H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2006
10/17/2006	US7122895 Stud-cone bump for probe tips used in known good die carriers
10/17/2006	US7122894 Wiring substrate and process for manufacturing the same
10/17/2006	US7122893 Semiconductor package structure
10/17/2006	US7122892 Multi-chip integrated circuit module for high-frequency operation
10/17/2006	US7122891 Ceramic embedded wireless antenna
10/17/2006	US7122890 Low cost power semiconductor module without substrate
10/17/2006	US7122889 Semiconductor module
10/17/2006	US7122888 Semiconductor device, electrical inspection method thereof, and electronic apparatus including the semiconductor device
10/17/2006	US7122887 Chip scale surface mounted device and process of manufacture
10/17/2006	US7122886 Semiconductor module and method for mounting the same
10/17/2006	US7122885 Flip-chip packaging
10/17/2006	US7122884 Robust leaded molded packages and methods for forming the same
10/17/2006	US7122883 Stacked semiconductor device including improved lead frame arrangement
10/17/2006	US7122882 Low cost power MOSFET with current monitoring
10/17/2006	US7122881 Wiring board and circuit module
10/17/2006	US7122877 Semiconductor device and method for producing the same
10/17/2006	US7122875 Semiconductor device
10/17/2006	US7122874 Electronic package having a sealing structure on predetermined area, and the method thereof
10/17/2006	US7122850 Semiconductor device having local interconnection layer and etch stopper pattern for preventing leakage of current
10/17/2006	US7122830 Semiconductor device and method of manufacturing the same
10/17/2006	US7122829 Probe look ahead: testing parts not currently under a probehead
10/17/2006	US7122748 Semiconductor device having packaging structure
10/17/2006	US7122587 Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device
10/17/2006	US7122478 Method of manufacturing a semiconductor device using a polysilicon etching mask
10/17/2006	US7122468 Methods of fabricating integrated circuit conductive contact structures including grooves
10/17/2006	US7122466 Two step semiconductor manufacturing process for copper interconnects
10/17/2006	US7122463 Manufacturing method of semiconductor device
10/17/2006	US7122462 Back end interconnect with a shaped interface
10/17/2006	US7122460 Electromigration barrier layers for solder joints
10/17/2006	US7122459 Semiconductor wafer package and manufacturing method thereof
10/17/2006	US7122458 Method for fabricating pad redistribution layer
10/17/2006	US7122457 Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device
10/17/2006	US7122456 Method for reduced input output area
10/17/2006	US7122440 Semiconductor device and fabrication method thereof
10/17/2006	US7122434 Method for generating an electrical contact with buried track conductors
10/17/2006	US7122421 Semiconductor device including a transistor and a capacitor having an aligned transistor and capacitive element
10/17/2006	US7122419 Capacitor and fabrication method thereof
10/17/2006	US7122407 Method for fabricating window ball grid array semiconductor package
10/17/2006	US7122404 Techniques for packaging a multiple device component
10/17/2006	US7122401 Area array type semiconductor package fabrication method
10/17/2006	US7122400 Method of fabricating an interconnection for chip sandwich arrangements
10/17/2006	US7122391 Wafer-level test structure for edge-emitting semiconductor lasers
10/17/2006	US7122390 Methods of fabrication for flip-chip image sensor packages
10/17/2006	US7122388 Method of detecting misalignment of ion implantation area
10/17/2006	US7122387 Deposition stop time detection apparatus and methods for fabricating copper wiring using the same
10/17/2006	US7122243 Metal/ceramic bonding substrate and method for producing same
10/17/2006	US7122124 Method of fabricating film carrier
10/17/2006	US7122069 High density
10/17/2006	US7121843 Integrated circuit socket corner relief
10/17/2006	US7121839 Compliant interconnect assembly
10/17/2006	US7121327 Heat sink assembly
10/17/2006	US7120999 Methods of forming a contact array in situ on a substrate
