H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2006
10/18/2006	EP1048392B1 Pb-FREE SOLDER-CONNECTED STRUCTURE AND ELECTRONIC DEVICE
10/18/2006	CN2829318Y Radiation base module set
10/18/2006	CN2829314Y Assembling positioning mechanism of radiating module fin
10/18/2006	CN2829313Y Side-blowing cylindrical heat pipe heat sink
10/18/2006	CN2829103Y High-efficience LED
10/18/2006	CN2829095Y Diode for vehicle
10/18/2006	CN2829092Y Module circuit assembly
10/18/2006	CN2829091Y Flip-chip package structure
10/18/2006	CN2829090Y Slotted cylindrical heat pipe
10/18/2006	CN2829089Y Fixture for heat sink
10/18/2006	CN2829088Y Radiation module
10/18/2006	CN2829087Y Liquid-cooled heat-pipe radiator
10/18/2006	CN2829086Y Cylindrical heat pipe radiator
10/18/2006	CN2829085Y Integral heat pipe radiator
10/18/2006	CN2829084Y Fan fastener
10/18/2006	CN1849853A Substrate and method of manufacturing the same
10/18/2006	CN1849851A Double-sided, edge-mounted stripline signal processing modules and modular network
10/18/2006	CN1849706A Chip on flex tape with dimension retention pattern
10/18/2006	CN1849373A Nano-filled composite materials with exceptionally high glass transition temperature
10/18/2006	CN1849260A Metal nanoparticle and method for producing same, liquid dispersion of metal nanoparticle and method for producing same, metal thin line, metal film and method for producing same
10/18/2006	CN1849051A Heat sink apparatus for electronic device
10/18/2006	CN1849041A Heater that attaches electronic component to and detaches the same from substrate
10/18/2006	CN1848677A Elastic-surface-wave-device mount substrate, high-frequency module using the same, and communication apparatus
10/18/2006	CN1848549A IC package, IC socket, and IC socket assembly
10/18/2006	CN1848469A Compact light emitting device package with enhanced heat dissipation and method for making the package
10/18/2006	CN1848440A A memory device and method of manufacturing same
10/18/2006	CN1848435A Fuse trimming circuit with higher reliability
10/18/2006	CN1848428A Memory module
10/18/2006	CN1848427A Electronic apparatus and method for manufacturing the same
10/18/2006	CN1848425A Power semiconductor module with connecting tracks and with connecting elements which are arranged flush with the connecting tracks
10/18/2006	CN1848424A Non-cavity semiconductor packages
10/18/2006	CN1848423A Semiconductor apparatus and circuit apparatus
10/18/2006	CN1848422A Lead wire frame, semiconductor device and method of manufacture, and injection mold
10/18/2006	CN1848421A Lead frame and semiconductor device
10/18/2006	CN1848420A Lead frame for semiconductor package
10/18/2006	CN1848419A Structure for mounting semiconductor and method of manufacturing mounting substrate used therein
10/18/2006	CN1848418A Optical device cavity structure, optical device, and method for manufacturing an optical device cavity structure
10/18/2006	CN1848417A Top via pattern for bond pad structure and making method thereof
10/18/2006	CN1848416A Secondary curved thermal tube finned radiator
10/18/2006	CN1848415A Radiating module Mechanism
10/18/2006	CN1848414A Thermal interface material producing method
10/18/2006	CN1848413A Strain silicon wafer with a crystal orientation (100) in flip chip bga package
10/18/2006	CN1848412A Substrate structure for image sensing chip package and producing method thereof
10/18/2006	CN1848393A Method for producing integrated circuit board
10/18/2006	CN1848381A Method for forming low-stress multi-layer metallized structure and leadless solder end electrode
10/18/2006	CN1848378A Method for producing chip fuse and products thereof
10/18/2006	CN1848320A Oxygen doped firing of barium titanate on copper foil
10/18/2006	CN1848305A Electronic assembly wire and flat cable comprising same
10/18/2006	CN1848289A Memory circuit element application apparatus
10/18/2006	CN1848035A Locking module
10/18/2006	CN1847965A Electronic device with fan-out block possessing homogeneous impedance
10/18/2006	CN1847308A Flame retardant and an epoxy resin composition comprising the same for encapsulating semiconductor devices
