H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2006
10/26/2006	US20060237794 Method for providing a programmable electrostatic discharge (ESD) protection device
10/26/2006	US20060237793 IGBT with injection regions between MOSFET cells
10/26/2006	US20060237763 Electronic systems
10/26/2006	US20060237759 Semiconductor device manufacturing method and semiconductor device
10/26/2006	US20060237755 Method for automated testing of the modulation transfer function in image sensors
10/26/2006	US20060237730 Peltier cooler with integrated electronic device(s)
10/26/2006	US20060237722 Solid state imaging device
10/26/2006	US20060237231 Substrate for mounting electronic part and electronic part
10/26/2006	US20060237225 Multilayer printed wiring board
10/26/2006	US20060237177 Counter-stream-mode oscillating-flow heat transport apparatus
10/26/2006	US20060237172 Water-cooling heat exchanger and heat-dissipating device for the same
10/26/2006	US20060237087 Method of forming leads of a packaged semiconductor device
10/26/2006	US20060236711 MEMS heat pumps for integrated circuit heat dissipation
10/26/2006	US20060236710 MEMS heat pumps for integrated circuit heat dissipation
10/26/2006	US20060236533 Bonding arrangement and method for LTCC circuitry
10/26/2006	DE19609929B4 Leistungshalbleitermodul The power semiconductor module
10/26/2006	DE102006013413A1 Halbleitervorrichtung und Verfahren zur Temperaturerfassung unter Verwendung derselben A semiconductor device and method of temperature detection using the same
10/26/2006	DE102005019157A1 Metal oxide semiconductor field effect transistor arrangement for use in integrated circuit, has source and gate connections of transistors that are connected with each other and that contact connections of chip, respectively
10/26/2006	DE102005017849A1 Electronic component, has spring unit establishing electrical connection between board and support unit, mechanically and electrically connected with board or support unit and lying against support unit or board in prestressed manner
10/26/2006	DE102005017538A1 Anordnung und Verfahren zur Temperaturkompensation eines Widerstands Apparatus and method for temperature compensation for a resistance
10/26/2006	DE102005013533A1 P-channel metal oxide field effect transistor for half bridge circuit arrangement, has rear side contact used as source connection, where source potential of transistor is at constant value for connecting source connection with heat sink
10/26/2006	DE10153666B4 Kontaktanordnung mit hoher Dichte und Verfahren zum Anordnen von Kontakten Contact arrangement having a high density and methods for arranging contacts
10/25/2006	EP1715520A1 Device for protecting an electronic circuit
10/25/2006	EP1715519A2 Jet generating device and electronic apparatus
10/25/2006	EP1715518A1 Device for protecting an electronic circuit
10/25/2006	EP1715512A2 Semiconductor device and method of forming the same
10/25/2006	EP1715445A1 Electronic device
10/25/2006	EP1714991A1 Photosensitive epoxy resin adhesive composition and use thereof
10/25/2006	EP1714536A1 Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules
10/25/2006	EP1714531A2 Preferential asymmetrical ground and differential signal via layout and preferential via exit structures for printed circuit boards
10/25/2006	EP1714530A1 Method for increasing a routing density for a circuit board and such a circuit board
10/25/2006	EP1714320A2 Conductive material compositions, apparatus, systems, and methods
10/25/2006	EP1714319A2 Semiconductor chip package
10/25/2006	EP1714318A2 Insert molding electronic devices
10/25/2006	EP1714316A1 Semiconductor package with contact support layer and method to produce the package
10/25/2006	EP1415335B1 Use of diverse materials in air-cavity packaging of electronic devices
10/25/2006	EP1414050B1 Method for producing nanocomposite magnet using atomizing method
10/25/2006	EP1038317A4 Integrated circuit header assembly and method for making same
10/25/2006	EP0860024A4 Circuit structure having a flip-mounted matrix of devices
10/25/2006	CN2831720Y Retainer assembly having earthing function
10/25/2006	CN2831718Y Radiation boards
10/25/2006	CN2831716Y Radiator for electronic element
