| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 10/19/2006 | US20060236270 Composable system-in-package integrated circuits and process of composing the same |
| 10/19/2006 | US20060234435 Semiconductor device having one-time programmable ROM and method of fabricating the same |
| 10/19/2006 | US20060234424 Technique for compensating for substrate shrinkage during manufacture of an electronic assembly |
| 10/19/2006 | US20060234423 System for providing a redistribution metal layer in an integrated circuit |
| 10/19/2006 | US20060234420 Electronic device |
| 10/19/2006 | US20060234080 Integrated electronic component |
| 10/19/2006 | US20060234023 Multilayer ceramic substrate and production method thereof |
| 10/19/2006 | US20060232942 Electric circuit module as well as power converter and vehicle-mounted electric system that include the module |
| 10/19/2006 | US20060232939 Coolant cooled type semiconductor device |
| 10/19/2006 | US20060232938 Fastening device for heat sink |
| 10/19/2006 | US20060232415 Inlet for an electronic tag |
| 10/19/2006 | US20060232349 Integrated circuit arrangement |
| 10/19/2006 | US20060231961 Semiconductor device and radiation detector employing it |
| 10/19/2006 | US20060231960 Non-cavity semiconductor packages |
| 10/19/2006 | US20060231959 Bonding pad for a packaged integrated circuit |
| 10/19/2006 | US20060231958 Fan out type wafer level package structure and method of the same |
| 10/19/2006 | US20060231957 Transistor, display device including the same, and manufacturing method thereof |
| 10/19/2006 | US20060231956 Semiconductor device and method of manufacturing the same |
| 10/19/2006 | US20060231955 Conductive line end extension |
| 10/19/2006 | US20060231953 Structure for mounting semiconductor part in which bump and land portion are hardly detached from each other and method of manufacturing mounting substrate used therein |
| 10/19/2006 | US20060231952 BGA semiconductor chip package and mounting structure thereof |
| 10/19/2006 | US20060231951 Electronic devices including offset conductive bumps |
| 10/19/2006 | US20060231950 Semiconductor package accomplishing fan-out structure through wire bonding |
| 10/19/2006 | US20060231949 Semiconductor module and method of forming a semiconductor module |
| 10/19/2006 | US20060231948 Integrated circuit system for bonding |
| 10/19/2006 | US20060231947 Systems and methods for reducing simultaneous switching noise in an integrated circuit |
| 10/19/2006 | US20060231946 Nanotube surface coatings for improved wettability |
| 10/19/2006 | US20060231945 Heat dissipation for heat generating element of semiconductor device and related method |
| 10/19/2006 | US20060231944 Thermally enhanced semiconductor package and fabrication method thereof |
| 10/19/2006 | US20060231943 Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging |
| 10/19/2006 | US20060231942 Semiconductor device |
| 10/19/2006 | US20060231941 Pillar grid array package |
| 10/19/2006 | US20060231940 High density direct connect LOC assembly |
| 10/19/2006 | US20060231939 Multilevel semiconductor module and method for fabricating the same |
| 10/19/2006 | US20060231938 Structure for stacking an integrated circuit on another integrated circuit |
| 10/19/2006 | US20060231937 Thin multiple semiconductor die package |
| 10/19/2006 | US20060231936 Semiconductor device having resin-sealed area on circuit board thereof |
| 10/19/2006 | US20060231935 BGA type semiconductor package featuring additional flat electrode teminals, and method for manufacturing the same |
| 10/19/2006 | US20060231934 Semiconductor device |
| 10/19/2006 | US20060231933 Robust leaded molded packages and methods for forming the same |
| 10/19/2006 | US20060231932 Electrical package structure including chip with polymer thereon |
| 10/19/2006 | US20060231931 Lead frame for semiconductor package |
| 10/19/2006 | US20060231930 Heat resistant photomask for high temperature fabrication processes |
| 10/19/2006 | US20060231928 Semiconductor device and chip-stack semiconductor device |
| 10/19/2006 | US20060231927 Semiconductor chip mounting body and manufacturing method thereof |
| 10/19/2006 | US20060231926 Semiconductor wafer, semiconductor chip and dicing method of a semiconductor wafer |
| 10/19/2006 | US20060231923 Inductor for semiconductor integrated circuit and method of fabricating the same |
| 10/19/2006 | US20060231922 Gate dielectric antifuse circuit to protect a high-voltage transistor |
| 10/19/2006 | US20060231921 Micro fuse |
| 10/19/2006 | US20060231920 MIM capacitor structure and method of fabrication |
| 10/19/2006 | US20060231915 Process for high voltage superjunction termination |
| 10/19/2006 | US20060231900 Semiconductor device having fine contacts and method of fabricating the same |
| 10/19/2006 | US20060231898 CMOS image sensor and method of manufacturing the same |
| 10/19/2006 | US20060231896 ESD protection device with thick poly film and method for forming the same |
| 10/19/2006 | US20060231895 Guardwall structures for ESD protection |
| 10/19/2006 | US20060231863 Manufacturing process of a chip package structure |
| 10/19/2006 | US20060231855 Semiconductor device |
| 10/19/2006 | US20060231835 Semiconductor device including ROM interface pad |
| 10/19/2006 | US20060231834 Bonding strength testing device |
