H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2006
11/22/2006	EP1724833A2 SIP (system-in-package) type package containing analog semiconductor chip and digital semiconductor chip stacked in order, and method for manufacturing the same
11/22/2006	EP1724832A2 Multilayer module formed of modules stacked on top of each other and method of manufacturing the same
11/22/2006	EP1724831A2 Lead-free semiconductor device
11/22/2006	EP1724830A2 Method for production of semiconductor package
11/22/2006	EP1724299A1 Modifier for resin and resin composition using the same and formed article
11/22/2006	EP1723836A1 A radio frequency circuit board topology
11/22/2006	EP1723689A2 Electromagnetic bandgap structure for suppressing electromagnetic coupling in microstrip and flip chip on board applications
11/22/2006	EP1723673A2 Method of making a semiconductor device, and semiconductor device made thereby
11/22/2006	EP1723671A2 Treatment method and device of the working layer of a multilayer structure
11/22/2006	EP1723670A1 Cooling device
11/22/2006	EP1582093A4 Improved patching methods and apparatus for fabricating memory modules
11/22/2006	EP1320886A4 Dram fabricated on a silicon-on-insulator (soi) substrate having bi-level digit lines
11/22/2006	EP1198831B1 Method for selectively coating ceramic surfaces
11/22/2006	EP1139705B1 Printed wiring board and method of producing the same
11/22/2006	EP1137332B1 Printed wiring board and method of producing the same and capacitor to be contained in printed wiring board
11/22/2006	EP0992065B1 Film used as a substrate for integrated circuits
11/22/2006	EP0803174B1 Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
11/22/2006	CN2840618Y Assembling radiating module
11/22/2006	CN2840616Y Radiating device
11/22/2006	CN2840615Y Radiating device for electronic components
11/22/2006	CN2840614Y Radiating device for electronic components
11/22/2006	CN2840613Y Radiating device structure
11/22/2006	CN2840327Y 芯片封装体 Chip package
11/22/2006	CN2840326Y Mechanism for radiating module combination
11/22/2006	CN2840325Y Radiating fin structure
11/22/2006	CN2840324Y Radiator and radiating fin thereof
11/22/2006	CN2840163Y Radiator fix base structure in electronic device
11/22/2006	CN1868243A Electronic device and method of manufacturing thereof
11/22/2006	CN1868242A Conductive paste and multilayer ceramic substrate
11/22/2006	CN1868065A Integrated circuit package having an inductance loop formed from a multi-loop configuration
11/22/2006	CN1868062A Semiconductor module including circuit device and insulating film, method for manufacturing same, and application of same
11/22/2006	CN1868061A Bipolar transistor having raised extrinsic base with selectable self-alignment and methods of forming same
11/22/2006	CN1868060A Inductor coil for an IC chip
11/22/2006	CN1868059A System and method for preventing and alleviating short circuiting in a semiconductor device
11/22/2006	CN1868058A System and method for reducing or eliminating semiconductor device wire sweep
11/22/2006	CN1868057A Method for providing double-sided cooling of leadframe-based wire-bonded electronic packages and device produced thereby
11/22/2006	CN1868056A Device, system and electric element
11/22/2006	CN1868055A 电子设备及其制造方法 Electronic device and method of manufacturing
11/22/2006	CN1868052A Electronic device and method of manufacturing thereof
11/22/2006	CN1867921A Esd test array and corresponding method
11/22/2006	CN1867419A Laser-based system for memory link processing with picosecond lasers
11/22/2006	CN1866629A Semiconductor device and method for manufacturing the same
11/22/2006	CN1866561A Light emitting device package and method for manufacturing the same
11/22/2006	CN1866560A Nitride semiconductor device
11/22/2006	CN1866534A 有机电致发光设备 Organic electroluminescent devices
11/22/2006	CN1866520A A semiconductor device and methods of manufacturing thereof, a semiconductor device structure
11/22/2006	CN1866519A Bank structure, wiring pattern forming method, device, electro-optical device, and electronic apparatus