10/25/2006	CN2831714Y Modular mains assembly
10/25/2006	CN2831713Y Modular mains assembly
10/25/2006	CN2831712Y Radiator
10/25/2006	CN2831702Y Fixed structure of radiator
10/25/2006	CN2831442Y 光源装置 The light source device
10/25/2006	CN2831441Y Surfaced plastic encapsulated high voltage diode
10/25/2006	CN2831438Y Electrostatic discharger able to control holding current
10/25/2006	CN2831437Y Electrostatic discharger able to avoid dead locking
10/25/2006	CN2831436Y Complex cave-type wire rack encapsulating structure
10/25/2006	CN2831435Y Chip connecting pads arrangement
10/25/2006	CN2831434Y Non-convex-block chip encapsulator
10/25/2006	CN2831433Y Plane surrounded salient point encapsulation structure of integrated circuit or discrete component
10/25/2006	CN2831432Y Plane lined salient point encapsulation structure of integrated circuit or discrete component
10/25/2006	CN2831431Y Plane array salient point encapsulation structure of integrated circuit or discrete component
10/25/2006	CN2831430Y Plane salient point combined encapsulation structure of integrated circuit or discrete component
10/25/2006	CN2831429Y Public electrode of crimped modular
10/25/2006	CN2831428Y Wire-bonding lead frame package
10/25/2006	CN2831427Y Faucet replacable water cooling radiator
10/25/2006	CN2831426Y Large power semiconductor water cooling radiator
10/25/2006	CN2831425Y Semiconductor encapsulation structure
10/25/2006	CN2831424Y Buckle set type radiating fins structure
10/25/2006	CN2831423Y Active radiator of large-scale integrated chip
10/25/2006	CN2831422Y Radiator structure of notobook computer
10/25/2006	CN2831421Y Radiation paste protector of radiator
10/25/2006	CN2831420Y Radiator
10/25/2006	CN2831418Y Wafer encapsulator
10/25/2006	CN1853451A Method for manufacturing an electronic module
10/25/2006	CN1853321A Semiconductor laser device and method of producing the same
10/25/2006	CN1853273A 半导体装置 Semiconductor device
10/25/2006	CN1853272A Electronic package having a folded flexible substrate and method of manufacturing the same
10/25/2006	CN1853271A Method and apparatus for a dual substrate package
10/25/2006	CN1853270A Amorphous carbon layer to improve photoresist adhesion
10/25/2006	CN1853269A 冷却装置和电子装置 Cooling equipment and electronic devices
10/25/2006	CN1853268A Thermal interface material with aligned carbon nanotubes
10/25/2006	CN1853263A Designs and methods for conductive bumps
10/25/2006	CN1853262A Process and integration scheme for fabricating conductive components through-vias and semiconductor components including conductive through-wafer vias
10/25/2006	CN1853261A Fabrication of single or multiple gate field plates
10/25/2006	CN1852651A Radiating system for communication apparatus
10/25/2006	CN1852646A Evapouration cooling-radiating structure of power device
10/25/2006	CN1852645A Boiling-chamber type radiating apparatus
10/25/2006	CN1852644A Radiator
10/25/2006	CN1851949A Light-emitting assembly capable of increasing brightness
10/25/2006	CN1851945A Packing substrate structure of optical diode and preparing method
10/25/2006	CN1851925A Active light-emitting apparatus and mfg. method
10/25/2006	CN1851923A SOI LIGBT device unit of integrated ESD diode
10/25/2006	CN1851917A Semiconductor device and method for producing the same
10/25/2006	CN1851916A Flat-face saliant-point type packing base-board for electronic device and making method thereof
10/25/2006	CN1851915A Flat-face saliant-point type packing base-board for integrated circuit or discrete device
10/25/2006	CN1851914A Lead-frame and semi-conductor device with same
10/25/2006	CN1851913A Lead carriage and packing structure using same
10/25/2006	CN1851912A Chip packing-body
10/25/2006	CN1851911A Microchannel-group integrated heat-pipe radiator
10/25/2006	CN1851910A Heat-pipe radiating apparatus
10/25/2006	CN1851909A Aluminium-alloy high-power semi-conductor radiator and preparing method
10/25/2006	CN1851908A Power semi-conductor device evaporation cooling apparatus
10/25/2006	CN1851907A Semiconductor packing structure comprising passive element
10/25/2006	CN1851865A Bare crystal and its manufacturing method
10/25/2006	CN1282403C Multilayer wiring board

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