H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2006
11/09/2006	WO2006118031A1 Insulating circuit board and power module substrate
11/09/2006	WO2006118003A1 Silicon nitride substrate, process for producing the same, and silicon nitride wiring board and semiconductor module using the same
11/09/2006	WO2006117962A1 Cooler, heat sink and electronic apparatus
11/09/2006	WO2006117961A1 Semiconductor package and method for manufacturing same
11/09/2006	WO2006117954A1 Al-Ni-B ALLOY WIRING MATERIAL AND ELEMENT STRUCTURE USING THE SAME
11/09/2006	WO2006117447A1 Method of producing a wall, particularly a wall of a micro heat exchanger, and micro heat exchanger comprising, in particular, nanotubes
11/09/2006	WO2006116969A1 Flat conductor structure for a semiconductor component and method for the production thereof
11/09/2006	WO2006099571A9 Micro solder pot
11/09/2006	WO2006074312A3 Dual flat non-leaded semiconductor package
11/09/2006	WO2006056643A3 Method for manufacturing an electronics module
11/09/2006	WO2006009783A3 Low dielectric constant zinc oxide
11/09/2006	WO2005104213B1 COSMETIC FORMULATIONS COMPRISING ZnO NANOPARTICLES
11/09/2006	WO2005048302A3 Method for integrating pre-fabricated chip structures into functional electronic systems
11/09/2006	US20060253826 Method for manufacturing a power bus on a chip
11/09/2006	US20060252911 adamantyl diglycidyl ether or 1-adamantanol epichlorohydrin adduct curable to polyepoxides; encapsulant for light-emitting diode; superior optical properties, heat resistance, photostability, and shrinkage inhibition
11/09/2006	US20060252264 Semiconductor device and manufacturing method thereof
11/09/2006	US20060252253 Internal connection system for power semiconductors comprising large-area terminals
11/09/2006	US20060252246 Image sensor module and method thereof
11/09/2006	US20060252240 Process for forming a dielectric on a copper-containing metallization and capacitor arrangement
11/09/2006	US20060252232 Circuit device and method of manufacturing thereof
11/09/2006	US20060252186 Method of manufacturing semiconductor device having conductive thin films
11/09/2006	US20060252183 Semiconductor device and method for the fabrication thereof
11/09/2006	US20060252162 Method and apparatus for electronically aligning capacitively coupled mini-bars
11/09/2006	US20060251907 Surface protection film and method for producing the same
11/09/2006	US20060251871 laminating a porous film made of polytetrafluoroethylene with elasticity suitable for elastic recovery and used as a base film, adhering conductive metal by electroless plating at plural positions of the base film; use in the burn-in test of semiconductor devices
11/09/2006	US20060251856 For dissipation of heat generated in electronic devices
11/09/2006	US20060251825 Low dielectric constant insulating film and method of forming the same
11/09/2006	US20060251355 Photoelectric chip array package structure
11/09/2006	US20060250749 Layer capacitor element and production process as well as electronic device
11/09/2006	US20060250298 Vehicle-mounted millimeter wave radar device, millimeter wave radar module, and manufacturing method thereof
11/09/2006	US20060250155 Signal isolators using micro-transformers
11/09/2006	US20060250139 Bond pad structure comprising multiple bond pads with metal overlap
11/09/2006	US20060249873 Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings
11/09/2006	US20060249859 Metrology system and method for stacked wafer alignment
11/09/2006	US20060249858 Stencil and method for depositing material onto a substrate
11/09/2006	US20060249857 Microelectronic packages and methods therefor
11/09/2006	US20060249856 Bumpless semiconductor device
11/09/2006	US20060249855 Method and apparatus for soldering modules to substrates
11/09/2006	US20060249854 Device with area array pads for test probing
11/09/2006	US20060249853 Semiconductor device and method of manufacturing the same
11/09/2006	US20060249852 Flip-chip semiconductor device
11/09/2006	US20060249851 Multiple Chip Package Module Including Die Stacked Over Encapsulated Package
11/09/2006	US20060249850 Ground shield and related method
11/09/2006	US20060249849 Methods and structures for interconnect passivation
11/09/2006	US20060249846 Electrical programmable metal resistor
11/09/2006	US20060249845 Semiconductor device and manufacturing method of the same
11/09/2006	US20060249844 Contact structure on chip and package thereof
11/09/2006	US20060249843 Semiconductor device, circuit board, and electronic instrument
11/09/2006	US20060249842 Semiconductor device
11/09/2006	US20060249841 Small scale wires with microelectromechanical devices
11/09/2006	US20060249840 Integrated circuit with low dielectric loss packaging material
11/09/2006	US20060249839 Semiconductor device and fabrication method thereof
11/09/2006	US20060249838 Miniaturized multi-chip module and method for manufacturing the same
11/09/2006	US20060249837 Integrated circuit cooling and insulating device and method
11/09/2006	US20060249836 Chip-scale package
11/09/2006	US20060249835 Package for receiving electronic parts, and electronic device and mounting structure thereof
11/09/2006	US20060249834 Structure of polymer-matrix conductive film and method for fabricating the same
