H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2006
10/31/2006	US7129175 Method of manufacturing semiconductor device
10/31/2006	US7129165 Method and structure to improve reliability of copper interconnects
10/31/2006	US7129163 Device package and method for the fabrication and testing thereof
10/31/2006	US7129161 Depositing a tantalum film
10/31/2006	US7129158 Printed wiring board and production method for printed wiring board
10/31/2006	US7129156 Method for fabricating a silicon carbide interconnect for semiconductor components using heating
10/31/2006	US7129146 Flip chip package and process of forming the same
10/31/2006	US7129145 Method of manufacturing an IC coil mounted in an information carrier
10/31/2006	US7129132 Semiconductor device and method of manufacturing the same
10/31/2006	US7129119 Method for fabricating semiconductor packages
10/31/2006	US7129117 Method of embedding semiconductor chip in support plate and embedded structure thereof
10/31/2006	US7129116 Partially patterned lead frames and methods of making and using the same in semiconductor packaging
10/31/2006	US7129115 Packaging of a microchip device
10/31/2006	US7129112 Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus
10/31/2006	US7129111 Method for forming bump protective collars on a bumped wafer
10/31/2006	US7129110 Semiconductor device and method for manufacturing the same
10/31/2006	US7129101 Failure analysis vehicle for yield enhancement with self test at speed burnin capability for reliability testing
10/31/2006	US7128979 Circuit board, method of producing same, and power module
10/31/2006	US7128852 Producing large quantities of a high quality, dense aerosol for spray pyrolysis operations; multi-phase particles for use in manufacturing electrically-conductive metallic films for electronic products
10/31/2006	US7128844 Metal/ceramic circuit board and method for producing same
10/31/2006	US7128271 Semiconductor integrated circuit and methods for protecting the circuit from reverse engineering
10/31/2006	US7128140 Heat sinks
10/31/2006	US7128134 Heat dissipation module
10/31/2006	US7128131 Heat sink for electronic devices and heat dissipating method
10/31/2006	US7127811 Methods of fabricating and using shaped springs
10/31/2006	US7127809 Method of forming one or more base structures on an LTCC cofired module
10/31/2006	US7127807 Process of manufacturing multilayer modules
10/31/2006	US7127794 Auto-boating process
10/26/2006	WO2006113171A1 Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
10/26/2006	WO2006112949A2 Structure for stacking an integrated circuit on another integrated circuit
10/26/2006	WO2006112417A1 Glass-sealed light-emitting device, circuit board with glass-sealed light-emitting device, and methods for manufacturing those
10/26/2006	WO2006112396A1 Curing accelerating compound-silica composite material, method for producing curing accelerating compound-silica composite material, curing accelerator, curable resin composition, and electronic component
10/26/2006	WO2006112384A1 Protruding electrode for connecting electronic component, electronic component mounted body using such electrode and methods for manufacturing such electrode and electronic component mounted body
10/26/2006	WO2006112337A1 Semiconductor device and semiconductor device manufacturing method
10/26/2006	WO2006112332A1 Semiconductor device and lead frame
10/26/2006	WO2006112211A1 Heat transfer sheet, radiation structure and method for using heat transfer sheet
10/26/2006	WO2006112129A1 Conductor powder and process for producing the same, and electrically conductive resin composition
10/26/2006	WO2006112105A1 Hermetic seal cover and method for manufacture thereof
10/26/2006	WO2006112048A1 Semiconductor integrated circuit
10/26/2006	WO2006112027A1 Heat sink, circuit board and electronic device
10/26/2006	WO2006064921A3 Semiconductor chip with identification codes, manufacturing method of the chip and semiconductor chip management system
10/26/2006	WO2006012113A3 Dielectric film with low coefficient of thermal expansion (cte) using liquid crystalline resin
10/26/2006	WO2006010639A3 Method of manufacturing an electronic circuit device through a direct write technique
10/26/2006	WO2005125298A3 Method for manufacturing an electronics module comprising a component electrically connected to a conductor- pattern layer
10/26/2006	WO2004112095A3 Thermoplastic fluxing underfill composition and method
10/26/2006	US20060242477 Folded interposer
10/26/2006	US20060240685 Pressure contact spring for contact arrangement in a power semiconductor module
10/26/2006	US20060240652 Very low dielectric constant plasma-enhanced cvd films
