H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2006
10/11/2006	CN1845329A Layout structure in semiconductor memory device and layout method therefor
10/11/2006	CN1845328A Display circuit structure
10/11/2006	CN1845326A Flat panel display and method of fabricating the same
10/11/2006	CN1845325A Laminated semiconductor device
10/11/2006	CN1845324A Stack bare-die package composite structure of multiple IC
10/11/2006	CN1845323A Heat radiation pipe structure and its making method
10/11/2006	CN1845322A Heat radiation pipe structure and its making method
10/11/2006	CN1845321A Flat-type heat pipe manufacturing method using ultrasonic welding
10/11/2006	CN1845320A Heat pipe manufacturing method using capping
10/11/2006	CN1845319A Wafer heat radiation structure and its structure manufacturing method
10/11/2006	CN1845318A Thermal interface material structure and its making process
10/11/2006	CN1845317A Cu-W thin film coating integrated composite heat sink
10/11/2006	CN1845316A Semiconductor light-source
10/11/2006	CN1845315A Integratively formed chip superconducting radiator
10/11/2006	CN1845314A Wafer heat radiation system and its heat-exchange device structure and manufacturing method
10/11/2006	CN1845313A Heat sink fin structure and its making method
10/11/2006	CN1845312A Air-blowing type wafer heat radiation device and its device making method
10/11/2006	CN1845311A Wafer heat radiation system and its heat radiator structure and manufacturing method
10/11/2006	CN1279623C TFT substrate, liquid crystal display device using the same, and its manufacturing method
10/11/2006	CN1279615C Semiconductor device and method for producing same
10/11/2006	CN1279613C Metal internal ligature structure
10/11/2006	CN1279612C Circuit base plate, electronic machine, and method of manufacture
10/11/2006	CN1279605C Semiconductor device and its producing method, circuit base board and electronic instrment
10/11/2006	CN1279604C Semiconductor device and its producing method, circuit base board and electronic instrument
10/11/2006	CN1279596C Soft soldering method for semiconductor components and semiconductor device
10/10/2006	US7120886 Device for determining the mask version utilized for each metal layer of an integrated circuit
10/10/2006	US7120884 Mask revision ID code circuit
10/10/2006	US7120287 Non-lot based method for assembling integrated circuit devices
10/10/2006	US7120069 Electronic circuit package
10/10/2006	US7120033 Electrically conducting bonding connection
10/10/2006	US7120031 Data processing system comprising ceramic/organic hybrid substrate with embedded capacitors
10/10/2006	US7120025 Imaging apparatus
10/10/2006	US7120023 Method of assembly of a wedge thermal interface to allow expansion after assembly
10/10/2006	US7120022 Loop thermosyphon with wicking structure and semiconductor die as evaporator
10/10/2006	US7120020 Electronic assemblies with high capacity bent fin heat sinks
10/10/2006	US7119963 Lenticular screen with removable alignment tab
10/10/2006	US7119657 Polysilicon resistor semiconductor device
10/10/2006	US7119650 Integrated transformer
10/10/2006	US7119613 RF amplifier
10/10/2006	US7119449 Enhancement of underfill physical properties by the addition of thermotropic cellulose
10/10/2006	US7119448 Main power inductance based on bond wires for a switching power converter
10/10/2006	US7119447 Direct fet device for high frequency application
10/10/2006	US7119446 Semiconductor device
10/10/2006	US7119445 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
10/10/2006	US7119444 Versatile system for charge dissipation in the formation of semiconductor device structures
10/10/2006	US7119443 Titanium nitride film formed over substrate and containing halogen element; chemical vapor deposited second conductive film using material gas with halogen-free element; chemical mechanical polishing or sputtering
10/10/2006	US7119442 Semiconductor device
10/10/2006	US7119441 Semiconductor interconnect structure
10/10/2006	US7119440 Dielectric over tungsten, metal silicide, copper, or aluminum-copper intermetallic; sputtering aluminum-copper alloy or intermetallic to fill via opening; photolithographically patterning and dry etching to form interconnect line; semiconductors; electrical resistance
10/10/2006	US7119439 Semiconductor device and method for manufacturing the same
