H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2006
11/16/2006	US20060255459 Stacked semiconductor memory device
11/16/2006	US20060255458 Semiconductor module provided with contacts extending through the package
11/16/2006	US20060255457 Integrated circuit package with glass layer and oscillator
11/16/2006	US20060255456 Multilayer substrate and the manufacturing method thereof
11/16/2006	US20060255455 Reliability and improved frequency response package for extremely high power density transistors
11/16/2006	US20060255454 Wafer bonding method
11/16/2006	US20060255453 Tightly engaged heat dissipating apparatus and method for manufacturing the same
11/16/2006	US20060255452 Cooling devices that use nanowires
11/16/2006	US20060255451 Heat Conduction Interface Method and Manufacturing Method Thereof
11/16/2006	US20060255450 Devices incorporating carbon nanotube thermal pads
11/16/2006	US20060255449 Lid used in package structure and the package structure having the same
11/16/2006	US20060255448 Terminal connection structure for semiconductor device
11/16/2006	US20060255447 Plasma etching method
11/16/2006	US20060255446 Stacked modules and method
11/16/2006	US20060255445 Memory modules including SIMM and DIMM-type connection structures and related memory systems
11/16/2006	US20060255444 System and method for vertically stacking computer memory components
11/16/2006	US20060255443 Multi stack packaging chip and method of manufacturing the same
11/16/2006	US20060255442 Apparatus and methods for constructing balanced chip packages to reduce thermally induced mechanical strain
11/16/2006	US20060255441 Physical quantity sensor device
11/16/2006	US20060255440 Composite multi-layer substrate and module using the substrate
11/16/2006	US20060255439 Semiconductor device and method for fabricating the same
11/16/2006	US20060255438 Lead frame and resin-encapsulated semiconductor device
11/16/2006	US20060255437 Lead-free semiconductor device
11/16/2006	US20060255436 Semiconductor device with sealed semiconductor chip
11/16/2006	US20060255435 Method for encapsulating a semiconductor device and semiconductor device
11/16/2006	US20060255434 Shielding noisy conductors in integrated passive devices
11/16/2006	US20060255433 Intelligent textile technology based on flexible semiconductor skins
11/16/2006	US20060255432 Forming semiconductor structures
11/16/2006	US20060255431 Semiconductor wafer
11/16/2006	US20060255411 Semiconductor device having MOS transistor and protection diode and method for designing the same
11/16/2006	US20060255398 Ultra-violet protected tamper resistant embedded EEPROM
11/16/2006	US20060255355 Radiation emitting semiconductor component with luminescent conversion element
11/16/2006	US20060254808 Substrate precursor structures
11/16/2006	US20060254790 Cooling unit having heat radiating portion, through which liquid coolant flows and electronic apparatus equipped with cooling unit
11/16/2006	US20060254762 3-Dimensional high performance heat sinks
11/16/2006	DE4320060B4 Verfahren zur Herstellung eines Halbleiterspeicherzellenkondensators A method for fabricating a semiconductor memory cell capacitor
11/16/2006	DE4238646B4 Halbleiter-Bauelement mit spezieller Anschlusskonfiguration Semiconductor device with a special port configuration
11/16/2006	DE202005013344U1 Electrical module unit for sensor, e.g. inertia sensor, has two spraying bodies formed, so that each body surrounds number of conduction cables, and pressing grids freely running between spraying bodies and embedded in spraying bodies
11/16/2006	DE19947044B4 Oberflächenmontierbares optoelektronisches Bauelement mit Reflektor und Verfahren zur Herstellung desselben Surface-mountable optoelectronic component with a reflector and method of manufacturing the same
11/16/2006	DE10352349B4 Halbleiterchip mit Flip-Chip-Kontakten und Verfahren zur Herstellung desselben Of the same semiconductor chip having flip chip contacts, and processes for preparing
11/16/2006	DE10239048B4 Integrierter Schaltkreis Integrated circuit
11/16/2006	DE102006015978A1 Mikrozwischenraumverfahren und -ESD-Schutzvorrichtung Micro-gap method and ESD protection device
11/16/2006	DE102005040686A1 Connector for semiconductor chip and circuit board, has mesa contact and contact covering formed on contact area of semiconductor chip, in which mesa contact is formed in semiconductor chip position corresponding to contact area
11/16/2006	DE102005036105B3 Electrical component e.g. insulated gate bipolar transistor module, has knob projecting from base surface of bus bar, and fastening unit provided for fixed connection contacting of external bus bar unit to contact surface of knob
