H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2006
11/08/2006	EP1719175A2 Electronic circuit package with cavity resonance cut off member
11/08/2006	EP1719174A2 Protective diode for protecting semiconductor switching circuits from electrostatic discharges
11/08/2006	EP1719173A1 Microelectronic interconnect device comprising localised conductive pins
11/08/2006	EP1719172A1 System comprising an electrical component and an electrical connecting lead for said component, and method for the production of said system
11/08/2006	EP1719171A1 Semiconductor structure
11/08/2006	EP1719169A1 Manufacturing method of semiconductor device, and ic card, ic tag, rfid, transponder, bill, securities, passport, electronic apparatus, bag, and garment
11/08/2006	EP1719168A1 Methods of fabricating interconnects for semiconductor components
11/08/2006	EP1410403B1 Low temperature method and compositions for producing electrical conductors
11/08/2006	EP1186039B1 Security method and device for a chip stack with a multidimensional structure
11/08/2006	CN2836422Y Thermoelectric conversion type heat radiation assembly
11/08/2006	CN2836410Y Improved cabinet for monitoring system
11/08/2006	CN2836240Y Laminar texture directly welded to silicon baseplate of semiconductor discrete device
11/08/2006	CN2836239Y Planar salient point type packaging structure for integrated circuit or discrete components
11/08/2006	CN2836238Y Transistor heat radiation structure
11/08/2006	CN2835786Y Heat radiation type LED light source module and lamp thereof
11/08/2006	CN1860831A Material board for producing hybrid circuit board with metallic terminal plate and method for producing hybrid circuit board
11/08/2006	CN1860607A Power-electronic-cooling device
11/08/2006	CN1860606A Electromagnetic noise shielding in semiconductor packages using caged interconnect structures
11/08/2006	CN1860601A Technique for evaluating a fabrication of a semiconductor component and wafer
11/08/2006	CN1860599A Fabrication of semiconductor drives
11/08/2006	CN1858908A 封装元件 Packaging components
11/08/2006	CN1858907A Semiconductor device and fabrication method thereof
11/08/2006	CN1858906A Super long alignment infrared focus plane detector
11/08/2006	CN1858905A Fuse system and reprogrammable method of electrical fuse
11/08/2006	CN1858904A Oblique recess for interconnecting conductors in a semiconductor device
11/08/2006	CN1858903A Memory array and method for manufacture thereof
11/08/2006	CN1858902A Water cooling combined heat radiator for semiconductor device
11/08/2006	CN1858143A Electronic packaging material
11/08/2006	CN1858112A Uvioresistant epoxy composition and its preparing method and use
11/08/2006	CN1858109A Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device
11/08/2006	CN1284434C Cooling element for electronic device
11/08/2006	CN1284431C Method for manufacturing multilayer wiring substrate
11/08/2006	CN1284428C Self-aligned coaxial via capacitors
11/08/2006	CN1284426C Via-in-pad with off-center geometry and method of manufacture
11/08/2006	CN1284239C 半导体器件 Semiconductor devices
11/08/2006	CN1284238C Arrangement and method for impedance matching
11/08/2006	CN1284237C Input protection circuit
11/08/2006	CN1284236C Interposer device
11/08/2006	CN1284235C Semiconductor device
11/08/2006	CN1284234C Ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture
11/08/2006	CN1284233C Power semiconductor device
11/08/2006	CN1284232C Vibration and shock resistant heat sink assembly
11/08/2006	CN1284231C Light sensitive semiconductor package, and manufacturing method and conductor frame thereof
11/08/2006	CN1284230C 高频模块 High-frequency module
11/08/2006	CN1284223C Electrostatic discharge protection structure and process thereof
11/08/2006	CN1284208C Semiconductor device and producing method thereof
11/08/2006	CN1284207C A method for preparing welder ball for semiconductor package
11/08/2006	CN1284110C Power wiring method for semiconductor integrated circuit and semiconductor integrated circuit
11/08/2006	CN1284000C Integrated testing circuit in integrated circuit
11/08/2006	CN1283550C Method and apparatus for preparing aluminum nitride
11/07/2006	US7134111 Layout method and apparatus for arrangement of a via offset from a center axis of a conductor and semiconductor device thereof
11/07/2006	US7133294 Integrated circuit packages with sandwiched capacitors
11/07/2006	US7133288 Processor heat sink retention module and assembly
11/07/2006	US7133287 ATCA integrated heatsink and core power distribution mechanism