10/26/2006	US20060240600 Semiconductor device and method of manufacturing the same
10/26/2006	US20060240596 Semiconductor device with terminals, and method of manufacturing the same
10/26/2006	US20060240595 Method and apparatus for flip-chip packaging providing testing capability
10/26/2006	US20060240594 Method of making stacked chip electronic package having laminate carrier
10/26/2006	US20060240592 Integrated circuit package and method for producing it
10/26/2006	US20060240582 Methods relating to the reconstruction of semiconductor wafers for wafer-level processing
10/26/2006	US20060240363 Semiconductor device with robust polysilicon fuse
10/26/2006	US20060239102 Semiconductor integrated circuit device and its power supply wiring method
10/26/2006	US20060238985 Heat dissipating assembly using liquid as a heat dissipating medium
10/26/2006	US20060238983 Power semiconductor module
10/26/2006	US20060238690 Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
10/26/2006	US20060238187 Packaging of electronic chips with air-bridge structures
10/26/2006	US20060238116 Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
10/26/2006	US20060237856 Microelectronic Contact Structure And Method Of Making Same
10/26/2006	US20060237855 Substrate for producing a soldering connection to a second substrate
10/26/2006	US20060237854 Carrying structure of electronic components
10/26/2006	US20060237853 Cobalt tungsten phosphate used to fill voids arising in a copper metallization process
10/26/2006	US20060237852 Semiconductor device in which LSI chip is arranged on package substrate in flipped condition and substrate wiring designing method
10/26/2006	US20060237851 Semiconductor device and related method of manufacture
10/26/2006	US20060237850 Semiconductor die edge reconditioning
10/26/2006	US20060237849 Electronic device, method of manufacture of the same, and sputtering target
10/26/2006	US20060237848 Semiconductor device having a leading wiring layer
10/26/2006	US20060237847 Integrated circuit interconnect
10/26/2006	US20060237846 Doped nitride film, doped oxide film and other doped films and deposition rate improvement for rtcvd processes
10/26/2006	US20060237845 Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
10/26/2006	US20060237844 Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
10/26/2006	US20060237843 BGA-type multilayer circuit wiring board
10/26/2006	US20060237842 Semiconductor device including an under electrode and a bump electrode
10/26/2006	US20060237841 Semiconductor device and method for producing the same
10/26/2006	US20060237840 Semiconductor package
10/26/2006	US20060237839 Apparatus for conducting heat in a flip-chip assembly
10/26/2006	US20060237838 Thermal interconnect systems methods of production and uses thereof
10/26/2006	US20060237837 Field effect transistor and method of manufacturing the same
10/26/2006	US20060237836 Microelectronic assemblies having compliant layers
10/26/2006	US20060237835 Electronic circuit device
10/26/2006	US20060237834 Method For Forming An Electric Device Comprising Power Switches Around A Logic Circuit And Related Apparatus
10/26/2006	US20060237833 System having semiconductor component with multiple stacked dice
10/26/2006	US20060237832 Standoffs for centralizing internals in packaging process
10/26/2006	US20060237831 Semiconductor device and electronic device
10/26/2006	US20060237830 Semiconductor device and electronic device
10/26/2006	US20060237829 Method and system for a semiconductor package with an air vent
10/26/2006	US20060237828 System and method for enhancing wafer chip scale packages
10/26/2006	US20060237827 Thermal enhanced low profile package structure and method for fabricating the same
10/26/2006	US20060237826 Leadframe designs for plastic overmold packages
10/26/2006	US20060237825 Device packages having a III-nitride based power semiconductor device
10/26/2006	US20060237824 Lead frame for semiconductor package and method of manufacturing the same
10/26/2006	US20060237823 Shielding arrangement to protect a circuit from stray magnetic fields
10/26/2006	US20060237822 Semiconductor substrate
10/26/2006	US20060237821 Interconnects including members integral with bit lines, as well as metal nitride and metal silicide, and methods for fabricating interconnects and semiconductor device structures including the interconnects
10/26/2006	US20060237814 Semiconductor device having surface mountable external contact areas and method for producing the same
10/26/2006	US20060237798 Semiconductor chip with fuse unit
10/26/2006	US20060237795 Semiconductor device and a method of manufacturing the same

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