11/16/2006	DE102005006280B4 Halbleiterbauteil mit einem Durchkontakt durch eine Gehäusemasse und Verfahren zur Herstellung desselben Of the same semiconductor device having a via through a housing composition and methods for preparing
11/16/2006	DE102004034397B4 Bildsensormodul mit einem Waferebenenpaket Image sensor module with a wafer-level package
11/16/2006	DE102004012232B4 Verfahren zum Herstellen von Plattenstapeln, insbesondere zum Herstellen von aus wenigstens einem Plattenstapel bestehenden Kühlern A method for producing stacks of plates, especially for producing a plate stack consisting of at least coolers
11/16/2006	DE10157362B4 Leistungsmodul und Verfahren zu seiner Herstellung Power module and method for its preparation
11/15/2006	EP1722615A2 A printed circuit board having protection means and a method of use thereof
11/15/2006	EP1722416A2 Integrated circuit with trimming elements and method
11/15/2006	EP1722415A2 Semiconductor device and manufacturing method thereof
11/15/2006	EP1722414A2 Improved reliability and improved frequency response package for extremely high power density transistors
11/15/2006	EP1722413A2 Terminal connection structure for semiconductor device
11/15/2006	EP1722412A2 Jet generator and electronic device
11/15/2006	EP1722411A2 Ceramic circuit board
11/15/2006	EP1721866A1 MEMS device having a trilayered beam and related methods
11/15/2006	EP1721497A2 Improved flip chip mmic on board performance using periodic electromagnetic bandgap structures
11/15/2006	EP1721338A2 Reprogrammable metal-to-metal antifuse employing carbon-containing antifuse material
11/15/2006	EP1721335A2 Wafer scale die handling
11/15/2006	EP1721334A2 Compliant passivated edge seal for low-k interconnect structures
11/15/2006	EP1721325A1 Housing for high performance components
11/15/2006	EP1720794A2 Packaged acoustic and electromagnetic transducer chips
11/15/2006	EP1665363A4 Wafer-level moat structures
11/15/2006	EP1576649A4 Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers and a method of making the same
11/15/2006	EP1569757A4 Apparatus for microdeposition of multiple fluid materials
11/15/2006	EP1472732B1 Device for connecting an ic terminal to a reference potential
11/15/2006	EP1437036A4 Latching micro magnetic relay packages and methods of packaging
11/15/2006	EP1417712B1 Integrated arrays of modulators and lasers on electronics
11/15/2006	EP1374651B1 Encapsulation arrangement
11/15/2006	EP1250709B1 Electronic package with integrated capacitor
11/15/2006	EP1114444B1 Semiconductor processing method and gate stack
11/15/2006	EP0826152B1 Method and apparatus for testing semiconductor dice
11/15/2006	CN2838045Y Lead connection frame for black ceramic low temperature glass shell for integrated circuit
11/15/2006	CN2838044Y Chip assembly structure
11/15/2006	CN2838043Y Conductive contact structure between PCB plate and baseplate
11/15/2006	CN2838042Y Fastener capable of being disassembled without tool
11/15/2006	CN2838041Y Oxidation prevention device for low-melting metal alloy heat conducting medium
11/15/2006	CN2838040Y Heat radiation structure
11/15/2006	CN2838039Y Radial side-blasting radiator structure
11/15/2006	CN2838038Y Semiconductor encapsulant
11/15/2006	CN2837916Y Water-cooled heat radiation mechanism
11/15/2006	CN1864264A Structure of package for semiconductor image pickup device and fabrication method thereof
11/15/2006	CN1864262A Electronically programmable antifuse and circuits made therewith
11/15/2006	CN1864261A Wiring protection element for laser deleted tungsten fuse
11/15/2006	CN1864259A Electronic device and carrier substrate for same
11/15/2006	CN1864258A Electrical circuit apparatus and methods for assembling same
11/15/2006	CN1864254A Electronic device and its manufacturing method
11/15/2006	CN1864043A Flat plate heat transfer device
11/15/2006	CN1863875A Curable organopolysiloxane composition and semiconductor device
11/15/2006	CN1862845A Light emitting element mounting frame and light emitting device
11/15/2006	CN1862821A Semiconductor device and method for manufacturing the same
11/15/2006	CN1862816A Memory element and mfg. method thereof
11/15/2006	CN1862811A 叠置半导体存储器件 Stacked semiconductor memory device
11/15/2006	CN1862810A 半导体器件 Semiconductor devices
11/15/2006	CN1862809A Packaging structure of power chip
11/15/2006	CN1862808A Chip architecture with multiple functions
11/15/2006	CN1862807A Electrostatic discharge protection circuit of power chip
11/15/2006	CN1862806A Electrostatic discharge protection circuit and semiconductor circuit with same
11/15/2006	CN1862805A Ground shield and related method
11/15/2006	CN1862804A Semiconductor device and manufacturing method of the same

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