave device |
| 10/05/2006 | US20060220265 Alignment mark for semiconductor device, and semiconductor device |
| 10/05/2006 | US20060220264 Mounting structure and mounting method of a semiconductor device, and liquid crystal display device |
| 10/05/2006 | US20060220263 Semiconductor device to be applied to various types of semiconductor package |
| 10/05/2006 | US20060220262 Stacked die package |
| 10/05/2006 | US20060220261 Semiconductor device |
| 10/05/2006 | US20060220260 Semiconductor chip package and manufacturing method thereof |
| 10/05/2006 | US20060220259 Multi-chip structure and method of assembling chips |
| 10/05/2006 | US20060220258 Method for mounting semiconductor chips on a substrate and corresponding assembly |
| 10/05/2006 | US20060220257 Multi-chip package and method for manufacturing the same |
| 10/05/2006 | US20060220256 Encapsulant cavity integrated circuit package system |
| 10/05/2006 | US20060220255 Terminal layer setting method for semiconductor circuit having a plurality of circuit layers, storage media storing terminal layer setting program, storage media storing a wiring terminal extension processing program and terminal extending component used for setting of the terminal layer |
| 10/05/2006 | US20060220254 Semiconductor device which prevents peeling of low-permittivity film by using multilevel interconnection |
| 10/05/2006 | US20060220253 Porous film, composition and manufacturing method, interlayer dielectric film, and semiconductor device |
| 10/05/2006 | US20060220252 Semiconductor device and driving method thereof |
| 10/05/2006 | US20060220251 Reducing internal film stress in dielectric film |
| 10/05/2006 | US20060220250 Crack stop and moisture barrier |
| 10/05/2006 | US20060220248 Low-temperature chemical vapor deposition of low-resistivity ruthenium layers |
| 10/05/2006 | US20060220247 Semiconductor device and manufacturing method therefor |
| 10/05/2006 | US20060220246 Bump land structure of circuit substrate for semiconductor package |
| 10/05/2006 | US20060220245 Flip chip package and the fabrication thereof |
| 10/05/2006 | US20060220244 Contact pad and bump pad arrangement for high-lead or lead-free bumps |
| 10/05/2006 | US20060220243 Electronic device package |
| 10/05/2006 | US20060220242 Method for producing flexible printed wiring board, and flexible printed wiring board |
| 10/05/2006 | US20060220241 Packaged semiconductor device and method of manufacture using shaped die |
| 10/05/2006 | US20060220240 Analytic structure for failure analysis of semiconductor device |
| 10/05/2006 | US20060220239 LGA socket with emi protection |
| 10/05/2006 | US20060220238 Multi-functional metal shield case and method for making the same |
| 10/05/2006 | US20060220237 Electronic substrate |
| 10/05/2006 | US20060220236 Semiconductor device with power module housed in casing |
| 10/05/2006 | US20060220235 Semiconductor device and insulating substrate for the same |
| 10/05/2006 | US20060220234 Wire bonded wafer level cavity package |
| 10/05/2006 | US20060220233 Electronic component mounting package and package assembled substrate |
| 10/05/2006 | US20060220232 Semiconductor device module and manufacturing method of semiconductor device module |
| 10/05/2006 | US20060220231 Semiconductor device and manufacturing method therefor |
| 10/05/2006 | US20060220230 Semiconductor device and method of manufacturing thereof |
| 10/05/2006 | US20060220229 Methods and apparatus for a flexible circuit interposer |
| 10/05/2006 | US20060220228 Methods and apparatus for a flexible circuit interposer |
| 10/05/2006 | US20060220227 High density integrated circuit having multiple chips and employing a ball grid array (BGA) and method for making same |
| 10/05/2006 | US20060220226 Integrated heat spreader with intermetallic layer and method for making |
| 10/05/2006 | US20060220225 Semiconductor packages and methods of manufacturing thereof |
| 10/05/2006 | US20060220224 Thermally Enhanced Three-Dimensional Package and Method for Manufacturing the Same |
| 10/05/2006 | US20060220223 Reactive nano-layer material for MEMS packaging |
| 10/05/2006 | US20060220221 Semiconductor device and a manufacturing method of the same |
| 10/05/2006 | US20060220220 Electronic device and method for fabricating the same |
| 10/05/2006 | US20060220219 Substrate for IC package |
| 10/05/2006 | US20060220218 Embedded-type power semiconductor package device |
| 10/05/2006 | US20060220217 High precision connector member and manufacturing method thereof |
| 10/05/2006 | US20060220216 Circuit device and manufacturing method thereof |
| 10/05/2006 | US20060220215 Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same |
| 10/05/2006 | US20060220214 Semiconductor device and manufacturing method thereof |
| 10/05/2006 | US20060220213 Semiconductor device |
| 10/05/2006 | US20060220212 Stacked package for electronic elements |
| 10/05/2006 | US20060220211 Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance |
| 10/05/2006 | US20060220210 Semiconductor assembly including chip scale package and second substrate and having exposed substrate surfaces on upper and lower sides |