H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2006
11/21/2006	US7138715 Interconnect, interconnect forming method, thin film transistor, and display device
11/21/2006	US7138714 Via barrier layers continuous with metal line barrier layers at notched or dielectric mesa portions in metal lines
11/21/2006	US7138713 Chip-type solid electrolytic capacitor and method of producing the same
11/21/2006	US7138712 Receptacle for a programmable, electronic processing device
11/21/2006	US7138711 Intrinsic thermal enhancement for FBGA package
11/21/2006	US7138710 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
11/21/2006	US7138709 Microelectronic package array
11/21/2006	US7138708 Electronic system for fixing power and signal semiconductor chips
11/21/2006	US7138707 Semiconductor package including leads and conductive posts for providing increased functionality
11/21/2006	US7138706 Semiconductor device and method for manufacturing the same
11/21/2006	US7138704 Concealable chip leadframe unit structure
11/21/2006	US7138703 Preventive film for polarizer and polarizing plate using the same
11/21/2006	US7138702 Integrated circuit chip
11/21/2006	US7138701 Electrostatic discharge protection networks for triple well semiconductor devices
11/21/2006	US7138700 Semiconductor device with guard ring for preventing water from entering circuit region from outside
11/21/2006	US7138698 Semiconductor device including power MOS field-effect transistor and driver circuit driving thereof
11/21/2006	US7138690 Shielding structure for use in a metal-oxide-semiconductor device
11/21/2006	US7138673 Semiconductor package having encapsulated chip attached to a mounting plate
11/21/2006	US7138672 Apparatus and method for making a tensile diaphragm with an insert
11/21/2006	US7138661 Optoelectronic component and optoelectronic arrangement with an optoelectronic component
11/21/2006	US7138654 Chemical-mechanical polishing proximity correction method and correction pattern thereof
11/21/2006	US7138583 Method and apparatus for maintaining a separation between contacts
11/21/2006	US7138354 For use in forming energy devices
11/21/2006	US7138334 Systems for forming insulative coatings for via holes in semiconductor devices
11/21/2006	US7138332 Method of forming silicon carbide films
11/21/2006	US7138328 Packaged IC using insulated wire
11/21/2006	US7138327 Method of routing an electrical connection on a semiconductor device and structure therefor
11/21/2006	US7138326 Wafer integrated rigid support ring
11/21/2006	US7138299 Method of electrically connecting a microelectronic component
11/21/2006	US7138298 Semiconductor chip with external connecting terminal
11/21/2006	US7138297 Method of dividing a semiconductor wafer utilizing a laser dicing technique
11/21/2006	US7138296 Board for manufacturing a BGA and method of manufacturing semiconductor device using thereof
11/21/2006	US7138294 Circuit substrate device, method for producing the same, semiconductor device and method for producing the same
11/21/2006	US7138159 Composite batch powder; battery
11/21/2006	US7138064 Semiconductor device and method of manufacturing the same
11/21/2006	US7137831 Substrate having spiral contactors
11/21/2006	US7137830 Miniaturized contact spring
11/21/2006	US7137827 Interposer with electrical contact button and method
11/21/2006	US7137557 Semiconductor device and an information management system therefore
11/21/2006	US7137443 Brazed wick for a heat transfer device and method of making same
11/21/2006	US7137193 Programmed material consolidation methods for fabricating printed circuit board
11/16/2006	WO2006122125A2 Magnetic assist manufacturing to reduce mold flash and assist with heat slug assembly
11/16/2006	WO2006121828A2 One time programmable memory cell
11/16/2006	WO2006121593A1 Method and apparatus for electronically aligning capacitively coupled mini-bars
11/16/2006	WO2006121565A1 Transient pulse, substrate-triggered bicmos rail clamp for esd abatement
11/16/2006	WO2006121129A1 Semiconductor device and method for manufacturing same
11/16/2006	WO2006120849A1 Semiconductor package having socket function, semiconductor module, electronic circuit module, and circuit board with socket
11/16/2006	WO2006120826A1 Ceramic multilayer board
11/16/2006	WO2006074470B1 Interconnect structures with bond-pads and methods of forming bump sites on bond-pads
11/16/2006	WO2006072019A3 Electronic device and process for forming same
11/16/2006	WO2006063060A3 Device having enhanced stress state and related methods
11/16/2006	WO2006050722B1 Method for welding two welding parts by means of a fillet weld and welding part with an inclined tapered edge area therefor
