Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2006
11/01/2006CN1855483A Integrated passive devices
11/01/2006CN1855478A Modular card stacking structure and its production
11/01/2006CN1855477A 电路装置 Circuit device
11/01/2006CN1855476A 半导体装置 Semiconductor device
11/01/2006CN1855475A Systems and methods for reducing simultaneous switching noise in an integrated circuit
11/01/2006CN1855474A Method and structure for implementing secure multichip modules for encryption applications
11/01/2006CN1855473A Multiple etch-stop layer deposition scheme and materials
11/01/2006CN1855472A Semiconductor device and method for forming SRAM unit
11/01/2006CN1855471A Lead frame for semiconductor package and method of manufacturing the same
11/01/2006CN1855470A Soft soldering method for semiconductor components and semiconductor device
11/01/2006CN1855469A Semiconductor device and method of manufacturing same
11/01/2006CN1855468A Bond pad structures and semiconductor devices using the same
11/01/2006CN1855467A Semiconductor device and method of manufacturing same
11/01/2006CN1855466A Semiconductor device
11/01/2006CN1855465A Semiconductor component and display
11/01/2006CN1855464A Processing device on which processing elements having same function are embedded in one chip
11/01/2006CN1855463A Manufacturing method of semiconductor device and semiconductor device
11/01/2006CN1855462A Substrate for mounting electronic part and electronic part
11/01/2006CN1855461A Duplexing wiring layer and its circuit structure
11/01/2006CN1855460A Semiconductor packing process
11/01/2006CN1855459A Planar pad design and production
11/01/2006CN1855458A Jet generating device and electronic apparatus
11/01/2006CN1855457A Jet generating device and electronic apparatus
11/01/2006CN1855456A Heat pipe radiator
11/01/2006CN1855455A Dissipating apparatus for integrated circuit chip and display module including the same
11/01/2006CN1855454A Method and system for a semiconductor package with an air vent
11/01/2006CN1855453A Radiating fin and its packing structure
11/01/2006CN1855452A Radiating moudle of electronic device
11/01/2006CN1855451A Semiconductor apparatus and manufacturing method thereof
11/01/2006CN1855450A High-heat loss rate semiconductor sealer and its production
11/01/2006CN1855449A Base of imaging sensor module and formation of the module
11/01/2006CN1855426A Fuse disconnection method fit for semiconductor device
11/01/2006CN1855412A Method and apparatus for semiconductor testing utilizing dies with integrated circuit
11/01/2006CN1855409A Method of manufacturing a semiconductor device
11/01/2006CN1855408A Method for MCP packaging for balanced performance
11/01/2006CN1855406A Method for manufacturing protection assembly for preventing electronic component from static discharge and electronic component of corresponding conformation
11/01/2006CN1855402A Transistor modular assembling method and its equipment
11/01/2006CN1855401A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
11/01/2006CN1855400A Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment
11/01/2006CN1855366A Improvement for ESD transistor source leaked capacitance
11/01/2006CN1855133A 存储卡 Memory Card
11/01/2006CN1855132A 存储卡 Memory Card
11/01/2006CN1854981A Airflow generating device and electronic apparatus
11/01/2006CN1854980A Vibrating device for jet flow generating including a voice coil motor
11/01/2006CN1854186A Semiconductor encapsulating epoxy resin composition and semiconductor device
11/01/2006CN1854185A Semiconductor encapsulating epoxy resin composition and semiconductor device
11/01/2006CN1854067A Magnesium hydrate particles and its manufacturing method and resin composite including same
11/01/2006CN1283134C Power miniature assembly and its mfg. method
11/01/2006CN1283044C Compound semiconductor switched circuit device
11/01/2006CN1283004C Semiconductor device and its manufacturing method, circuit base plate and electronic machine
11/01/2006CN1283003C 静电放电保护电路 Electrostatic discharge protection circuit
11/01/2006CN1283002C Connection terminal and producing method thereof, semiconductor device and producing method thereof
11/01/2006CN1282994C Forming method for forming film with copper diffusion preventing by alumium
11/01/2006CN1282914C Highly effective liquid cooling heat sink for computer
10/2006
10/31/2006US7131094 Method and system for automatically extracting data from a textual bump map
10/31/2006US7131074 Nested voltage island architecture
10/31/2006US7130944 Chip-to-chip communication system using an ac-coupled bus and devices employed in same
10/31/2006US7130195 Electronic apparatus
10/31/2006US7130192 Heat dissipating device
10/31/2006US7130191 Function module with built-in heat dissipation device
10/31/2006US7130189 Method and apparatus for cooling a portable computer
10/31/2006US7130175 Monolithic integratable circuit arrangement for protection against a transient voltage
10/31/2006US7130174 Integral-type ceramic circuit board and method of producing same
10/31/2006US7130063 Micropattern shape measuring system and method
10/31/2006US7129779 Semiconductor device with floating block
10/31/2006US7129718 Method and structure for measuring a bonding resistance
10/31/2006US7129640 Integrated circuit device for driving a laser diode with reduced heat transfer and method for fabricating the device
10/31/2006US7129591 Semiconductor device having align key and method of fabricating the same
10/31/2006US7129589 Use of an internal on-chip inductor for electrostatic discharge protection of circuits which use bond wire inductance as their load
10/31/2006US7129588 Portable telephone
10/31/2006US7129587 Semiconductor device, semiconductor package for use therein, and manufacturing method thereof
10/31/2006US7129586 Flip chip packaging structure and related packaging method
10/31/2006US7129585 Semiconductor device and method of packaging the same
10/31/2006US7129584 Elimination of RDL using tape base flip chip on flex for die stacking
10/31/2006US7129583 Multi-chip package structure
10/31/2006US7129582 Reducing the migration of grain boundaries
10/31/2006US7129581 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
10/31/2006US7129580 Methods and procedures for engineering of composite conductive films by atomic layer deposition
10/31/2006US7129579 Semiconductor apparatus and method for fabricating the same
10/31/2006US7129578 Substrate for semiconductor device, manufacturing method thereof, semiconductor device, and frame main body
10/31/2006US7129577 Power supply packaging system
10/31/2006US7129576 Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps
10/31/2006US7129575 Semiconductor chip assembly with bumped metal pillar
10/31/2006US7129574 Multi-power ring chip scale package for system level integration
10/31/2006US7129573 System having semiconductor component with encapsulated, bonded, interconnect contacts
10/31/2006US7129572 Submember mounted on a chip of electrical device for electrical connection
10/31/2006US7129571 Semiconductor chip package having decoupling capacitor and manufacturing method thereof
10/31/2006US7129570 Electronic component having at least one semiconductor chip on a circuit carrier and method for producing the same
10/31/2006US7129569 Large die package structures and fabrication method therefor
10/31/2006US7129568 Chip package and electrical connection structure between chip and substrate
10/31/2006US7129566 Scribe street structure for backend interconnect semiconductor wafer integration
10/31/2006US7129565 Semiconductor device, method of manufacturing the same, and phase shift mask
10/31/2006US7129561 Tri-metal and dual-metal stacked inductors
10/31/2006US7129558 Chip-scale schottky device
10/31/2006US7129554 Nanosensors
10/31/2006US7129546 Electrostatic discharge protection device
10/31/2006US7129520 Liquid crystal display device with a test pad for testing plural shorting bars
10/31/2006US7129519 Monitoring system comprising infrared thermopile detector
10/31/2006US7129507 Chip mis-position detection method
10/31/2006US7129420 Semiconductor device and method for manufacture thereof, circuit board, and electronic instrument