11/09/2006	US20060249833 Wiring board, multilayer wiring board, and method for manufacturing the same
11/09/2006	US20060249832 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
11/09/2006	US20060249831 Wirebonded device packages for semiconductor devices having elongated electrodes
11/09/2006	US20060249830 Large die package and method for the fabrication thereof
11/09/2006	US20060249829 Stacked type semiconductor device
11/09/2006	US20060249828 Stacked Package Semiconductor Module having Packages Stacked in a Cavity in the Module Substrate
11/09/2006	US20060249827 Method and apparatus for forming stacked die and substrate structures for increased packing density
11/09/2006	US20060249825 Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device
11/09/2006	US20060249824 Stack type surface acoustic wave package, and method for manufacturing the same
11/09/2006	US20060249823 Semiconductor package having ultra-thin thickness and method of manufacturing the same
11/09/2006	US20060249822 Bondwire utilized for coulomb counting and safety circuits
11/09/2006	US20060249821 Novel metallization scheme and method of manufacture therefor
11/09/2006	US20060249820 Molded lead frame connector with one or more passive components
11/09/2006	US20060249819 Lead frame having contacting pins of different thickness
11/09/2006	US20060249800 Semiconductor device and method of manufacturing the same
11/09/2006	US20060249793 Nonlinear via arrays for resistors to reduce systematic circuit offsets
11/09/2006	US20060249792 Electrostatic discharge protection circuit and integrated circuit having the same
11/09/2006	US20060249791 One time programmable memory cell
11/09/2006	US20060249768 Semiconductor device and method of manufacturing the same
11/09/2006	US20060249759 Buried guard ring and radiation hardened isolation structures and fabrication methods
11/09/2006	US20060249729 Methods of and apparatuses for measuring electrical parameters of a plasma process
11/09/2006	US20060249301 Anisotropic conductive coatings and electronic devices
11/09/2006	US20060249279 Method and apparatus for electronics cooling
11/09/2006	US20060248716 Self-supporting contacting structures that are directly produced on components without housings
11/09/2006	DE202006011215U1 Wärmeabführmodul Wärmeabführmodul
11/09/2006	DE112004002607T5 Verfahren und Vorrichtung für Zweiphasen-Einschaltbetrieb Method and apparatus for two-phase turn-on
11/09/2006	DE102005050637A1 Surface mountable semiconductor module has plastic housing having area in which ball sections of solder balls protrude out of socket contact surface
11/09/2006	DE102005034012A1 Power semiconductor component for use as e.g. low-side switch, has diode with anode and cathode terminals, which are connected with source, drain and gate terminals of field effect transistor by diffusion solder connection
11/09/2006	DE102005020453A1 Flachleiterstruktur für ein Halbleiterbauteil und Verfahren zur Herstellung derselben Flat conductor structure for a semiconductor device and method of manufacturing the same
11/09/2006	DE102005020091A1 Integrated semiconductor component e.g. thyristor, arrangement, has passivation layer area turned away from surface area of material area and formed with covering layer that is chemically inert and corrode-resistant against oxygen radicals
11/09/2006	DE102005020087A1 Even surface area producing method for e.g. semiconductor chip, involves evenly pressing surface by action of die or roller on surface of carrier for semiconductor device, and using steel plate as base for carrier
11/09/2006	DE102005019574A1 Contact arrangement for semiconductor component e.g. integrated circuit (IC) has reinforcement layer formed on contact surface and protrudes above insulating layer
11/09/2006	DE102005019305A1 ESD-Schutzstruktur mit Diodenreihenschaltung ESD protection structure with diode series circuit
11/09/2006	DE102004041910B4 Kühlmodul mit Geräuschdämpfung und Luftführung Cooling module with noise reduction and air duct
11/09/2006	DE10148042B4 Elektronisches Bauteil mit einem Kunststoffgehäuse und Komponenten eines höhenstrukturierten metallischen Systemträgers und Verfahren zu deren Herstellung An electronic part having a plastic housing and components of a height-structured metallic leadframe and method for their preparation
11/09/2006	DE10129289B4 Halbleitervorrichtung mit einer Diode für eine Eingangsschutzschaltung einer MOS-Vorrichtung und Verfahren zu deren Herstellung A semiconductor device comprising a diode for input protection circuit of a MOS device and process for their preparation
11/08/2006	EP1720385A2 Conductive connecting pin and package substrate
11/08/2006	EP1720203A2 Multilayer ceramic substrate and production method thereof
11/08/2006	EP1719744A1 Non oxide ceramic having oxide layer on the surface thereof, method for production thereof and use thereof
11/08/2006	EP1719397A1 Housing arrangement
11/08/2006	EP1719189A2 Light-emitting diode arrangement for a high-power light-emitting diode, and method for producing a light-emitting diode arrangement
11/08/2006	EP1719183A2 Ldmos transistor and method of making the same
11/08/2006	EP1719176A2 Semiconductor package with crossing conductor assembly and method of manufacture

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