H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2006
10/12/2006	US20060226541 Electroosmotic pumps using porous frits for cooling integrated circuit stacks
10/12/2006	US20060226540 Chip package
10/12/2006	US20060226539 Integrated circuit coolant microchannel assembly with targeted channel configuration
10/12/2006	US20060226538 Interposer and semiconductor device employing same, and method for manufacturing semiconductor device
10/12/2006	US20060226537 Multilayer circuit board and method of manufacturing the same
10/12/2006	US20060226536 Semiconductor multipackage module including tape substrate land grid array package stacked over ball grid array package
10/12/2006	US20060226535 Reinforced bond pad for a semiconductor device
10/12/2006	US20060226534 Structure and assembly method of integrated circuit package
10/12/2006	US20060226533 Via connection structure with a compensative area on the reference plane
10/12/2006	US20060226532 Semiconductor device
10/12/2006	US20060226531 Power semiconductor module
10/12/2006	US20060226530 Advanced standard cell power connection
10/12/2006	US20060226529 Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate
10/12/2006	US20060226528 Multipackage module having stacked packages with asymmetrically arranged die and molding
10/12/2006	US20060226527 Semiconductor device and method of manufacturing semiconductor device
10/12/2006	US20060226526 Microcontroller internal data capture and display
10/12/2006	US20060226525 Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same
10/12/2006	US20060226524 Micro-device packaging
10/12/2006	US20060226523 Organic electronic devices having external barrier layer
10/12/2006	US20060226522 Full fault tolerant architecture for organic electronic devices
10/12/2006	US20060226521 Semiconductor Package Having Integrated Metal Parts for Thermal Enhancement
10/12/2006	US20060226520 Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component
10/12/2006	US20060226519 Method and system for increasing tensile stress in a thin film using collimated electromagnetic radiation
10/12/2006	US20060226518 Method and system for increasing tensile stress in a thin film using multi-frequency electromagnetic radiation
10/12/2006	US20060226517 Gas barrier film, substrate film, and organis electroluminescence device
10/12/2006	US20060226516 Silicon-doped carbon dielectrics
10/12/2006	US20060226515 Semiconductor device and manufacturing method thereof
10/12/2006	US20060226514 Semiconductor epitaxial wafer
10/12/2006	US20060226488 Lateral bipolar transistor with additional ESD implant
10/12/2006	US20060226487 Resistor with reduced leakage
10/12/2006	US20060226479 Semiconductor device having field stabilization film and method
10/12/2006	US20060226451 Power semiconductor device and method therefor
10/12/2006	US20060226433 Strobe light control circuit and IGBT device
10/12/2006	US20060226142 Enhancement of performance of a conductive wire in a multilayered substrate
10/12/2006	US20060226118 Methods for forming backside alignment markers useable in semiconductor lithography
10/12/2006	US20060225908 Method of making a heat dissipating microdevice
10/12/2006	US20060225272 Method of fabricating semiconductor chip assemblies
10/12/2006	DE10343255B4 Verfahren zum Herstellen elektrischer Verbindungen zwischen einem Halbleiterchip in einem BGA-Gehäuse und einer Leiterplatte A method of making electrical connections between a semiconductor chip in a BGA package and a printed circuit board
10/12/2006	DE10300949B4 Halbleitervorrichtung mit Herstellungsverfahren dafür Semiconductor device manufacturing method thereof
10/12/2006	DE102006011689A1 Halbleitervorrichtung und isolierendes Substrat für dieselbe Semiconductor device and the insulating substrate for the same
10/12/2006	DE102006004420A1 Vorrichtung zur Umwandlung der elektrischen Energie A device for converting the electrical energy
10/12/2006	DE102005034439B3 Cooling arrangement for computer system, has cooling device fasted at threaded holes of base plate by screws, where plate has stampings in which spacers are introduced by sliding/rotary motion such that spacers are retained in area of holes
10/12/2006	DE102005029246A1 Halbleiterchip mit einer Lötschichtenfolge und Verfahren zum Löten eines Halbleiterchips Semiconductor chip with a solder layer and the procedures for soldering a semiconductor chip
10/12/2006	DE102005015455A1 Kunststoffgehäuse und Halbleiterbauteil mit derartigem Kunststoffgehäuse sowie Verfahren zur Herstellung desselben The same plastic housing and the semiconductor device with such plastic housing and methods for preparing
10/12/2006	DE102005002814B3 Halbleitersensorbauteil mit geschützten Zuleitungen und Verfahren zur Herstellung desselben Of the same semiconductor sensor component with leads protected and methods for preparing