11/22/2006	CN1866518A Circuitry component
11/22/2006	CN1866517A Circuitry component
11/22/2006	CN1866514A Pluggable module and cage
11/22/2006	CN1866513A Packaging structure with mixed circuitry and composite substrate
11/22/2006	CN1866512A Memory module assembly and manufacturing method thereof
11/22/2006	CN1866511A Static discharge device capable of controlling triggering voltage
11/22/2006	CN1866510A Overlay vernier and method for manufacturing semiconductor device using the same
11/22/2006	CN1866509A Semiconductor device
11/22/2006	CN1866508A Semiconductor device having trench structures and manufacturing method thereof
11/22/2006	CN1866507A Multi-layered complementary wire structure and manufacturing method thereof
11/22/2006	CN1866506A 半导体器件 Semiconductor devices
11/22/2006	CN1866505A Semiconductor device and method of manufacturing the same
11/22/2006	CN1866504A Semiconductor device and making method thereof
11/22/2006	CN1866503A Heat pipe and substrate combination method
11/22/2006	CN1866502A Heat radiator, auxiliary jig and heat radiator manufacturing method
11/22/2006	CN1866501A Heat radiator assembling forming method
11/22/2006	CN1866500A Integrated circuit packaging and manufacturing method
11/22/2006	CN1866499A Contact scheme for memory array and manufacturing methods thereof
11/22/2006	CN1866492A system and method for identification of a reference integrated circuit for a pick-and-place equipment
11/22/2006	CN1866488A Welding pad layout method and structure
11/22/2006	CN1866483A Wiring substrate and manufacturing method thereof
11/22/2006	CN1866468A Circuitry component fabricating method
11/22/2006	CN1866467A Circuitry component fabricating method
11/22/2006	CN1866277A 存储卡 Memory Card
11/22/2006	CN1865329A Flame-proof agent and flame-proof resin composition comprising same, and its uses
11/22/2006	CN1864909A Solder alloy and a semiconductor device using the solder alloy
11/22/2006	CN1286223C Method for welding unit on connection supporting seat without addition material
11/22/2006	CN1286176C Semiconductor device
11/22/2006	CN1286174C Electrostatic charging protective circuit
11/22/2006	CN1286173C Circuit structure for connecting weld-pad and electrostatic protective circuit
11/22/2006	CN1286172C Electrostatic discharge protective circuit structure and manufacturing method thereof
11/22/2006	CN1286171C Apparatus and method for forming a battery in an integrated circuit
11/22/2006	CN1286158C Method of manufacturing semiconductor device and electronic device
11/22/2006	CN1286131C Integrated transformer
11/22/2006	CN1285764C Electroless-plating solution
11/22/2006	CN1285636C Process for producing alkylene oxide derivative
11/22/2006	CN1285420C Microdeposition apparatus
11/21/2006	US7139993 Method and apparatus for routing differential signals across a semiconductor chip
11/21/2006	US7139176 Circuit substrate and method for fabricating the same
11/21/2006	US7139171 Heat dissipation device
11/21/2006	US7139160 Electronic component
11/21/2006	US7138987 Protection circuit for input and output of liquid crystal display
11/21/2006	US7138872 Power amplifier device
11/21/2006	US7138817 Method and apparatus for testing defective portion of semiconductor device
11/21/2006	US7138751 Crystal unit
11/21/2006	US7138725 Semiconductor device
11/21/2006	US7138724 Thick solder mask for confining encapsulant material over selected locations of a substrate and assemblies including the solder mask
11/21/2006	US7138723 Deformable semiconductor device
11/21/2006	US7138722 Semiconductor device
11/21/2006	US7138721 Memory module
11/21/2006	US7138719 Trench interconnect structure and formation method
11/21/2006	US7138718 Multilevel interconnect structure with low-k dielectric
11/21/2006	US7138716 Addition of metal layers with signal reallocation to a microprocessor for increased frequency and lower power

1 ... 1147 1148 1149 1150 1151 1152 1153 1154 1155 1156 1157 1158 1159 1160 1161 1162 1163 1164 1165 1166 1167 ... 2262