10/17/2006	US7120987 Method of making RFID device
10/17/2006	CA2211533C Glass bonding layer for a ceramic circuit board support substrate
10/15/2006	CA2651842A1 A base plate for a dual base plate heatsink
10/12/2006	WO2006107802A1 Radiation curable cycloaliphatic barrier sealants
10/12/2006	WO2006107660A1 Refractory solid, adhesive composition, and device, and associated method
10/12/2006	WO2006107659A1 Resin compositions and methods of use thereof
10/12/2006	WO2006107582A1 Electronic package with a stepped-pitch leadframe
10/12/2006	WO2006107507A2 Wafer level package including a device wafer integrated with a passive component
10/12/2006	WO2006107365A2 Heat sink for multiple semiconductor modules
10/12/2006	WO2006106939A1 Cu-Ni-Si-Co-Cr BASED COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCTION THEREOF
10/12/2006	WO2006106840A1 Heat sink and method of manufacturing the same
10/12/2006	WO2006106761A1 Transmission line pair
10/12/2006	WO2006106564A1 Semiconductor device mounting method, and semiconductor device
10/12/2006	WO2006105760A1 Plastic housing and semi-conductor component comprising said type of plastic housing in addition to a method for the production thereof
10/12/2006	WO2006105759A1 Semi-conductor sensor component with a cavity housing and sensor chip and method for the production thereof
10/12/2006	WO2006105735A1 Package structure with flat bumps for integrate circuit or discrete device and method of manufacture the same
10/12/2006	WO2006105734A1 A packaging substrate with flat bumps for electronic devices and method of manufacturing the same
10/12/2006	WO2006105733A1 Package structure with flat bumps for electronic device and method of manufacture the same
10/12/2006	WO2006105644A1 Mounting assembly for optoelectronic devices
10/12/2006	WO2006105638A1 Electronic device package with an integrated evaporator
10/12/2006	WO2006105586A1 A method for producing a multi component electronic module and a module produced by the method
10/12/2006	WO2006052465A3 Polymeric substrate having a desiccant layer
10/12/2006	WO2006048843A3 Integrated circuit nanotube-based substrate
10/12/2006	US20060229694 Substrate sensor
10/12/2006	US20060228926 Socket for semiconductor device
10/12/2006	US20060228916 Socket for semiconductor device
10/12/2006	US20060228915 Socket for semiconductor device
10/12/2006	US20060228897 Rapid thermal processing using energy transfer layers
10/12/2006	US20060228884 Unidirectionally conductive materials for interconnection
10/12/2006	US20060228857 DRAM cells
10/12/2006	US20060228833 Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein
10/12/2006	US20060228636 Pattern layout for forming integrated circuit
10/12/2006	US20060226927 Method of terminating bus,bus termination resistor and wiring subtrate having terminated buses and method of its manufacture
10/12/2006	US20060226736 Acoustic resonator support, acoustic resonator and corresponding integrated circuit
10/12/2006	US20060226557 Semiconductor substrate with occurrence of slip suppressed and method of manufacturing the same
10/12/2006	US20060226555 Semiconductor device and manufacturing method thereof
10/12/2006	US20060226554 Semiconductor device with contact structure and manufacturing method thereof
10/12/2006	US20060226553 Selective isotropic etch for titanium-based materials
10/12/2006	US20060226552 Semiconductor structure formed using a sacrificial structure
10/12/2006	US20060226551 Integrated circuit device and method of producing the same
10/12/2006	US20060226550 Molybdenum-based electrode with carbon nanotube growth
10/12/2006	US20060226549 Semiconductor device and fabricating method thereof
10/12/2006	US20060226548 Very low dielectric constant plasma-enhanced cvd films
10/12/2006	US20060226547 Semiconductor chip capable of implementing wire bonding over active circuits
10/12/2006	US20060226545 Semiconductor device
10/12/2006	US20060226544 Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same
10/12/2006	US20060226543 Ball grid array package stack
10/12/2006	US20060226542 Semiconductor device and fabrication method thereof

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