H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2006
10/25/2006	CN1282285C Back cooling type high power semiconductor laser micro-channel heat sink structure and preparing method thereof
10/25/2006	CN1282252C 电子电路 Electronic circuit
10/25/2006	CN1282248C Improved memory unit contact part
10/25/2006	CN1282246C High-power RF integrated circuit capable of blocking parasitic loss current and its mfg. method
10/25/2006	CN1282244C Electronic module having 3-D array of carrier-mounted IC packages
10/25/2006	CN1282243C Semiconductor device with copper wirings
10/25/2006	CN1282242C Chip ratio package and manufacturing method thereof
10/25/2006	CN1282241C 半导体装置 Semiconductor device
10/25/2006	CN1282240C 半导体装置 Semiconductor device
10/25/2006	CN1282207C Composite electronic components
10/25/2006	CN1282026C Display device
10/25/2006	CN1281965C Socket and contact of semiconductor package
10/24/2006	US7127365 Method for identifying a defective die site
10/24/2006	US7126871 Circuits and methods to protect a gate dielectric antifuse
10/24/2006	US7126829 Adapter board for stacking Ball-Grid-Array (BGA) chips
10/24/2006	US7126824 Heat dissipation device assembly incorporating retention member
10/24/2006	US7126823 Locking device for heat dissipating device
10/24/2006	US7126822 Electronic packages, assemblies, and systems with fluid cooling
10/24/2006	US7126819 Chassis air guide thermal cooling solution
10/24/2006	US7126798 On die voltage regulator
10/24/2006	US7126637 Solid-state image pickup apparatus having a hermetic seal portion and fabricating method thereof
10/24/2006	US7126441 Electronic component having a connection member connecting a resonator terminal and a mounting substrate electrode
10/24/2006	US7126365 System and method for measuring negative bias thermal instability with a ring oscillator
10/24/2006	US7126359 Device monitor for RF and DC measurement
10/24/2006	US7126346 Method, apparatus, and article of manufacture for manufacturing high frequency balanced circuits
10/24/2006	US7126232 Defect repair apparatus for an electronic device
10/24/2006	US7126231 Mask-making member and its production method, mask and its making method, exposure process, and fabrication method of semiconductor device
10/24/2006	US7126230 Semiconductor electronic device and method of manufacturing thereof
10/24/2006	US7126229 Wire-bonding method and semiconductor package using the same
10/24/2006	US7126228 Apparatus for processing semiconductor devices in a singulated form
10/24/2006	US7126227 Wiring substrate, semiconductor device, semiconductor module, electronic equipment, method for designing wiring substrate, method for manufacturing semiconductor device, and method for manufacturing semiconductor module
10/24/2006	US7126226 Semiconductor device and semiconductor chip for use therein
10/24/2006	US7126225 Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling
10/24/2006	US7126224 Semiconductor substrate-based interconnection assembly for semiconductor device bearing external connection elements
10/24/2006	US7126223 Semiconductor device formed with an air gap using etch back of inter layer dielectric (ILD)
10/24/2006	US7126222 Semiconductor device
10/24/2006	US7126221 Semiconductor package
10/24/2006	US7126220 Miniaturized contact spring
10/24/2006	US7126219 Small memory card
10/24/2006	US7126218 Embedded heat spreader ball grid array
10/24/2006	US7126217 Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support
10/24/2006	US7126216 Two part mold for wafer scale caps
10/24/2006	US7126215 Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist
10/24/2006	US7126214 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
10/24/2006	US7126213 Rectification chip terminal structure
10/24/2006	US7126211 Circuit carrier
10/24/2006	US7126210 System and method for venting pressure from an integrated circuit package sealed with a lid
10/24/2006	US7126209 Lead frame, resin-encapsulated semiconductor device, and method of producing the same
10/24/2006	US7126208 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
10/24/2006	US7126204 Integrated semiconductor circuit with an electrically programmable switching element