10/12/2006	DE102004039620B4 Integrierte Schaltung, die eine vorgegebene Spannungsfestigkeit besitzt Integrated circuit having a predetermined dielectric strength
10/12/2006	DE10164606B4 Flip-Chip-Halbleitereinrichtung mit außerhalb von Energiezufuhranschlussflächen angeordneten Signalanschlussflächen Flip-chip semiconductor device having arranged outside of power supply pads signal pads
10/12/2006	CA2617314A1 Mounting assembly for optoelectronic devices
10/12/2006	CA2614803A1 Electronic device package with an integrated evaporator
10/12/2006	CA2598485A1 Integrated smart power switch
10/11/2006	EP1710832A2 Electronic assembly with a noflow underfill
10/11/2006	EP1710085A2 Semiconductor device, ink tank provided with such semiconductor device, ink jet cartridge, ink jet recorsding apparatus, method for manufacturing such semiconductor device, and communication system, method for controlling pressure, memory element, security system of ink jet recording apparatus
10/11/2006	EP1709854A2 System and method for self-leveling heat sink for multiple height devices
10/11/2006	EP1709848A1 Partially etched dielectric film with conductive features
10/11/2006	EP1709686A2 Apparatus incorporating small-feature-size and large-feature-size components and method for making same
10/11/2006	EP1709685A1 Efficient use of wafer area with device under the pad approach
10/11/2006	EP1709684A1 Pillar bumps for high power chip interconnection
10/11/2006	EP1709683A1 Method and system for cooling at least one electronic device
10/11/2006	EP1709679A1 System and method for surface reduction, passivation, corrosion prevention and activation of copper surface
10/11/2006	EP1709678A1 Stress free etch processing in combination with a dynamic liquid meniscus
10/11/2006	EP1709674A1 Plasma processing method and method for fabricating electronic component module using the same
10/11/2006	EP1709673A1 Semiconductor device and method of manufacturing thereof
10/11/2006	EP1708958A1 Microcomponent comprising a hermetically-sealed cavity and a plug, and method of producing one such microcomponent
10/11/2006	EP1587728B1 Stanchion with an integrated device for securing a load, in particular for tarpaulin-covered transport vehicles
10/11/2006	EP1508583B1 Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, process for producing the same, and sealing material and laminate each comprising or made with the same
10/11/2006	EP1356510A4 Wafer scale molding of protective caps
10/11/2006	EP1337497B1 A heat conductive material
10/11/2006	EP1320712B1 Multi-purpose microchannel micro-component
10/11/2006	EP1264347B1 Electronic module having a three dimensional array of carrier-mounted integrated circuit packages
10/11/2006	EP0903060B1 Apparatus and method for mounting an electronic component to a substrate
10/11/2006	EP0870325B1 Microelectronic mounting with multiple lead deformation
10/11/2006	CN2826920Y Binding structure of heat pipe and heat sink
10/11/2006	CN2826695Y 半导体衬底 A semiconductor substrate
10/11/2006	CN2826694Y ESD protection structure
10/11/2006	CN2826693Y Metal lead frame with different pin thickness for IC
10/11/2006	CN2826692Y Improved structure of semiconductor lead frame
10/11/2006	CN2826691Y Bumpless chip package
10/11/2006	CN2826690Y Heat radiator for large power consumption power device
10/11/2006	CN2826689Y Heat sink fixer
10/11/2006	CN2826688Y Heat radiation module for central processing unit
10/11/2006	CN2826687Y Heat radiator
10/11/2006	CN2826686Y Riveting and close-fitting structure of heat sink and base
10/11/2006	CN2826685Y Wiring structure of memory card stack circuit
10/11/2006	CN2826514Y Heat-dividing radiator of computer processor
10/11/2006	CN2826513Y 散热器 Heat sink
10/11/2006	CN2826512Y 散热器 Heat sink
10/11/2006	CN1846466A Laser monitoring and control in a transmitter optical subassembly having a ceramic feedthrough header assembly
10/11/2006	CN1846311A Stackable electronic assembly
10/11/2006	CN1846308A Microelectronic package method and device
10/11/2006	CN1846307A Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow
10/11/2006	CN1846306A Method for producing an electronic component or module and a corresponding component or module
10/11/2006	CN1846303A Process for fabricating electronic components using liquid injection molding
10/11/2006	CN1846302A Integrated electronic chip and interconnect device and process for making the same
10/11/2006	CN1846296A Integrated circuit with a capacitor and method for the production thereof
10/11/2006	CN1845838A Control unit and method for producing the same
10/11/2006	CN1845661A Heat radiator
10/11/2006	CN1845655A Wiring board, multilayer wiring board, and method for manufacturing the same
10/11/2006	CN1845414A Protection circuit for resisting power supply abrupt change
10/11/2006	CN1845333A Camera module and method of manufacturing the same
10/11/2006	CN1845330A Semiconductor memory device

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