H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2006
11/30/2006	US20060267069 Nonvolatile semiconductor memory
11/30/2006	US20060267010 Semiconductor device, semiconductor device manufacturing method, and semiconductor device test method
11/30/2006	US20060267009 Method for local wafer thinning and reinforcement
11/30/2006	US20060267008 Semiconductor bond pad structures and methods of manufacturing thereof
11/30/2006	US20060266499 Cooling device of hybrid-type
11/30/2006	DE19819217B4 Leiterplatte für eine elektronische Komponente Circuit board for an electronic component
11/30/2006	DE10335155B4 Verfahren zum Herstellen einer Anordnung eines elektrischen Bauelements auf einem Substrat A method of manufacturing an arrangement of an electrical component on a substrate
11/30/2006	DE10316047B4 Richtkoppler in koplanarer Wellenleitertechnik Directional coupler in coplanar waveguide technology
11/30/2006	DE10314172B4 Verfahren zum Betreiben einer Anordnung aus einem elektrischen Bauelement auf einem Substrat und Verfahren zum Herstellen der Anordnung A method of operating an arrangement comprising an electrical component on a substrate and method of manufacturing the arrangement
11/30/2006	DE102006012967A1 Aktiver Begrenzer mit integriertem Sensor Active limiter with integrated sensor
11/30/2006	DE102005024430A1 Siliziumwafer mit einer lötbaren Beschichtung auf seiner Waferrückseite und Verfahren zum Herstellen desselben Of the same silicon wafer with a solderable coating on the wafer backside and methods for preparing
11/30/2006	DE102005023949A1 Nutzen und Halbleiterbauteil aus einer Verbundplatte mit Halbleiterchips und Kunststoffgehäusemasse sowie Verfahren zur Herstellung derselben Benefits and semiconductor component of a composite plate with semiconductor chips and plastic housing composition and method of making same
11/30/2006	DE102005023460A1 MOSFET e.g. lightly doped drain-MOSFET, operating method for e.g. memory circuit, involves applying breakdown voltage between gate electrode and channel area for penetrating gate dielectric material
11/30/2006	DE10156769B4 Leistungshalbleitereinrichtung mit einem äußeren Verbindungsanschluß zum Führen eines großen Stromes Power semiconductor device having an external connection terminal for carrying a large current
11/30/2006	DE10060828B4 Halbleiterbauelement in Drain-up-Konfiguration A semiconductor device in drain-up configuration
11/30/2006	DE10044841B4 Plasmaverkapselung für elektronische und mikroelektronische Bauelemente wie OLEDs sowie Verfahren zu dessen Herstellung Plasmaverkapselung for electronic and microelectronic devices such as OLEDs and to processes for the preparation thereof
11/29/2006	EP1727220A2 Conductive structure based on poly-3,4-alkenedioxythiophene (PEDOT) and polystyrenesulfonic acid (PSS)
11/29/2006	EP1727201A1 Shielding material for preventing outleakage and penetration of electromagnetic waves
11/29/2006	EP1727200A2 Integrated circuits and interconnect structure for integrated circuits
11/29/2006	EP1727199A2 Integrated circuits and interconnect structure for integrated circuits
11/29/2006	EP1727198A2 Semiconductor module and semiconductor module heat radiation plate
11/29/2006	EP1727192A1 Electronic substrate manufacturing method comprising embedding component in substrate by application of heat and pressure and wiring formation by ink jet printing
11/29/2006	EP1726419A1 Process for producing ceramic sheet, ceramic substrate utilizing the same and use thereof
11/29/2006	EP1726197A2 An element for carrying electronic components
11/29/2006	EP1726165A1 Video processor alignment clamping spring
11/29/2006	EP1726042A2 Reconfigurable processor module with stacked die elements
11/29/2006	EP1726040A1 Integrated circuit chips utilizing carbon nanotube composite interconnection vias
11/29/2006	EP1725775A1 Arrangement with an electronically commutated external rotor motor
11/29/2006	EP1725495A1 Flip chip bonded micro-electro-mechanical system (mems) device
11/29/2006	EP1725344A2 System, method and apparatus for self-cleaning dry etch
11/29/2006	EP1644874B1 Flexible semiconductor device and identification label
11/29/2006	EP1546656A4 Method and apparatus for monitoring integrated circuit fabrication
11/29/2006	EP1508003B1 Control arrangement for heating devices
11/29/2006	EP1461386B1 Electroconductive resin composition
11/29/2006	EP1374306B1 Bump metallurgy bars for power and ground routing
11/29/2006	EP1358664A4 High power radiation emitter device and heat dissipating package for electronic components
11/29/2006	EP1065730B1 Compression contacted semiconductor device
11/29/2006	CN2843013Y Device with radiating characteristic
11/29/2006	CN2843010Y Radiating device for electronic element
