H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2006
11/29/2006	CN1287450C Preparation method for capsulation of output and input end points as well as its structure
11/29/2006	CN1287449C Silicon-aluminium alloy sealing material and preparing method thereof
11/29/2006	CN1287435C Semiconductor device and manufacturing method thereof
11/29/2006	CN1287434C Method for producing semiconductor device
11/29/2006	CN1287429C Method for manufacturing semiconductor device
11/29/2006	CN1287130C Sensor with vibration attenuation component
11/29/2006	CN1286918C Resin compound, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof
11/29/2006	CN1286906C 环氧树脂组合物和半导体装置 Epoxy resin composition and a semiconductor device
11/29/2006	CN1286898C Elastomer formed product
11/29/2006	CN1286801C Dielectric substance with block effect preventing copper diffusion
11/28/2006	USRE39413 Low friction polish-stop stratum for endpointing chemical-mechanical planarization processing of semiconductor wafers
11/28/2006	US7142435 Lid for use in packaging an electronic device and method of manufacturing the lid
11/28/2006	US7142430 Heat dissipating device assembly
11/28/2006	US7142429 Heat sink and retaining clip assembly
11/28/2006	US7142428 Locking heatsink apparatus
11/28/2006	US7142425 Liquid cooling system including a liquid absorption and a leak detection device
11/28/2006	US7142422 Heat dissipation device
11/28/2006	US7142274 Liquid crystal display device and method of fabricating the same
11/28/2006	US7142000 Mounting spring elements on semiconductor devices, and wafer-level testing methodology
11/28/2006	US7141997 Method for testing using a universal wafer carrier for wafer level die burn-in
11/28/2006	US7141886 Air pocket resistant semiconductor package
11/28/2006	US7141885 Wafer level package with air pads and manufacturing method thereof
11/28/2006	US7141884 Module with a built-in semiconductor and method for producing the same
11/28/2006	US7141883 Integrated circuit package configuration incorporating shielded circuit element structure
11/28/2006	US7141882 Semiconductor wafer device having separated conductive patterns in peripheral area and its manufacture method
11/28/2006	US7141881 Semiconductor device having a multilayer interconnection structure, fabrication method thereof, and designing method thereof
11/28/2006	US7141880 Metal line stacking structure in semiconductor device and formation method thereof
11/28/2006	US7141879 Semiconductor device
11/28/2006	US7141878 Semiconductor device and manufacturing method thereof
11/28/2006	US7141877 Display device and manufacturing method of the same
11/28/2006	US7141876 Semiconductor device
11/28/2006	US7141875 Flexible multi-chip module and method of making the same
11/28/2006	US7141874 Electronic component packaging structure and method for producing the same
11/28/2006	US7141873 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
11/28/2006	US7141872 Semiconductor device and method of manufacturing semiconductor device
11/28/2006	US7141871 Method for manufacturing encapsulated opto-electronic devices and encapsulated device thus obtained
11/28/2006	US7141870 Apparatus for micro-electro mechanical system package
11/28/2006	US7141869 Electronic package for image sensor, and the packaging method thereof
11/28/2006	US7141868 Flash preventing substrate and method for fabricating the same
11/28/2006	US7141867 Quad flat non-leaded package
11/28/2006	US7141854 Double-gated silicon-on-insulator (SOI) transistors with corner rounding
11/28/2006	US7141853 Method and structure for buried circuits and devices
11/28/2006	US7141832 Semiconductor device and capacitance regulation circuit
11/28/2006	US7141821 Semiconductor device having an impurity gradient in the impurity regions and method of manufacture
11/28/2006	US7141819 Semiconductor package
11/28/2006	US7141741 Circuit board
11/28/2006	US7141739 Sealing device and apparatus
11/28/2006	US7141576 4-quinazolineamine derivatives; antineoplastic agents; inhibitors of erb family tyrosine kinases and/or epidermal growth factor receptors
11/28/2006	US7141509 Method for fabricating a circuit device
11/28/2006	US7141496 Method of treating microelectronic substrates
11/28/2006	US7141493 Semiconductor device, method of manufacturing three-dimensional stacking type semiconductor device, circuit board, and electronic instrument
