H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2006
11/15/2006	CN1862803A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
11/15/2006	CN1862802A Electrical programmable metal resistor
11/15/2006	CN1862801A IC element with pin position correcting function
11/15/2006	CN1862800A Electronic component plane button ultra-thin packed substrate and making method thereof
11/15/2006	CN1862799A Semiconductor component plane button type ultra-thin packed substrate and making method thereof
11/15/2006	CN1862798A Semiconductor device with sealed semiconductor chip
11/15/2006	CN1862797A Lead frame and resin-encapsulated semiconductor device
11/15/2006	CN1862796A Semiconductor device chip and semiconductor device chip package
11/15/2006	CN1862795A Wiring board and method of manufacturing the same
11/15/2006	CN1862794A Radiator with low-melting point metal alloy covered layer and mfg. method thereof
11/15/2006	CN1862793A Spring fixing device for heat radiation module
11/15/2006	CN1862792A Semiconductor device and manufacturing method thereof
11/15/2006	CN1862783A Method for preparing transistor and combined improved structure obtained thereby
11/15/2006	CN1862782A Wire loop, semiconductor device containing same and wire connecting method
11/15/2006	CN1862771A Technique and structure for making convex
11/15/2006	CN1862765A Chip stage silicon perforating radiating method and structure thereof
11/15/2006	CN1862448A Parallel heat pipe radiator
11/15/2006	CN1285242C Distribution base plate, electronic device, electrooptics device and electronic instrument
11/15/2006	CN1285125C Three-D integrated memory
11/15/2006	CN1285122C Glass and glass tube for encapsulating semiconductors
11/15/2006	CN1285111C Integrated circuit chip and wafer and its producing and detecting method
11/15/2006	CN1285102C Metallic silicifying double-layer structure and method for forming same
11/14/2006	US7136543 Mount assembly, optical transmission line and photoelectric circuit board
11/14/2006	US7136520 Method of checking alignment accuracy of patterns on stacked semiconductor layers
11/14/2006	US7136295 Semiconductor arrangement
11/14/2006	US7136287 Clip for mounting heat sink to circuit board
11/14/2006	US7136268 Tunable ESD trigger and power clamp circuit
11/14/2006	US7136116 Liquid crystal display with control electrodes for preventing lateral leak of electric field
11/14/2006	US7135955 Electrical component with a negative temperature coefficient
11/14/2006	US7135783 Contact etching utilizing partially recessed hard mask
11/14/2006	US7135782 Semiconductor module and production method therefor and module for IC cards and the like
11/14/2006	US7135781 Low profile, chip-scale package and method of fabrication
11/14/2006	US7135780 Semiconductor substrate for build-up packages
11/14/2006	US7135779 Method for packaging integrated circuit chips
11/14/2006	US7135777 Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof
11/14/2006	US7135776 Semiconductor device and method for manufacturing same
11/14/2006	US7135775 Enhancement of an interconnect
11/14/2006	US7135774 Heat resistant ohmic electrode and method of manufacturing the same
11/14/2006	US7135773 Integrated circuit chip utilizing carbon nanotube composite interconnection vias
11/14/2006	US7135772 Nitride semiconductor laser
11/14/2006	US7135771 Self alignment features for an electronic assembly
11/14/2006	US7135770 Semiconductor element with conductive columnar projection and a semiconductor device with conductive columnar projection
11/14/2006	US7135769 Semiconductor packages and methods of manufacturing thereof
11/14/2006	US7135768 Hermetic seal
11/14/2006	US7135767 Integrated circuit substrate material and method
11/14/2006	US7135766 Integrated power devices and signal isolation structure
11/14/2006	US7135765 Semiconductor device package and method of making the same
11/14/2006	US7135764 Shielded semiconductor chip carrier having a high-density external interface
11/14/2006	US7135763 Technique for attaching die to leads
11/14/2006	US7135762 Semiconductor device, stacked semiconductor device, methods of manufacturing them, circuit board, and electronic instrument
11/14/2006	US7135761 Robust power semiconductor package
11/14/2006	US7135760 Moisture resistant integrated circuit leadframe package