10/24/2006	US7126200 Integrated circuits with contemporaneously formed array electrodes and logic interconnects
10/24/2006	US7126198 Protruding spacers for self-aligned contacts
10/24/2006	US7126194 Method for removing impurities of a semiconductor wafer, semiconductor wafer assembly, and semiconductor device
10/24/2006	US7126178 Semiconductor device and its manufacturing method
10/24/2006	US7126173 Method for enhancing the electric connection between a power electronic device and its package
10/24/2006	US7126165 Light emitting device assembly
10/24/2006	US7126164 Wafer-level moat structures
10/24/2006	US7126155 S-parameter power plane probe coupon
10/24/2006	US7126154 Test structure for a single-sided buried strap DRAM memory cell array
10/24/2006	US7126151 Interconnected high speed electron tunneling devices
10/24/2006	US7126083 Chip scale marker and method of calibrating marking position
10/24/2006	US7126063 Encapsulated electronic sensor package
10/24/2006	US7126057 Integrated electronic component
10/24/2006	US7125810 Semiconductor device and method of manufacturing semiconductor device
10/24/2006	US7125798 Circuit device and manufacturing method of circuit device
10/24/2006	US7125797 Contact structure of semiconductor device and method of forming the same
10/24/2006	US7125793 Method for forming an opening for an interconnect structure in a dielectric layer having a photosensitive material
10/24/2006	US7125789 Composite metal column for mounting semiconductor device
10/24/2006	US7125788 Circuit device and method of manufacturing the circuit device
10/24/2006	US7125760 Method for implementing electro-static discharge protection in silicon-on-insulator devices
10/24/2006	US7125755 Method and structure for electrostatic discharge protection of photomasks
10/24/2006	US7125754 Semiconductor device and its manufacturing method
10/24/2006	US7125751 Semiconductor device and method for the fabrication thereof grinding frame portion such that plural electrode constituent portions
10/24/2006	US7125749 Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages
10/24/2006	US7125748 Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask
10/24/2006	US7125747 Process for manufacturing leadless semiconductor packages including an electrical test in a matrix of a leadless leadframe
10/24/2006	US7125745 Multi-chip package substrate for flip-chip and wire bonding
10/24/2006	US7125744 High-frequency module and method for manufacturing the same
10/24/2006	US7125743 Method for reduction of electromagnetic interference in integrated circuit packages
10/24/2006	US7125739 Method for producing and testing a corrosion-resistant channel in a silicon device
10/24/2006	US7125521 Method to solve alignment mark blinded issues and technology for application of semiconductor etching at a tiny area
10/24/2006	US7125429 Protecting resin-encapsulated components
10/24/2006	US7124810 Heat pipe having wick structure
10/24/2006	US7124809 Brazed wick for a heat transfer device
10/24/2006	US7124807 Heat dissipation device having thermally conductive cover board
10/19/2006	WO2006110903A1 Microfluidic cooling of integrated circuits
10/19/2006	WO2006110750A2 Multilayer, multicomponent high-k films and methods for depositing the same
10/19/2006	WO2006110394A1 Thermal interface material having spheroidal particulate filler
10/19/2006	WO2006110217A2 Rapid thermal processing using energy transfer layers
10/19/2006	WO2006109997A1 Window manufacture method of semiconductor package type printed circuit board
10/19/2006	WO2006109857A1 Semiconductor device
10/19/2006	WO2006109768A1 Light-transmitting resin composition
10/19/2006	WO2006109660A1 Heat sink device
10/19/2006	WO2006109566A1 Semiconductor device
10/19/2006	WO2006109480A1 Phthalocyanine black pigment and use thereof
10/19/2006	WO2006109120A1 Ball grid array package
10/19/2006	WO2006108816A1 Conductive line end extension
10/19/2006	WO2006108444A1 Protection of an integrated circuit and method therefor
10/19/2006	WO2006078070A3 Semiconductor module and semiconductor device
10/19/2006	WO2006068082A9 Semiconductor device

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