H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2006
11/02/2006	US20060244118 High power radiation emitter device and heat dissipating package for electronic components
11/02/2006	US20060244117 Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides
11/02/2006	US20060244116 Semiconductor device
11/02/2006	US20060244115 Chip package structure and method for manufacturing the same
11/02/2006	US20060244114 Systems, methods, and apparatus for connecting a set of contacts on an integrated circuit to a flex circuit via a contact beam
11/02/2006	US20060244113 Leadless leadframe electronic package and sensor module incorporating same
11/02/2006	US20060244112 Packaging of electronic chips with air-bridge structures
11/02/2006	US20060244111 Electrical connecting member capable of achieving stable connection with a simple structure and connector using the same
11/02/2006	US20060244110 Electronic device
11/02/2006	US20060244109 Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions
11/02/2006	US20060244108 Capacitive techniques to reduce noise in high speed interconnections
11/02/2006	US20060244107 Semiconductor device, manufacturing method, and electronic device
11/02/2006	US20060244099 Split-channel antifuse array architecture
11/02/2006	US20060244072 Device for Electrostatic Discharge Protection and Method of Manufacturing the Same
11/02/2006	US20060244071 Semiconductor device including metal-oxide-silicon field-effect transistor as a trigger circuit
11/02/2006	US20060244070 Semiconductor storage device and portable electronic equipment
11/02/2006	US20060244018 Semiconductor device and method of manufacture thereof
11/02/2006	US20060243947 Curing composition and method for preparing same, light-shielding paste, light-shielding resin and method for producing same, package for light-emitting diode, and semiconductor device
11/02/2006	US20060243812 Module for contactless chip cards or identification systems
11/02/2006	US20060243504 Electrical apparatus, cooling system therefor, and electric vehicle
11/02/2006	US20060243483 Semiconductor device assemblies with compliant spring contact structures
11/02/2006	US20060243480 Methods and apparatus for interconnecting a ball grid array to a printed circuit board
11/02/2006	US20060243478 Multilayer printed wiring board
11/02/2006	US20060243425 Integrated circuit heat pipe heat spreader with through mounting holes
11/02/2006	US20060243392 Forming folded-stack packaged device using progressive folding tool
11/02/2006	US20060243376 Forming folded-stack packaged device using progressive folding tool
11/02/2006	US20060243375 Forming folded-stack packaged device using progressive folding tool
11/02/2006	US20060243374 Forming folded-stack packaged device using progressive folding tool
11/02/2006	US20060242828 Fabrication of compliant spring contact structures and use thereof
11/02/2006	US20060242826 Method of manufacturing a metal-ceramic circuit board
11/02/2006	US20060242825 Method of making a circuitized substrate
11/02/2006	EP1717871A2 Optoelectronic surface-mountable component
11/02/2006	EP1717863A2 Semiconductor power device with passivation layers
11/02/2006	EP1717858A1 Thick film conductor paste compositions for LTCC tape in microwave applications
11/02/2006	EP1717857A2 Semiconductor apparatus and manufacturing method thereof
11/02/2006	EP1717856A2 Processing device on which processing elements having same function are embedded in one chip
11/02/2006	EP1717855A1 Thick film conductor compositions and the use thereof in LTCC circuits and devices
11/02/2006	EP1717854A2 Semiconductor device with a plurality of solding layers and process therefor
11/02/2006	EP1717851A1 Circuit-connecting material and circuit terminal connected structure and connecting method
11/02/2006	EP1717195A1 Trilayered beam MEMS device and related methods
11/02/2006	EP1717194A1 Trilayered Beam MEMS device and related methods
11/02/2006	EP1717193A1 Trilayered beam MEMS device and related methods
11/02/2006	EP1716732A2 Tin-based coating of electronic component
11/02/2006	EP1716591A2 Buried guard ring and radiation hardened isolation structures and fabrication methods
11/02/2006	EP1716590A1 Assembly of a semiconductor die attached to substrate with oxazoline derivative bearing an electron donor or acceptor functionality
11/02/2006	EP1716389A2 Continuously varying offset mark and methods of determining overlay
11/02/2006	EP1194022B1 Multilayer printed wiring board and method of manufacturing multilayer printed wiring board
11/02/2006	EP1097467B1 Ic stack utilizing secondary leadframes
11/02/2006	EP0890187B1 A method for producing a semiconductor device by the use of an implanting step
11/02/2006	EP0774162B1 Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities
11/02/2006	DE60028282T2 Leistungshalbleitermodul The power semiconductor module
11/02/2006	DE202006013062U1 Adapter for positioning and connecting e.g. chip, has pressing unit arranged in receiving area for pressing electronic component and including inner side that is pushed at upper surface of component if unit is blocked with hub body
