H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2006
11/07/2006	US7132314 System and method for forming one or more integrated circuit packages using a flexible leadframe structure
11/07/2006	US7132313 Diamond heat spreading and cooling technique for integrated circuits
11/07/2006	US7132312 Method for fabricating semiconductor package having conductive bumps on chip
11/07/2006	US7132311 Encapsulation of a stack of semiconductor dice
11/07/2006	US7132309 Semiconductor-on-diamond devices and methods of forming
11/07/2006	US7132303 Stacked semiconductor device assembly and method for forming
11/07/2006	US7132171 Irradiating an organosilicon compound
11/07/2006	US7132161 Fiber adhesive material
11/07/2006	US7132020 Solder for use on surfaces coated with nickel by electroless plating
11/07/2006	US7131851 Anisotropic conductivity connector, conductive paste composition, probe member, and wafer inspection device, and wafer inspecting method
11/07/2006	US7131848 Helical microelectronic contact and method for fabricating same
11/07/2006	US7131594 IC card
11/07/2006	US7131487 Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers
11/07/2006	US7131486 Electroosmotic microchannel cooling system
11/07/2006	US7131483 Apparatus, mold, and method for manufacturing metal-ceramic composite member
11/07/2006	US7131286 Cooling of electronics by electrically conducting fluids
11/07/2006	US7131199 Mechanical highly compliant thermal interface pad
11/07/2006	US7131189 Continuous processing of thin-film batteries and like devices
11/07/2006	CA2463832C Full wave dc/dc converter
11/02/2006	WO2006116283A2 System and method for enhancing wafer chip scale packages
11/02/2006	WO2006116280A2 Chip-scale package
11/02/2006	WO2006116250A1 Semiconductor device packages with substrates for redistributing semiconductor device electrodes
11/02/2006	WO2006116249A2 Device packages having a iii-nitride based power semiconductor device
11/02/2006	WO2006116225A2 The use of solder paste for heat dissipation
11/02/2006	WO2006116162A2 Semiconductor package
11/02/2006	WO2006116161A1 Igbt with injection regions between mosfet cells
11/02/2006	WO2006115637A1 Zoned thermal monitoring
11/02/2006	WO2006115576A2 Semiconductor die edge reconditioning
11/02/2006	WO2006115267A1 Circuit member, circuit member manufacturing method, semiconductor device and multilayer structure on circuit member surface
11/02/2006	WO2006115124A1 Resin composition and semiconductor device using the same
11/02/2006	WO2006115073A1 Liquid-cooled jacket
11/02/2006	WO2006114986A1 Electronic component mounting board and electronic device using same
11/02/2006	WO2006114971A2 Electronic component module
11/02/2006	WO2006114957A1 Electronic component module
11/02/2006	WO2006114934A1 Vibrating device, jet flow generating device, electronic device, and method of manufacturing vibrating device
11/02/2006	WO2006114825A1 Semiconductor device manufacturing method
11/02/2006	WO2006114772A1 Integrated circuit assembly with passive integration substrate for power and ground line routing on top of an integrated circuit chip
11/02/2006	WO2006114406A1 A package for beamlead semiconductor devices
11/02/2006	WO2006114267A2 Electronic component and electronic configuration
11/02/2006	WO2006072032A3 Flip chip contact(pcc) power package
11/02/2006	WO2005125297A3 Cooling electronic devices in computer systems
11/02/2006	WO2005022599A3 Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure
11/02/2006	WO2004023528A3 A thinned semiconductor wafer and die and corresponding method
11/02/2006	US20060247393 semiconductor encapsulating resin; polyepoxide of biphenyl-4,4'-diglycidyl ether and 3,3',5,5'-tetramethylbiphenyl-4,4'-diglycidyl ether, phenolic resin, low amount of filler, curing accelerator; inherently fire resistant without added flame retardant; forms foamed layer at ignition for fire retardancy
11/02/2006	US20060247391 Epoxy resin composition and semiconductor apparatus
11/02/2006	US20060247122 Methods for the deposition of electrocatalyst particles
11/02/2006	US20060246726 Making contact with the emitter contact of a semiconductor
11/02/2006	US20060246714 Method of forming a conductive contact
11/02/2006	US20060246702 Non-solder mask defined (nsmd) type wiring substrate for ball grid array (bga) package and method for manufacturing such a wiring substrate
11/02/2006	US20060246674 Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof
11/02/2006	US20060246635 Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
11/02/2006	US20060246630 Electronic parts packaging structure and method of manufacturing the same
11/02/2006	US20060246628 Chipcard with contact areas and method for producing contact areas
11/02/2006	US20060246625 Method for fabricating a semiconductor device having a heat radiation layer
11/02/2006	US20060246624 Semiconductor device with semiconductor chip and rewiring layer and method for producing the same
11/02/2006	US20060246623 Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same
11/02/2006	US20060246621 Microelectronic die including thermally conductive structure in a substrate thereof and method of forming same
11/02/2006	US20060246314 Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions
11/02/2006	US20060246276 Conformable interface materials for improving thermal contacts
11/02/2006	US20060244547 Methods for providing bias to a monolithic microwave integrated circuit
11/02/2006	US20060244475 Compliant contact pin test assembly and methods thereof
11/02/2006	US20060244157 Stacked integrated circuit package system
11/02/2006	US20060244156 Bond pad structures and semiconductor devices using the same
11/02/2006	US20060244155 Conductive ball mounting apparatus
11/02/2006	US20060244154 Wire bonded semiconductor device having low inductance and noise
11/02/2006	US20060244153 Wiring substrate and radiation detector using the same
11/02/2006	US20060244152 Barrier film integrity on porous low k dielectrics by application of a hydrocarbon plasma treatment
11/02/2006	US20060244151 Oblique recess for interconnecting conductors in a semiconductor device
11/02/2006	US20060244150 Memory Packages Having Stair Step Interconnection Layers
11/02/2006	US20060244149 Semiconductor device production method and semiconductor device
11/02/2006	US20060244148 Solder deposition on wafer backside for thin-die thermal interface material
11/02/2006	US20060244147 Dielectric structures having high dielectric constants, methods of forming the dielectric structures, non-volatile semiconductor memory devices having the dielectric structures and methods of manufacturing the non-volatile semiconductor memory devices
11/02/2006	US20060244146 Method for improved process latitude by elongated via integration
11/02/2006	US20060244145 Semiconductor device
11/02/2006	US20060244144 Semiconductor device including multi-layered interconnection and method of manufacturing the device
11/02/2006	US20060244143 Coating process to enable electrophoretic deposition
11/02/2006	US20060244142 Electronic component and electronic configuration
11/02/2006	US20060244141 Bow control in an electronic package
11/02/2006	US20060244140 Conductive bump structure of circuit board and method for forming the same
11/02/2006	US20060244139 Solder bumps in flip-chip technologies
11/02/2006	US20060244138 Techniques for improving bond pad performance
11/02/2006	US20060244137 Semiconductor package board using a metal base
11/02/2006	US20060244136 Semiconductor device
11/02/2006	US20060244135 Microelectronic component and assembly having leads with offset portions
11/02/2006	US20060244134 Multilayer printed wiring board
11/02/2006	US20060244133 Design structure for coupling noise prevention
11/02/2006	US20060244132 Dicing die adhesive film for semiconductor
11/02/2006	US20060244131 Semiconductor apparatus and manufacturing method thereof
11/02/2006	US20060244130 Multi-chip semiconductor package
11/02/2006	US20060244129 Electronic device with heat dissipation module
11/02/2006	US20060244128 Semiconductor device and method of manufacturing the same
11/02/2006	US20060244127 Integrated stacked microchannel heat exchanger and heat spreader
11/02/2006	US20060244126 Memory module
11/02/2006	US20060244125 Heat sink member and method of manufacturing the same
11/02/2006	US20060244124 Reduced cost printed circuit board
11/02/2006	US20060244123 Composite electronic component
11/02/2006	US20060244122 Electronic circuit device
11/02/2006	US20060244121 Semiconductor device, manufacturing method thereof, and connection method of circuit board
11/02/2006	US20060244120 Semiconductor device with a rewiring level and method for producing the same
11/02/2006	US20060244119 Circuit board with built-in electronic component and method for manufacturing the same

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