| 10/19/2006 | US20060231833 High-Frequency, High-Signal-Density, Surface-Mount Technology Footprint Definitions |
| 10/19/2006 | US20060231795 Securing a document by applying a phosphor powder containing particles that are spherical and have an average particle size of 0.31 to not greater than 10 mu m.; up-converter particles; emits at least two different wavelengths |
| 10/19/2006 | US20060231755 Process for precise arrangement of micro-bodies |
| 10/19/2006 | US20060231528 Methods of forming semiconductor constructions |
| 10/19/2006 | US20060231290 Multilayer printed wiring board |
| 10/19/2006 | US20060231239 Battery cooler |
| 10/19/2006 | DE112004002018T5 Halbleiterbauelement-Baugruppe, die ein herausstehendes Zwischenverbindungsmaterial verwendet A semiconductor device module that uses an out-standing interconnection material |
| 10/19/2006 | DE112004001727T5 Verfahren zur Herstellung eines elektronischen Moduls A process for producing an electronic module |
| 10/19/2006 | DE112004000727T5 Bandverbindung Band connection |
| 10/19/2006 | DE10305455B4 Trägeranordnung für eine organische Leuchtdiode Carrier assembly for an organic light-emitting diode |
| 10/19/2006 | DE102006017042A1 Zuleitungsrahmen für ein Halbleiterbauteil A lead frame for a semiconductor device |
| 10/19/2006 | DE102006015750A1 Image sensor module and fabricating method thereof to minimize thickness of image sensor module |
| 10/19/2006 | DE102005016511A1 Verfahren zum Herstellen einer Leiterstruktur auf einem Substrat A method for producing a conductor pattern on a substrate |
| 10/19/2006 | DE102005016294A1 Chip cover for use in smart card, has activator material which is degraded partially after activation of chip surface, where material represents fluorine compound to release hydrogen fluoride from semiconductor chip |
| 10/19/2006 | DE102005016008A1 Component module, e.g. sensor component, for use on substrate of motor vehicle air conditioning system, has chip housing body with cavities, where sensor chip-arrangement and humidity measuring chip are fastened in cavities, respectively |
| 10/19/2006 | DE102005014674A1 Halbleitermodul mit Halbleiterchips in einem Kunststoffgehäuse in getrennten Bereichen und Verfahren zur Herstellung desselben The same semiconductor module with the semiconductor chip in a plastic housing in separate areas and methods for preparing |
| 10/19/2006 | DE102004058413B4 Verfahren zur Herstellung einer Chipgroßen Packungsstruktur A method for producing a chip-sized package structure |
| 10/19/2006 | DE102004029200B4 Verfahren zur Herstellung einer elektronischen Schaltung sowie ein Substrat für eine elektronische Schaltung A process for producing an electronic circuit and a substrate for an electronic circuit |
| 10/19/2006 | DE102004002659B4 Halbleitervorrichtung mit einem Kontaktmuster und Herstellungsverfahren dafür A semiconductor device with a contact pattern and manufacturing method thereof |
| 10/19/2006 | DE10109172B4 Strombegrenzungseinrichtung Current-limiting device |
| 10/19/2006 | DE10084994B4 Verfahren zur Bildung einer leitenden Silicidschicht auf einem Silicium enthaltenden Substrat und Verfahren zur Bildung eines leitenden Silicidkontaktes A method of forming a conductive silicide layer on a silicon containing substrate and method for forming a conductive Silicidkontaktes |
| 10/19/2006 | DE10052419B4 Verfahren zur Herstellung mikromechanischer Bauelemente A process for preparing micromechanical components |
| 10/18/2006 | EP1713314A1 Multilayer printed wiring board |
| 10/18/2006 | EP1713313A1 Multilayer printed wiring board |
| 10/18/2006 | EP1713125A1 On chip inductive structure |
| 10/18/2006 | EP1713124A2 Power semiconductor module with connecting tracks and with connecting elements which are arranged flush with the connecting tracks. |
| 10/18/2006 | EP1713122A2 Semiconductor device and method for producing the same |
| 10/18/2006 | EP1713120A2 Method and apparatus for fabricating high fin-density heatsinks |
| 10/18/2006 | EP1713091A2 Method of manufacture of semiconductor device and conductive compositions used therein |
| 10/18/2006 | EP1713020A1 Method of for manufacturing electronic device |
| 10/18/2006 | EP1712980A2 Apparatus for cooling computer parts and method of manufacturing the same |
| 10/18/2006 | EP1712113A2 Method for disposing a conductor structure on a substrate, and substrate comprising said conductor structure |
| 10/18/2006 | EP1711963A2 Integrating passive components on spacer in stacked dies |
| 10/18/2006 | EP1711958A1 Method for producing a semiconductor product |
| 10/18/2006 | EP1711278A2 Polyhedral oligomeric silsesquioxanes and metallized polyhedral oligomeric silsesquioxanes as coatings, composites and additives |
| 10/18/2006 | EP1547128A4 Method and apparatus for shielding an integrated circuit from radiation |
| 10/18/2006 | EP1493314B1 Board-level emi shield with enhanced thermal dissipation |
| 10/18/2006 | EP1421630B1 Method of depositing an oxide layer on a substrate and a photovoltaic cell using said substrate |
| 10/18/2006 | EP1419528B1 Interconnect module with reduced power distribution impedance |
| 10/18/2006 | EP1270694B1 Porous adhesive sheet, semiconductor wafer with porous adhesive sheet, and method of manufacture thereof |
| 10/18/2006 | EP1155452B1 Semiconductor device comprising a security coating and smartcard provided with such a device |