11/02/2006	DE19655310B4 Adhesively bonding lead frame of semiconductor component to heat sink - using cured epoxy resin layer and thermoplastic material or partly cured epoxy! resin
11/02/2006	DE112004002304T5 Entkoppelschaltung für mitmontierte Halbleitervorrichtungen Decoupling circuit for co-packaged semiconductor devices
11/02/2006	DE112004002266T5 Dielektrischer Film mit sehr geringer Dielektrizitätskonstante für Kupferverbindungen Dielectric film with a very low dielectric constant for copper compounds
11/02/2006	DE102006012394A1 Semiconductor apparatus for automobile, has sensor internal circuit, noise filter circuit, power supply pad, grounding pad and signal pad, formed in single semiconductor chip, where signal pad is provided for inputting signals
11/02/2006	DE102006011232A1 Substrat zum Montieren eines elektronischen Teils sowie elektronisches Teil Substrate for mounting an electronic part and an electronic part
11/02/2006	DE102005028396A1 Transponder device for vehicular tire pressure monitoring system, has metal oxide semiconductor transistor structures spaced apart from each other by preset distance, so that parasitic transistor has negligible current gain
11/02/2006	DE102005018941A1 Power semiconductor device, e.g. power transistor or power integrated circuit (IC), has standard housing provided with external connectors which are arranged and electrically connected to flat leads outside of or within standard housing
11/02/2006	DE102005018116A1 Electronic module e.g. power semiconductor module, has carrier with electrical connection unit arranged in housing with opening, and sleeve inserted into opening, where unit and sleeve are fixedly connected with carrier by solder
11/02/2006	DE102005016650A1 Leistungshalbleitermodul mit stoffbündig angeordneten Anschlusselementen Power semiconductor module with material arranged flush connection elements
11/02/2006	DE102005014665A1 Substrat zur Herstellung einer Lötverbindung mit einem zweiten Substrat The substrate for forming a solder connection with a second substrate
11/02/2006	DE102005007280A1 Critical dimension determination for laterally structured layer on substrate of microelectronic or micromechanical semiconductor chip, involves using formed test mark to determine critical dimension of laterally structured layer
11/02/2006	DE102004001578B4 Integrierte Schaltung und Verfahren zum Erzeugen eines Bereitschaftssignals Integrated circuit and method for generating a ready signal
11/01/2006	CN2834122Y Remote wind-cooled micro-grooves phase change heat radiation system
11/01/2006	CN2834121Y Remote forced liquid-cooled micro-grooves phase change heat radiation system
11/01/2006	CN2834120Y Natural air-cooled passive circulating micro-grooves phase change heat radiation system
11/01/2006	CN2834118Y Combined structure of radiator module
11/01/2006	CN2833894Y LED heat radiation structure with high heat radiation efficiency
11/01/2006	CN2833893Y Ceramic sealed diode
11/01/2006	CN2833892Y Heat radiator
11/01/2006	CN2833891Y Heat radiation module structure for heating component
11/01/2006	CN2833890Y Heat radiator
11/01/2006	CN2833889Y CPU radiator with high performance
11/01/2006	CN2833888Y Improved structure of heat pipe radiator
11/01/2006	CN2833887Y Fin structure improvement of radiator
11/01/2006	CN2833886Y Heat radiation structure
11/01/2006	CN2833885Y Folded pressurized heat radiation fins
11/01/2006	CN2833884Y Radiator structure improvement
11/01/2006	CN2833700Y Cascaded radiator fan fixing structure
11/01/2006	CN2833697Y Radiation sheet structure of assembled radiator
11/01/2006	CN1857043A Ceramic circuit board, method for making the same, and power module
11/01/2006	CN1856878A Method of forming a semiconductor package and structure thereof
11/01/2006	CN1856877A Conductor track connection structure and associated production method
11/01/2006	CN1856876A Method for producing a multifunctional dielectric layer on a substrate
11/01/2006	CN1856872A Adjustable self-aligned air gap dielectric for low capacitance wiring
11/01/2006	CN1856871A System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler
11/01/2006	CN1856241A Active radiating method for electronic device and radiator manufactured by said method
11/01/2006	CN1856240A Radiator for flat display device
11/01/2006	CN1856237A Radiator
11/01/2006	CN1856218A Printed circuit board having embedded capacitors using hybrid material and method of manufacturing the same
11/01/2006	CN1855563A Lead frame for surface-mounting LED and manufacturing method thereof
11/01/2006	CN1855532A Lateral bipolar transistor with additional ESD implant
11/01/2006	CN1855526A Organic light emitting display device and method of fabricating the same
11/01/2006	CN1855522A Solid state imaging device
11/01/2006	CN1855514A Non-volatile memory device capable of preventing damage by plasma charge
11/01/2006	CN1855491A Semiconductor device and method for manufacturing same
11/01/2006	CN1855488A Methods and apparatus for programmably powering down structured application-specific integrated circuits
11/01/2006	CN1855487A Mask-programmable logic device with programmable input/output ports
11/01/2006	CN1855486A 半导体器件 Semiconductor devices

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