11/16/2006	WO2006050449A3 Low cost power mosfet with current monitoring
11/16/2006	WO2006014418A3 Encapsulated semiconductor device with reliable down bonds
11/16/2006	US20060258822 Curing accelerator, epoxy resin composition, and semiconductor device
11/16/2006	US20060258160 Method of manufacturing semiconductor device
11/16/2006	US20060258153 Barrier assembly for an exposure apparatus
11/16/2006	US20060258151 Multi-layered copper line structure of semiconductor device and method for forming the same
11/16/2006	US20060258150 Oxygen bridge structures and methods to form oxygen bridge structures
11/16/2006	US20060258149 Method of manufacturing a semiconductor device
11/16/2006	US20060258147 Method of forming closed air gap interconnects and structures formed thereby
11/16/2006	US20060258143 Method of reducing process steps in metal line protective structure formation
11/16/2006	US20060258140 Integrated circuit with additional mini-pads connected by an under-bump metallization and method for production thereof
11/16/2006	US20060258135 Semiconductor integrated circuit
11/16/2006	US20060258080 Vertical diode, matrix position sensitive apparatus and manufacturing method of the same
11/16/2006	US20060258059 Contact portion and manufacturing method thereof, thin film transistor array panel and manufacturing method thereof
11/16/2006	US20060258058 Surface-mounted device with leads
11/16/2006	US20060258056 Method for producing a chip panel by means of a heating and pressing process using a thermoplastic material
11/16/2006	US20060258050 Module component and method for manufacturing the same
11/16/2006	US20060258046 Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds
11/16/2006	US20060258045 Semiconductor device and method of fabricating the same
11/16/2006	US20060258044 Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor device
11/16/2006	US20060258026 Multi-wavelength semiconductor laser device and its manufacturing method
11/16/2006	US20060258025 Fabrication method of IC inlet, ID tag, ID tag reader and method of reading date thereof
11/16/2006	US20060257758 Methods of eliminating pattern collapse on photoresist patterns
11/16/2006	US20060257672 Of use when electric and electronic parts having a copper, silver or other metal portion on their surface are encapsulated or sealed therewith, to prevent or retard the parts from corrosion with sulfur-containing gases
11/16/2006	US20060257659 Small particle size, narrow particle size distribution, spherical morphology and good crystallinity; for making electroluminescent display devices
11/16/2006	US20060256222 CIS Package and Method Thereof
11/16/2006	US20060256018 Integrated circuit package including miniature antenna
11/16/2006	US20060255480 Materials and method to seal vias in silicon substrates
11/16/2006	US20060255479 Magnetic assist manufacturing to reduce mold flash and assist with heat slug assembly
11/16/2006	US20060255478 Electronic component comprising a semiconductor chip and a plastic housing, and method for producing the same
11/16/2006	US20060255477 Pad structure, pad layout structure, and pad layout method in semiconductor devices
11/16/2006	US20060255476 Electronic assembly with controlled solder joint thickness
11/16/2006	US20060255475 Wafer level pre-packaged flip chip system
11/16/2006	US20060255474 Packaging structure and method
11/16/2006	US20060255473 Flip chip interconnect solder mask
11/16/2006	US20060255472 Semiconductor device
11/16/2006	US20060255471 Flip chip package having protective cap and method of fabricating the same
11/16/2006	US20060255470 ZrAlxOy DIELECTRIC LAYERS
11/16/2006	US20060255469 Semiconductor device and method of fabricating the same
11/16/2006	US20060255468 Semiconductor device chip and semiconductor device chip package
11/16/2006	US20060255467 Single-sided, flat, no lead, integrated circuit package
11/16/2006	US20060255466 Carbon containing silicon oxide film having high ashing tolerance and adhesion
11/16/2006	US20060255465 Semiconductor device and method of manufacturing the same
11/16/2006	US20060255464 Fuel cell formed in a single layer of monocrystalline silicon and fabrication process
11/16/2006	US20060255463 Electrical interconnection, and image sensor having the electrical interconnection
11/16/2006	US20060255462 Structures and methods to enhance copper metallization
11/16/2006	US20060255461 Handling and positioning of metallic plated balls for socket application in ball grid array packages
11/16/2006	US20060255460 Multi-chip electronic package with reduced line skew, method of making same and information handling system utilizing same

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