11/07/2006	US7133286 Method and apparatus for sealing a liquid cooled electronic device
11/07/2006	US7133117 Dual sided lithographic substrate imaging
11/07/2006	US7132922 Direct application voltage variable material, components thereof and devices employing same
11/07/2006	US7132888 Large gain range, high linearity, low noise MOS VGA
11/07/2006	US7132756 Semiconductor device and method for manufacturing the same
11/07/2006	US7132755 Embedding a conductor in a film with a thermosetting adhesive layer and a heat resistance backing; mounting a semiconductor chip on the conductor; connecting the chip to the conductor; encapsulating the chip with a resin; and removing the adhesive
11/07/2006	US7132754 Flip chip stack
11/07/2006	US7132753 Stacked die assembly having semiconductor die overhanging support
11/07/2006	US7132752 Semiconductor chip and semiconductor device including lamination of semiconductor chips
11/07/2006	US7132751 Memory cell using silicon carbide
11/07/2006	US7132750 Semiconductor component having conductors with wire bondable metalization layers
11/07/2006	US7132749 Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
11/07/2006	US7132748 Semiconductor apparatus
11/07/2006	US7132747 Multilayer integrated circuit for RF communication and method for assembly thereof
11/07/2006	US7132746 Electronic assembly with solder-bonded heat sink
11/07/2006	US7132745 Method for attaching shields on substrates
11/07/2006	US7132744 Enhanced die-up ball grid array packages and method for making the same
11/07/2006	US7132743 Integrated circuit package substrate having a thin film capacitor structure
11/07/2006	US7132742 Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument
11/07/2006	US7132741 Semiconductor chip assembly with carved bumped terminal
11/07/2006	US7132740 Semiconductor package with conductor impedance selected during assembly
11/07/2006	US7132739 Encapsulated stack of dice and support therefor
11/07/2006	US7132738 Semiconductor device having multiple semiconductor chips stacked in layers and method for manufacturing the same, circuit substrate and electronic apparatus
11/07/2006	US7132737 Package for electronic component and method of manufacturing piezoelectric device
11/07/2006	US7132736 Devices having compliant wafer-level packages with pillars and methods of fabrication
11/07/2006	US7132735 Integrated circuit package with lead fingers extending into a slot of a die paddle
11/07/2006	US7132734 Microelectronic component assemblies and microelectronic component lead frame structures
11/07/2006	US7132733 Semiconductor device
11/07/2006	US7132732 Semiconductor device having two distinct sioch layers
11/07/2006	US7132731 Semiconductor component and assembly having female conductive members
11/07/2006	US7132728 Non-volatile memory devices including fuse covered field regions
11/07/2006	US7132726 Integrated semiconductor circuit having a logic and power metallization without intermetal dielectric
11/07/2006	US7132720 Semiconductor device having guard ring and manufacturing method thereof
11/07/2006	US7132707 Magnetic random access memory array with proximate read and write lines cladded with magnetic material
11/07/2006	US7132698 Compression assembled electronic package having a plastic molded insulation ring
11/07/2006	US7132696 Intermeshed guard bands for multiple voltage supply structures on an integrated circuit, and methods of making same
11/07/2006	US7132684 Test structure for detecting defect size in a semiconductor device and test method using same
11/07/2006	US7132683 Dual purpose test structure for gate-body current measurement in PD/SOI and for direct extraction of physical gate length in scaled CMOS technologies
11/07/2006	US7132473 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
11/07/2006	US7132358 Method of forming solder bump with reduced surface defects
11/07/2006	US7132356 Interconnection method
11/07/2006	US7132348 Low k interconnect dielectric using surface transformation
11/07/2006	US7132325 Test structure and methodology for semiconductor stress-induced defects and antifuse based on same test structure
11/07/2006	US7132320 Method for manufacturing semiconductor device
11/07/2006	US7132317 Method of manufacturing a semiconductor device that includes changing the internal stress of a conductive film
11/07/2006	US7132315 Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same

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