10/18/2006	CN1846920A Production process and apparatus and application of low smelting point metal alloy material
10/18/2006	CN1846831A Adhesion apparatus
10/18/2006	CN1281107C Transfer carrier for flexible printed circuit board and electronic parts mounting method to flexible printed circuit board
10/18/2006	CN1280908C Programmable element for programming utilizing resistance value change by phase change
10/18/2006	CN1280905C Electrostatic discharge protecting component and method for manufacturing the same
10/18/2006	CN1280904C Semiconductor packaging device and mounting method of semiconductor packaging device
10/18/2006	CN1280903C Semiconductor device with fraud structure
10/18/2006	CN1280902C Cooling device, electronic device, display unit and manuafcture of cooling device
10/18/2006	CN1280901C Heat conducting tube for increaing heat conductivity using whirlwind
10/18/2006	CN1280900C Semiconductor device and producing method thereof
10/18/2006	CN1280899C Mask sheet for assembling semiconductor device and method for assembling semiconductor device
10/18/2006	CN1280898C Double-enclosure protective-ring structure for semiconductor chip
10/18/2006	CN1280890C Semiconductor device and its manufacturing method
10/18/2006	CN1280884C Semiconductor device and manufacture thereof, circuit board and electronic machine
10/18/2006	CN1280882C Method for multilevel copper interconnects for ultra large scale integration
10/18/2006	CN1280875C Low-K metal proelectrolyte semiconductor structure
10/18/2006	CN1280866C Semiconductor assembly
10/18/2006	CN1280844C Magnetic component
10/18/2006	CN1280666C Circuit substrate, its mfg. method, electrooptical device and electronic appliance
10/18/2006	CN1280337C Poly (phenylene ether)-polyvinyl thermosetting resin
10/18/2006	CN1280025C Ultra-frequency of increasing resolution ratio in microdeposition controlling system
10/17/2006	US7124389 Automated wiring pattern layout method
10/17/2006	US7124341 Integrated circuit having electrically isolatable test circuitry
10/17/2006	US7124050 Method in an integrated circuit (IC) manufacturing process for identifying and redirecting IC's mis-processed during their manufacture
10/17/2006	US7123484 Multi-layer and multi-direction fan device
10/17/2006	US7123483 Heat sink fan and method for manufacturing heat sink that is used for the heat sink fan
10/17/2006	US7123482 Levers for support of heatsink component
10/17/2006	US7123480 Package structure for a semiconductor device
10/17/2006	US7123479 Enhanced flow channel for component cooling in computer systems
10/17/2006	US7123466 Extended thin film capacitor (TFC)
10/17/2006	US7123088 Power amplifier module for wireless communication devices
10/17/2006	US7123084 Semiconductor integrated circuit and designing method for same
10/17/2006	US7123054 Semiconductor integrated circuit device having an ESD protection unit
10/17/2006	US7122912 Chip and multi-chip semiconductor device using thereof and method for manufacturing same
10/17/2006	US7122911 Heat spreader and semiconductor device package having the same
10/17/2006	US7122910 Packaged semiconductor device
10/17/2006	US7122909 Wiring board, stacked wiring board and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
10/17/2006	US7122908 Electronic device package
10/17/2006	US7122907 Interposer substrate and wafer scale interposer substrate member for use with flip-chip configured semiconductor dice
10/17/2006	US7122906 Die-wafer package and method of fabricating same
10/17/2006	US7122905 Microelectronic devices and methods for mounting microelectronic packages to circuit boards
10/17/2006	US7122904 Semiconductor packaging device and manufacture thereof
10/17/2006	US7122902 Semiconductor device
10/17/2006	US7122901 Semiconductor device
10/17/2006	US7122899 Semiconductor device and production process
10/17/2006	US7122898 Electrical programmable metal resistor
10/17/2006	US7122897 Semiconductor device and method of manufacturing the semiconductor device
10/17/2006	US7122896 Mounting structure of electronic component, electro-optic device, electronic equipment, and method for mounting electronic component

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