10/10/2006	US7119438 Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor device
10/10/2006	US7119437 Electronic substrate, power module and motor driver
10/10/2006	US7119436 Memory module
10/10/2006	US7119434 Efficiency CPU cooling arrangement
10/10/2006	US7119433 Packaging for enhanced thermal and structural performance of electronic chip modules
10/10/2006	US7119432 Method and apparatus for establishing improved thermal communication between a die and a heatspreader in a semiconductor package
10/10/2006	US7119431 Apparatus and method for forming heat sinks on silicon on insulator wafers
10/10/2006	US7119430 Spacer for mounting a chip package to a substrate
10/10/2006	US7119429 3-D stackable semiconductor package
10/10/2006	US7119428 Semiconductor device
10/10/2006	US7119427 Stacked BGA packages
10/10/2006	US7119426 Semiconductor device and manufacturing method of same
10/10/2006	US7119425 Stacked multi-chip semiconductor package improving connection reliability of stacked chips
10/10/2006	US7119424 Semiconductor device and method for manufacturing the same
10/10/2006	US7119423 Semiconductor device and method of manufacturing the same, electronic module, and electronic instrument
10/10/2006	US7119422 Solid-state semiconductor light emitting device
10/10/2006	US7119421 Quad flat non-leaded package comprising a semiconductor device
10/10/2006	US7119420 Chip packaging structure adapted to reduce electromagnetic interference
10/10/2006	US7119419 Detailed description of the presently preferred embodiments
10/10/2006	US7119418 Supercritical fluid-assisted deposition of materials on semiconductor substrates
10/10/2006	US7119414 Fuse layout and method trimming
10/10/2006	US7119401 Tunable semiconductor diodes
10/10/2006	US7119399 LDMOS transistor
10/10/2006	US7119383 Arrangement of wiring lines including power source lines and channel wirings of a semiconductor integrated circuit having plural cells
10/10/2006	US7119379 Semiconductor device
10/10/2006	US7119372 Flip-chip light emitting diode
10/10/2006	US7119363 Thin film transistor formed on a transparent substrate
10/10/2006	US7119362 Method of manufacturing semiconductor apparatus
10/10/2006	US7119351 Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system
10/10/2006	US7119029 Method of oxidizing a silicon substrate and method of forming an oxide layer using the same
10/10/2006	US7119025 Methods of eliminating pattern collapse on photoresist patterns
10/10/2006	US7119014 Method for fabricating a semiconductor device having a tapered-mesa side-wall film
10/10/2006	US7119011 Semiconductor device and manufacturing method thereof
10/10/2006	US7119010 Integrated circuit with self-aligned line and via and manufacturing method therefor
10/10/2006	US7119009 Semiconductor device with dual damascene wiring
10/10/2006	US7119008 Integrating metal layers with ultra low-K dielectrics
10/10/2006	US7119004 Semiconductor device, its manufacturing method, and ratio communication device
10/10/2006	US7119003 Extension of fatigue life for C4 solder ball to chip connection
10/10/2006	US7119000 Method of manufacturing semiconductor device
10/10/2006	US7118998 Method of forming a conductive structure
10/10/2006	US7118992 Wafer thinning using magnetic mirror plasma
10/10/2006	US7118985 Method of forming a metal-insulator-metal capacitor in an interconnect cavity
10/10/2006	US7118984 Method for fabricating semiconductor component
10/10/2006	US7118962 Nonvolatile memory device and method for manufacturing the same
10/10/2006	US7118961 Stitch and select implementation in twin MONOS array
10/10/2006	US7118941 Forming carbon nanotubes on a substrate; depositing a layer of a metal over the nanotubes and exposed portions of the surface to form a metal matrix around thenanotubes; and separating the matrix and nanotubes from the substrate to form a free-standing device; for packaged integrated circuits
10/10/2006	US7118940 Method of fabricating an electronic package having underfill standoff
10/10/2006	US7118939 Manufacturing method and manufacturing apparatus for semiconductor device
10/10/2006	US7118938 Method for packaging a multi-chip module of a semiconductor device
10/10/2006	US7118931 Radiation emitter device having an integral micro-groove lens

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