11/29/2006	CN2843009Y Radiating module
11/29/2006	CN2842834Y Modularized power adjusting device
11/29/2006	CN2842747Y Light-emitting diode lead carriage
11/29/2006	CN2842745Y Light-emitting diode packing structure
11/29/2006	CN2842738Y Sharing substrate image-sensor structure
11/29/2006	CN2842737Y Image sensor package of light thin and short type
11/29/2006	CN2842735Y Flatboard type water-cooling radiator of insulating-grid two-pole transistor
11/29/2006	CN2842734Y Radiating apparatus
11/29/2006	CN2842733Y Radiating apparatus
11/29/2006	CN2842732Y Semiconductor element and wafer level chip size package having it
11/29/2006	CN2842731Y Heat-pipe conductive radiator
11/29/2006	CN2842730Y Lower-blowing type radiation apparatus
11/29/2006	CN2842729Y Fan-shape radiating-fin structure of heat-pipe type ring-shape radiator
11/29/2006	CN2842728Y Semiconductor package
11/29/2006	CN1871718A Encapsulation assembly for electronic devices
11/29/2006	CN1871704A Semi-fusible link system for a multi-layer integrated circuit and method of making same
11/29/2006	CN1871703A Integrated circuit with additional mini-pads connected by an under-bump metallization and method for production thereof
11/29/2006	CN1871702A Paste for forming an interconnect and interconnect formed from the paste
11/29/2006	CN1871701A Semiconductor device package utilizing proud interconnect material
11/29/2006	CN1871696A Method for forming insulating film, system for forming insulating film, and method for manufacturing semiconductor device
11/29/2006	CN1871671A Embedded toroidal inductors
11/29/2006	CN1871305A Thin bond-line silicone adhesive composition and method for preparing the same.
11/29/2006	CN1871276A 环氧树脂组合物及半导体装置 Epoxy resin composition and a semiconductor device
11/29/2006	CN1870884A Mounting method of flexible circuit board
11/29/2006	CN1870880A Device and method for controlling hot substrate
11/29/2006	CN1870878A Heat sink
11/29/2006	CN1870876A 电子装置 Electronic devices
11/29/2006	CN1870860A Electronic substrate manufacturing method, semiconductor device, and manufacturing method of electronic machine
11/29/2006	CN1870436A Signal alignment circuit, drawing down circuit and pulling up circuit
11/29/2006	CN1870283A Image sensor assembly and image sensor
11/29/2006	CN1870268A Semiconductor integrated circuit device and electronic card using it
11/29/2006	CN1870266A Semiconductor integrated circuit device and electronic card using it
11/29/2006	CN1870265A Semiconductor integrated circuit device and electronic card using it
11/29/2006	CN1870263A Guard rings on semiconductor substrate
11/29/2006	CN1870262A Small radio communication module and manufacturing method
11/29/2006	CN1870261A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
11/29/2006	CN1870260A Bonding pad having metal pad in which slot is formed and mesh type via pattern
11/29/2006	CN1870259A 多层布线基片 A multilayer wiring substrate
11/29/2006	CN1870258A Carrier tape
11/29/2006	CN1870257A 半导体器件 Semiconductor devices
11/29/2006	CN1870256A Automatic tab package connecting host device element
11/29/2006	CN1870255A Liquid-cooling heat sink
11/29/2006	CN1870254A Cooling system of portable equipment
11/29/2006	CN1870253A Cooling method for reducing semiconductor device heating, manufacturing method and corresponding semiconductor device
11/29/2006	CN1870252A Semiconductor module and semiconductor module heat radiation plate
11/29/2006	CN1870251A Heat sink
11/29/2006	CN1870250A Method of forming film pattern, active matrix substrate, electro-optic device, and electronic apparatus
11/29/2006	CN1870246A Method of forming bit line of flash memory device
11/29/2006	CN1870239A Method and circuit structure employing a photo-imaged solder mask
11/29/2006	CN1870238A Method for cutting fuse structure
11/29/2006	CN1870237A IC packaging technology
11/29/2006	CN1870226A Transparent conductive film and method forming thereof, electrooptic device and electronic apparatus
11/29/2006	CN1870225A Pixel electrode, method for forming the same, electrooptical device, and electronic apparatus
11/29/2006	CN1868736A Interface materials and methods of production and use thereof
11/29/2006	CN1868661A Shaping method of radiator fin and its structure
11/29/2006	CN1287514C Semiconductor devices
11/29/2006	CN1287457C Information memory device
11/29/2006	CN1287455C Semiconductor integrated circuit device and electronic card using same
11/29/2006	CN1287453C Electro static discharging protective circuit
11/29/2006	CN1287452C Windowing ball grid array semiconductor packaging element with wire-holder as carrier and making method thereof
11/29/2006	CN1287451C Ball grid array semiconductor package

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