11/14/2006	US7135759 Individualized low parasitic power distribution lines deposited over active integrated circuits
11/14/2006	US7135758 Surface mount solder method and apparatus for decoupling capacitance and process of making
11/14/2006	US7135754 Chip type solid electrolytic capacitor having a small size and a simple structure
11/14/2006	US7135751 High breakdown voltage junction terminating structure
11/14/2006	US7135743 Electrostatic discharge protection device with complementary dual drain implant
11/14/2006	US7135729 Semiconductor memory device including multi-layer gate structure
11/14/2006	US7135723 Integrated circuit with a test circuit
11/14/2006	US7135722 Wiring layout of semiconductor device and design method of the same
11/14/2006	US7135704 VCSEL settling fixture
11/14/2006	US7135643 EMI shield including a lossy medium
11/14/2006	US7135642 Integrated circuit carrier with conductive rings and semiconductor device integrated with the carrier
11/14/2006	US7135489 Cyclooxygenase inhibitors; antiinflammatory agents
11/14/2006	US7135438 Calcining oxides of barium, copper, scandium and yttrium and lanthanum hydroxide, pulverization, shaping, sintering, cooling; single phase perovskite crystal structure
11/14/2006	US7135399 Deposition method for wiring thin film
11/14/2006	US7135398 Reliable low-k interconnect structure with hybrid dielectric
11/14/2006	US7135397 Method and system for packaging ball grid arrays
11/14/2006	US7135396 Method of making a semiconductor structure
11/14/2006	US7135395 Bonding pad structure to minimize IMD cracking
11/14/2006	US7135386 Process for fabricating a semiconductor device
11/14/2006	US7135378 Process for fabricating a semiconductor device having a plurality of encrusted semiconductor chips
11/14/2006	US7135366 Method for fabricating a lateral metal-insulator-metal capacitor
11/14/2006	US7135358 Process for producing resin-sealed type electronic device
11/14/2006	US7135357 Process for making an organic electronic device having a roughened surface heat sink
11/14/2006	US7135356 Semiconductor device and method of producing a high contrast identification mark
11/14/2006	US7135355 Stencil mask design method and under bump metallurgy for C4 solder bump
11/14/2006	US7135354 Semiconductor device and method of manufacturing the same, semiconductor wafer, circuit board and electronic instrument
11/14/2006	US7135272 Method for forming a photoresist pattern and method for forming a capacitor using the same
11/14/2006	US7135246 Electronic apparatus having energy-saving cooling system
11/14/2006	US7135204 Method of manufacturing a wiring board
11/14/2006	US7135081 Adhesive tape applying method and apparatus
11/14/2006	US7134486 Control of electrolysis gases in electroosmotic pump systems
11/14/2006	US7134484 Increased efficiency in liquid and gaseous planar device cooling technology
11/14/2006	US7134311 Device and method for fabricating lead frame by press forming
11/14/2006	US7134199 Fluxless bumping process
11/14/2006	US7134198 Method for manufacturing electric element built-in module with sealed electric element
11/14/2006	US7134197 Plastic lead frames utilizing reel-to-reel processing
11/14/2006	US7134196 Electronic device and manufacturing same
11/14/2006	US7134195 Method of production of multilayer circuit board with built-in semiconductor chip
11/14/2006	CA2246761C Lighting device for a cabinet
11/09/2006	WO2006119493A2 Semiconductor device with reduced metal layer stress
11/09/2006	WO2006119485A2 Wirebonded device packages for semiconductor devices having elongated electrodes
11/09/2006	WO2006119254A1 Wire bonded semiconductor device having low inductance and noise
11/09/2006	WO2006119189A2 Molded lead frame connector with one or more passive components
11/09/2006	WO2006118982A2 Semiconductor substrate with exposed upper and lower sides
11/09/2006	WO2006118720A2 Semiconductor assembly including chip scale package and second substrate and having exposed substrate surfaces on upper and lower sides
11/09/2006	WO2006118335A1 Curable silicone composition and electronic components
11/09/2006	WO2006118033A1 Sheet-like underfill material and semiconductor device manufacturing method
11/09/2006	WO2006118032A1 Heat sink for power module

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