11/28/2006	US7141454 Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold
11/28/2006	US7141453 Method of mounting wafer on printed wiring substrate
11/28/2006	US7141310 Metal matrix composite structure and method
11/28/2006	US7141309 High thermal conductive material having high thermal conductivity and process for producing the same
11/28/2006	US7141278 Thin film forming method
11/28/2006	US7141274 Batch processing method for processing a number of substrates simultaneously; substrate holders which have heating medium flow passages regulate the temperature of the holding portions as a whole; for embedding interconnects in the surface of a substrate like a semiconductor
11/28/2006	US7141273 Curable organopolysiloxane composition and semiconductor device
11/28/2006	US7141180 Etchant for wire, method of manufacturing wire using etchant, thin film transistor array panel including wire and manufacturing method thereof
11/28/2006	US7141129 outer dielectric layer may include at least one of CaO, MgO, ZrO2, BaO, and SiO2, and the inner dielectric layer may include BaTiO3
11/28/2006	US7140883 Contact carriers (tiles) for populating larger substrates with spring contacts
11/28/2006	US7140423 Finned heat dissipation module having flow guide
11/28/2006	US7140422 Heat sink with heat pipe in direct contact with component
11/28/2006	US7140421 Wick structure of heat pipe
11/28/2006	US7140374 System, method and apparatus for self-cleaning dry etch
11/28/2006	US7140048 Breathable article of clothing that resists insect bites
11/23/2006	WO2006125062A2 System for supplying carbon dioxide
11/23/2006	WO2006124607A2 Materials and method to seal vias in silicon substrates
11/23/2006	WO2006124295A2 Backside method and system for fabricating semiconductor components with conductive interconnects
11/23/2006	WO2006124085A2 Memory module system and method
11/23/2006	WO2006122844A1 Micromechanical component and corresponding production method
11/23/2006	WO2006122608A1 Apparatus for attenuating reflections of electromagnetic waves, method for its manufacture and its use
11/23/2006	WO2006122505A1 Integrated circuit packaging and method of making the same
11/23/2006	WO2006122467A1 A packaging substrate with flat bumps for ic or discrete device and method of manufacturing the same
11/23/2006	WO2006122426A1 Light-emitting module
11/23/2006	WO2006076208A3 Systems and methods for removing operating heat from a light emitting diode
11/23/2006	WO2006039089A3 Heat spreader for display device
11/23/2006	WO2005109500A3 System and method for sensitivity optimization of rf receiver using adaptive nulling
11/23/2006	WO2005101494A3 Three dimensional six surface conformal die coating
11/23/2006	WO2005067598A3 Compliant passivated edge seal for low-k interconnect structures
11/23/2006	WO2005008725A3 Nested voltage island architecture
11/23/2006	US20060265142 Connector including an integrated circuit powered by a connection to a conductor terminating in the connector
11/23/2006	US20060264595 Coating a silicon wafer with the liquid coating of polysiloxane copolymer coating film; heat curing the coating film
11/23/2006	US20060264066 Multilayer multicomponent high-k films and methods for depositing the same
11/23/2006	US20060264065 Sacrificial styrene benzocyclobutene copolymers for making air gap semiconductor devices
11/23/2006	US20060264059 Semiconductor device, method for manufacturing semiconductor device and gas for plasma cvd
11/23/2006	US20060264048 Interconnect Structure Diffusion Barrier With High Nitrogen Content
11/23/2006	US20060264046 Method of manufacturing semiconductor device and semiconductor device
11/23/2006	US20060264041 Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
11/23/2006	US20060264040 Semiconductor device
11/23/2006	US20060264036 Line level air gaps
11/23/2006	US20060264034 Semiconductor device
11/23/2006	US20060264033 Dual damascene patterning method
11/23/2006	US20060264030 Wire structure and forming method of the same
11/23/2006	US20060264029 Low inductance via structures
11/23/2006	US20060264025 Stacked semiconductor device and method of manufacturing the same
11/23/2006	US20060264023 Die-wafer package and method of fabricating same
11/23/2006	US20060264022 Semiconductor device
11/23/2006	US20060264021 Offset solder bump method and apparatus
11/23/2006	US20060264017 Method of manufacturing semiconductor device

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